KR101902515B1 - The light emitting device package and the light emitting system - Google Patents

Abstract

The present invention relates to a light emitting device package comprising a body including a cavity, a first electrode and a second electrode separated from each other in the cavity, a second electrode disposed within the cavity, electrically connected to the first and second electrodes, And a moisture absorbing member formed in a boundary region between the body and the first and second electrodes, wherein at least one of the light emitting device, the resin member, and the light emitting device covers the light emitting device, . Therefore, by forming the moisture absorbing member in the boundary region between the body and the lead frame, it is possible to prevent the water penetrating from the outside from approaching the light emitting element. Further, by forming the moisture absorbing member using a reversible porous moisture absorbent, the moisture retained in accordance with the temperature can be discharged to the outside again, which can be used permanently.

Description

[0001] The present invention relates to a light emitting device package and a light emitting device,

The present invention relates to a light emitting device package.

Light emitting diodes (LEDs) can be made of a compound semiconductor material such as GaAs-based, AlGaAs-based, GaN-based, InGaN-based, and InGaAlP-based.

Such a light emitting diode is used as a light emitting device package that is packaged and emits various colors, and the light emitting device package is used as a light source in various fields such as a lighting indicator, a character indicator, and an image indicator.

Embodiments provide a light emitting device package and a light emitting module having a novel structure.

Embodiments provide a light emitting device package and a light emitting module capable of preventing moisture from penetrating from the outside.

An embodiment includes a body including a cavity, a first electrode and a second electrode separated from each other in the cavity, at least one light emitting element disposed in the cavity and electrically connected to the first and second electrodes, A resin material covering the device and filling the cavity, and a moisture absorption member formed in a boundary region between the body and the first and second electrodes.

Meanwhile, the embodiment provides a lighting device including a module substrate, a plurality of light emitting device packages arranged separately on the module substrate, and a moisture absorbing member formed in a region other than the plurality of light emitting device packages.

According to the embodiment, by forming the moisture absorbing member in the boundary region between the body and the lead frame, it is possible to prevent the moisture penetrating from the outside from approaching the light emitting element. Further, by forming the moisture absorbing member using a reversible porous moisture absorbent, the moisture retained in accordance with the temperature can be discharged to the outside again, which can be used permanently.

1 is a perspective view of a light emitting device package according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of the light emitting device package of FIG. 1 taken along line I-I '.
3 is a cross-sectional view of the light emitting diode of FIG.
4 is an exploded perspective view of the display device of the present invention.
5 is a cross-sectional view of the display device of FIG. 4 taken along line I-I '.
FIG. 6 is a view showing the light emitting module of FIG. 4;
7 is a cross-sectional view of the light emitting module of FIG. 6 taken along line II-II '.
8 is a view showing another embodiment of the light emitting module of FIG.
9 is a view showing an example of a lighting device including the light emitting device package of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure may be formed "on" or "under" a substrate, each layer The terms " on "and " under " include both being formed" directly "or" indirectly " Also, the criteria for top, bottom, or bottom of each layer will be described with reference to the drawings. The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

Hereinafter, the light emitting device package of the embodiment will be described with reference to FIGS. 1 to 3. FIG.

FIG. 1 is a top view of a light emitting device package according to a first embodiment of the present invention, FIG. 2 is a sectional view taken along line I-I 'of FIG. 1, to be.

1 to 3, the light emitting device package 100 includes a body 110, at least one light emitting device 120 disposed on the body 110, and a light emitting diode 120 disposed on the body 110 And a first electrode 131 and a second electrode 132 electrically connected to the light emitting device 120.

In addition, the light emitting device package 100 includes a resin material 170 for protecting the light emitting device 120.

The body 110 may include at least one of a resin material such as polyphthalamide (PPA), a silicon (Si), a metal material, a photo sensitive glass (PSG), a sapphire (Al ₂ O ₃ ), a printed circuit board Can be formed. Preferably, the body 110 may be made of a resin material such as polyphthalamide (PPA).

