[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS5318329B2 - - Google Patents

Info

Publication number
JPS5318329B2
JPS5318329B2 JP4184474A JP4184474A JPS5318329B2 JP S5318329 B2 JPS5318329 B2 JP S5318329B2 JP 4184474 A JP4184474 A JP 4184474A JP 4184474 A JP4184474 A JP 4184474A JP S5318329 B2 JPS5318329 B2 JP S5318329B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4184474A
Other versions
JPS5086431A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5086431A publication Critical patent/JPS5086431A/ja
Publication of JPS5318329B2 publication Critical patent/JPS5318329B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12583—Component contains compound of adjacent metal
    • Y10T428/1259—Oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12701—Pb-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/12847—Cr-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Electrolytic Production Of Metals (AREA)
JP4184474A 1973-12-03 1974-04-16 Expired JPS5318329B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/421,236 US3998601A (en) 1973-12-03 1973-12-03 Thin foil

Publications (2)

Publication Number Publication Date
JPS5086431A JPS5086431A (ja) 1975-07-11
JPS5318329B2 true JPS5318329B2 (ja) 1978-06-14

Family

ID=23669727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4184474A Expired JPS5318329B2 (ja) 1973-12-03 1974-04-16

Country Status (11)

Country Link
US (1) US3998601A (ja)
JP (1) JPS5318329B2 (ja)
BE (1) BE822888A (ja)
DE (1) DE2413669C3 (ja)
FI (1) FI61425C (ja)
FR (1) FR2252920B1 (ja)
GB (1) GB1458259A (ja)
IT (1) IT1004471B (ja)
LU (1) LU71409A1 (ja)
NL (1) NL155892B (ja)
SE (1) SE409160B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0996318A3 (en) * 1998-10-19 2002-02-20 Mitsui Mining & Smelting Co., Ltd. Novel composite foil, process for producing the same and copper-clad laminate
JP2002368365A (ja) * 2001-06-04 2002-12-20 Nikko Materials Co Ltd 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
JP2006022406A (ja) * 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4073699A (en) * 1976-03-01 1978-02-14 Hutkin Irving J Method for making copper foil
US4088544A (en) * 1976-04-19 1978-05-09 Hutkin Irving J Composite and method for making thin copper foil
FR2361224A1 (fr) * 1976-08-11 1978-03-10 Uop Inc Produit stratifie a placage metallique et son procede de fabrication
US4169018A (en) * 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
US4323632A (en) * 1978-10-17 1982-04-06 Gould Inc. Metal composites and laminates formed therefrom
US4234395A (en) * 1978-10-17 1980-11-18 Gould Inc. Metal composites and laminates formed therefrom
US4386139A (en) * 1980-10-31 1983-05-31 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
US4387137A (en) * 1980-12-01 1983-06-07 The Mica Corporation Capacitor material
US4305795A (en) * 1981-01-08 1981-12-15 Rca Corporation Method for the manufacture of stampers
US4394419A (en) * 1981-06-12 1983-07-19 Oak Industries Inc. Printed circuit material
JPS6020919B2 (ja) * 1981-09-18 1985-05-24 住友電気工業株式会社 印刷配線板の製造方法
US4431685A (en) * 1982-07-02 1984-02-14 International Business Machines Corporation Decreasing plated metal defects
US4462873A (en) * 1982-07-16 1984-07-31 Eiji Watanabe Method of fixedly arranging an array of electroformed letters or the like on an article
US4487662A (en) * 1982-09-20 1984-12-11 Xerox Corporation Electrodeposition method for check valve
GB8333753D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Dielectric boards
DE208177T1 (de) * 1985-07-05 1987-08-13 Yates Industries, Inc., Bordentown, N.J. Aeusserst duenne kupferfolie und verfahren zur herstellung einer solchen folie.
US4927700A (en) * 1988-02-24 1990-05-22 Psi Star Copper etching process and product with controlled nitrous acid reaction
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
US5121535A (en) * 1988-12-14 1992-06-16 Sulzer Bros. Ltd. Method for production of thin sections of reactive metals
US5127146A (en) * 1988-12-14 1992-07-07 Sulzer Brothers, Ltd. Method for production of thin sections of reactive metals
NL9000310A (nl) * 1989-02-27 1990-09-17 Omi Int Corp Mengsel en werkwijze voor omzetting.
JPH0818401B2 (ja) * 1989-05-17 1996-02-28 福田金属箔粉工業株式会社 複合箔とその製法
DE69025500T2 (de) * 1989-06-23 1996-10-31 Meiko Electronics Co Ltd Verfahren zur Herstellung eines kupferkaschierten Laminats
DE4116045A1 (de) * 1991-05-16 1992-11-19 Chen Ron Hon Entwicklungsverfahren mit indikationseffekt
US5403672A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Co., Ltd. Metal foil for printed wiring board and production thereof
US5322975A (en) * 1992-09-18 1994-06-21 Gould Electronics Inc. Universal carrier supported thin copper line
IT1264791B1 (it) * 1993-05-31 1996-10-10 Rotoincisa Srl Matrici sfilabili,per i cilindri delle macchine per la stampa a rotocalco, riciclabili
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
US5447619A (en) * 1993-11-24 1995-09-05 Circuit Foil Usa, Inc. Copper