The body 110 may be formed of a conductor having conductivity. When the body 110 is made of an electrically conductive material, an insulating film (not shown) is formed on the surface of the body 110 to prevent the body 110 from being electrically short-circuited with the first electrode and the second electrode. . The peripheral shape of the body 110 viewed from above may have various shapes such as a triangular shape, a rectangular shape, a polygonal shape, and a circular shape depending on the use and design of the light emitting device package 100.

A cavity 115 may be formed in the body 110 to open the upper portion 112. The cavity 115 may be formed by, for example, injection molding, or may be formed by etching.

The cavity 115 may be formed in a cup shape, a concave container shape, or the like, and the inner surface thereof may be a side surface perpendicular to the bottom surface or a side surface inclined. The inclined side surface may be inclined by 50 to 60 when the body 110 is wet etched.

The shape of the cavity 115 viewed from the top may be circular, square, polygonal, elliptical, or the like.

The first electrode 131 and the second electrode 132 may be formed on the body 110. The first electrode 131 and the second electrode 132 may be electrically separated from an anode and a cathode to provide power to the light emitting device 120. According to the design of the light emitting device 120, a plurality of electrodes may be formed in addition to the first and second electrodes 131 and 132, but the present invention is not limited thereto.

The first and second electrodes 131 and 132 may be separated from each other in the cavity 115 and extend to the backside of the body 110 as shown in FIG. .

The first and second electrodes 131 and 132 may have a single-layer structure. For example, it may be formed of a metal or an alloy including at least one of Cu, Cr, Au, Al, Ag, Sn, Ni, Pt and Pd. The first and second electrodes 131 and 132 may have a multi-layer structure. For example, the first and second electrodes 131 and 132 may be a Ti / Cu / Ni / Au layer in which titanium (Ti), copper (Cu), nickel (Ni) It is not limited thereto.

That is, materials having excellent adhesion to the body such as titanium (Ti), chromium (Cr), and tantalum (Ta) are laminated on the lowest layers of the first and second electrodes 131 and 132, Platinum (Pt) is deposited between the uppermost layer and the lowermost layer of the first and second electrodes 131 and 132, and wires and the like are easily attached to the uppermost layer of the first and second electrodes 131 and 132, , Nickel (Ni), copper (Cu), or the like may be stacked, but the present invention is not limited thereto.

The first and second electrodes 131 and 132 may be selectively formed using a plating method, a deposition method, a photolithography method, or the like, but are not limited thereto.

The first and second electrodes 131 and 132 may be electrically connected to a wire 122 to electrically connect the first and second electrodes 131 and 132 to the light emitting device 120.

1 and 2, a cathode mark may be formed on the body 110 in order to distinguish the first and second electrodes 131 and 132 from each other without confusion. I do not.

The light emitting device 120 may be mounted on the body 110. When the body 110 includes the cavity 115, the light emitting device 120 may be mounted in the cavity 115.

At least one light emitting device 120 may be mounted on the body 110 according to the design of the light emitting device package 100. When a plurality of the light emitting device packages 100 are mounted, a plurality of electrodes for supplying power to the plurality of light emitting device packages 100 may be formed. However, the present invention is not limited thereto.

The light emitting device 120 may be directly mounted on the body 110 or may be electrically connected to the first or second electrodes 131 and 132.

The light emitting device 120 can be mounted by selectively using wire bonding, die bonding, and flip bonding. The bonding method can be changed depending on the chip type and the electrode position of the chip.

 The light emitting device 120 may selectively include a semiconductor light emitting device manufactured using a semiconductor of a group III-V element compound semiconductor such as AlInGaN, InGaN, GaN, GaAs, InGaP, AllnGaP, InP, or InGaAs have.

As shown in FIG. 2, the light emitting device 120 may be attached to the second electrode 132 with a conductive adhesive, and may be electrically connected to the first electrode 131 with a wire 122.

The light emitting device 120 is called a vertical light emitting device and includes a conductive supporting substrate 121, a bonding layer 123, a second conductive semiconductor layer 125, an active layer 127, And a conductive semiconductor layer 129.

 The conductive support substrate 121 may be formed of a metal or an electrically conductive semiconductor substrate.

 A group III-V nitride semiconductor layer is formed on the substrate 121. The growth equipment of the semiconductor includes an electron beam evaporator, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma laser deposition (PLD) For example, a dual-type thermal evaporator, sputtering, metal organic chemical vapor deposition (MOCVD), and the like.

 A bonding layer 123 may be formed on the conductive supporting substrate 121. The bonding layer 123 bonds the conductive supporting substrate 121 and the nitride semiconductor layer. In addition, the conductive supporting substrate 121 may be formed by a plating method instead of a bonding method. In this case, the bonding layer 123 may not be formed.

 The second conductivity type semiconductor layer 125 is formed on the bonding layer 123 and the second conductivity type semiconductor layer 125 is electrically connected to the first electrode 31.

 The second conductive semiconductor layer 125 may be formed of at least one of Group III-V compound semiconductor such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, and AlInN. The second conductivity type semiconductor layer 125 may be doped with a second conductivity type dopant, and the second conductivity type dopant may be a p type dopant including Mg, Zn, Ca, Sr, and Ba.

 The second conductivity type semiconductor layer 125 may be formed of a p-type GaN layer having a predetermined thickness by supplying a gas including a p-type dopant such as NH3, TMGa (or TEGa), and Mg.

 The second conductivity type semiconductor layer 125 includes a current spreading structure in a predetermined region. The current diffusion structure includes semiconductor layers having a higher current diffusion speed in the horizontal direction than the current diffusion speed in the vertical direction.

 The current diffusion structure may include, for example, semiconductor layers having a dopant concentration or a difference in conductivity.

 The second conductivity type semiconductor layer 125 can be supplied with a carrier diffused in a uniform distribution to another layer on the second conductivity type semiconductor layer 125, for example, the active layer 127.

 The active layer 127 is formed on the second conductive semiconductor layer 125. The active layer 127 may be formed of a single quantum well or a multiple quantum well (MQW) structure. One period of the active layer 127 may selectively include a period of InGaN / GaN, a period of AlGaN / InGaN, a period of InGaN / InGaN, or a period of AlGaN / GaN.

 A second conductive type clad layer (not shown) may be formed between the second conductive type semiconductor layer 125 and the active layer 127. The second conductivity type cladding layer may be formed of a p-type GaN-based semiconductor. The second conductivity type cladding layer may be formed of a material having a band gap higher than the energy band gap of the well layer.

 A first conductive semiconductor layer 129 is formed on the active layer 127. The first conductive semiconductor layer 129 may be an n-type semiconductor layer doped with the first conductive dopant. The n-type semiconductor layer may be made of any one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, and AlInN. The first conductivity type dopant is an n-type dopant, and at least one of Si, Ge, Sn, Se, and Te can be added.

 The first conductivity type semiconductor layer 129 may be formed of an n-type GaN layer having a predetermined thickness by supplying a gas containing an n-type dopant such as NH3, TMGa (or TEGa), and Si.

The second conductive semiconductor layer 125 may be a p-type semiconductor layer and the first conductive semiconductor layer 129 may be an n-type semiconductor layer. The light emitting structure may be implemented by any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure. Hereinafter, for the sake of explanation of the embodiments, the uppermost layer of the semiconductor layer will be described as the first conductive type semiconductor layer 129 as an example thereof.

A first electrode and / or an electrode layer (not shown) may be formed on the first conductive semiconductor layer 129. The electrode layer may be formed of an oxide or nitride-based light-transmitting layer such as indium tin oxide (ITO), indium tin oxide nitride (ITON), indium zinc oxide (IZO), indium zinc oxide nitride (IZON) (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), IrO x, RuO x, NiO. ≪ / RTI > The electrode layer can function as a current diffusion layer capable of diffusing a current.

The electrode layer may be a reflective electrode layer and the reflective electrode layer may be formed of a material consisting of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, . For example, the metal layer may be formed of at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, and Hf or an alloy thereof. .

A plurality of the light emitting devices 120 may be mounted on the body 110.

And a molding material 170 for filling the cavity 115 in the cavity 115.

The molding material 170 is formed of a light transmitting material and is formed up to the upper portion of the body 110.

The molding material 170 has a structure in which phosphors are dispersed in a translucent resin. The phosphors vary the wavelength of light emitted from the light emitting device 120 and emit light of different wavelengths.

For example, when the light emitting element 120 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to generate white light. When the light emitting device 120 emits ultraviolet rays (UV), phosphors of three colors of red, green, and blue are added to realize white light.

At this time, a plurality of moisture absorption members 180 are formed in the boundary region between the body 110 and the first and second electrodes 131 and 132.

The first moisture absorption member 180 is formed on the upper surface of the first and second electrodes 131 and 132 along the side surface of the body 110.

1, the first moisture absorption member 180 may have a stripe shape along the side surface of the body 110. Alternatively, the first moisture absorption member 180 may include a plurality of first moisture absorption members 180 separated from each other.

The second moisture absorption member 181 is connected to the bottom of the first and second electrodes 131 and 132 from the bottom surface of the body 110. The second moisture absorbing member 180 may be formed of a plurality of moisture absorbing members separated from each other. The width of the moisture absorbing member exposed on the bottom surface of the body 110 may be a width of the first and second electrodes 131 and 132, The width of the region closer to the lower portion of the substrate 100 may be larger than the width of the region.

The first and second moisture absorbing members 180 and 181 are formed of a porous moisture absorbent and may be formed of a material having a reversible nature such as silica gel, calcium chloride, or activated alumina.

The first and second moisture absorption members 180 and 181 are formed at a portion in contact with the electrodes 131 and 132 from the outside to absorb moisture penetrating into the cavity 115 at the boundaries of the electrodes 131 and 132, It is possible to prevent moisture from reaching the surface 120.

In addition, since the first and second moisture absorption members 180 and 181 are reversible, they can be used permanently by discharging water absorbed by applying a predetermined temperature to the outside.

Hereinafter, various embodiments to which the moisture absorbing member is applied will be described.

4 is an exploded perspective view of the display device of the present invention, FIG. 5 is a cross-sectional view of the display device of FIG. 4 taken along line I-I ', FIG. 6 is a view of the light emitting module of FIG. Sectional view taken along line II-II 'of the light emitting module of FIG. 4, and FIG. 8 is a view showing another embodiment of the light emitting module of FIG.

The display device includes a backlight unit and a display panel that receives light from the backlight unit and displays an image. Therefore, in the following description, the backlight unit will also be described together with the display device.

4 to 7, the display device includes a bottom frame 10, a light emitting module 20 formed in the bottom frame 10, a reflective sheet 25, and a light guide plate 30.

Such a display device has a light guide plate 30 formed on a light emitting module 20, a reflective sheet 25 and a reflective sheet 25 to form a light emitting portion. The light guide plate 30 includes an optical sheet 40, A top frame 70 is formed on the display panel 60 and the display panel 60.

The bottom frame 10 includes a bottom surface having a rectangular planar shape having two long sides opposite to each other and a long side having two short sides facing each other, and four side portions extending vertically from the bottom surface.

The bottom frame 10 includes a light emitting module 20, a reflection sheet 25, a light guide plate 30, and an optical sheet 40 (not shown) in the bottom frame 10 in combination with a support member 50 formed on the optical sheet 40. [ ).

The bottom frame 10 may be formed of, for example, a metal material, and a plurality of convex portions (not shown) may be formed on the bottom surface to enhance rigidity.

On the bottom surface of the bottom frame 10, a reflective sheet 25 is formed.

On the other hand, the reflective sheet 25 is composed of a reflective material, a reflective metal plate, and the like, and reflects light leaked from the light guide plate 30.

The display device includes a light guide plate 30 for diffusing and reflecting light emitted from the light emitting module 20 onto a plurality of light emitting modules 20 and a plurality of reflective sheets 25 to irradiate the display panel 60 with a surface light source .

The light guide plate 30 is formed in a one-body shape corresponding to a screen defined by the display panel 60. [

The integrated light guide plate 30 includes upper and lower surfaces, and the upper surface on which the surface light source is generated is flat.

The light guide plate 30 may be made of PC material or PMMA (Poly methyl methacrylate), and a reflection pattern may be formed on the lower part. The reflection pattern may be formed in a concentric or concave-convex pattern with respect to each corner, but the present invention is not limited thereto.

The light guide plate 30 may be fabricated by mixing phosphors, or may be coated with phosphors on the upper surface, but the present invention is not limited thereto.

The light guide plate 30 has a polygonal shape corresponding to one screen, and may have a rectangular shape, preferably a rectangular shape, depending on the shape of the screen.

A light emitting module (20) is disposed on one side of the light guide plate (30).

The light emitting module 20 may be of a bar type extending along one side of the light guide plate 30.

Referring to FIGS. 6 and 7, the light emitting module 20 includes a plurality of light emitting device packages 23 formed on a substrate 21.

The substrate 21 is a module substrate 21 having a pattern for driving the light emitting device package 23, and may be a metal substrate or the like.

The light emitting device package 23 may be spaced apart from the module substrate 21 by a predetermined distance as shown in FIG. 3. The light emitting device package 23 may be a top view type that emits light to the upper surface of the module substrate 21, To emit light to the side of the light source.

The module substrate 21 includes a radiator plate 210, an insulation layer 211 on the radiator plate 210, and a circuit pattern 212 on the insulation layer 211.

The radiator plate 210 may be a metal substrate or an alloy substrate including a metal having a high thermal conductivity such as aluminum or copper. Alternatively, the radiator plate 210 may be a nitride substrate having high thermal conductivity.

And an insulating layer 211 is formed on the radiator plate 210.

The insulating layer 211 may be omitted if the radiator plate 210 is made of a nonconductive material such as nitride.

When the radiator plate 210 is a metal substrate, the insulating layer 211 may be an oxide or a nitride of the metal substrate, or may be formed of a resin material.

A circuit pattern 212 is formed on the insulating layer 211.

The circuit pattern 212 includes pads connected to the light emitting device package 23 and an external power source (not shown).

The pads are exposed by the solder resist 213, and the circuit patterns 212 except the pads are covered with the solder resist 213.

The pad is physically bonded to the plurality of light emitting device packages 23 through a solder (not shown).

At this time, a moisture absorbing member 25 is formed in a space between the neighboring light emitting device packages 23.

That is, as shown in FIG. 6, the moisture absorbing member 25 is formed across the short side of the module substrate 21 in the space between the neighboring light emitting device packages 23.

The moisture absorbing member 25 may be formed to have a thickness equal to the thickness of the solder resist 213 as shown in FIG. 7, or may be formed to protrude above the solder resist 213.

The moisture absorbing member 25 is formed at the center of the spacing space.

The moisture absorbing member 25 is formed of a porous moisture absorbent having a reversible property according to temperature as described in the light emitting device package 100 of FIG. 1, and may be silica gel, calcium chloride, or activated alumina, but is not limited thereto.

 Meanwhile, the moisture absorbing member 25 may be formed to surround the light emitting device package 23 as shown in FIG. 8, and the formation of the moisture absorbing member 25 is not limited thereto.

The display panel 60 includes, for example, an LCD panel, first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 60, but the present invention is not limited thereto. The display panel 60 transmits or blocks light provided from the light emitting module 20 to display information. Such a display device can be applied to various kinds of portable terminals, monitors of notebook computers, monitors of laptop computers, and video display devices such as televisions.

The optical sheet 40 is disposed between the display panel 60 and the light guide plate 30 and includes at least one light transmitting sheet. The optical sheet 40 may include at least one of a sheet such as a diffusion sheet, a horizontal / vertical prism sheet, and a brightness enhanced sheet. The diffusion sheet diffuses the incident light, and the horizontal and / or vertical prism sheet concentrates the incident light on the display panel 60. The brightness enhancing sheet reuses the lost light to improve the brightness I will. A protective sheet may be disposed on the display panel 60, but the present invention is not limited thereto.

9 is a perspective view of a lighting apparatus according to an embodiment.

9, the lighting apparatus 1500 includes a case 1510, a light emitting module 1530 installed in the case 1510, a connection terminal (not shown) installed in the case 1510 and supplied with power from an external power source 1520).

The case 1510 is preferably formed of a material having a good heat dissipation property, and may be formed of, for example, a metal material or a resin material.

The light emitting module 1530 may include a substrate 1532 and a light emitting device package 100 mounted on the substrate 1532. A plurality of the light emitting device packages 100 may be arrayed in a matrix or at a predetermined interval.

The substrate 1532 may be a circuit pattern printed on an insulator. For example, the substrate 1532 may be a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, FR-4 substrate, and the like.

In addition, the substrate 1532 may be formed of a material that efficiently reflects light, or may be a coating layer such as a white color, a silver color, or the like whose surface is efficiently reflected by light.

At least one light emitting device package 100 may be mounted on the substrate 1532. Each of the light emitting device packages 100 may include at least one LED (Light Emitting Diode) chip. The LED chip may include a light emitting diode in a visible light band such as red, green, blue or white, or a UV light emitting diode that emits ultraviolet (UV) light.

The light emitting module 1530 may be arranged to have a combination of various light emitting device packages 100 to obtain color and brightness. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be arranged in combination in order to secure a high color rendering index (CRI).

The connection terminal 1520 may be electrically connected to the light emitting module 1530 to supply power. The connection terminal 1520 is connected to the external power source by being inserted in a socket manner, but the present invention is not limited thereto. For example, the connection terminal 1520 may be formed in a pin shape and inserted into an external power source or may be connected to an external power source through wiring.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

The light emitting device package 100
The light emitting element 120
The body 110
The moisture absorption members 180, 181, 25

Claims (8)

A body including a cavity;
A first electrode and a second electrode separately disposed in the cavity;
At least one light emitting element disposed in the cavity and electrically connected to the first electrode and the second electrode;
A resin material covering the light emitting device and filling the cavity;
A plurality of first moisture absorption members formed in a boundary region between the body and the first electrode and the second electrode; And
And a plurality of second moisture absorption members connected to a bottom of the first electrode and a second electrode from a bottom surface of the body,
The first moisture absorption member is formed along a side surface of the body at an upper portion of the first electrode and the second electrode,
The second moisture absorption member is disposed on the same plane as the bottom surface of the body,
The lower surface of the second moisture absorption member is exposed on the bottom surface of the body,
And a bottom width of the second moisture absorption member is larger than a width of a region where the second moisture absorption member is in contact with the lower surface of the first electrode and the second electrode. The method according to claim 1,
And the upper surface of the second moisture absorption member is in contact with the lower surface of the first electrode and the second electrode. 3. The method of claim 2,
And a lower surface of the first moisture absorption member is in contact with an upper surface of the first electrode and the second electrode. The method of claim 3,
Wherein the first moisture absorption member and the second moisture absorption member are formed of a porous moisture absorbent and include silica gel, calcium chloride, or activated alumina. 5. The method of claim 4,
And the second moisture absorption member passes through the body from the bottom surface of the body to the first electrode and the second electrode.
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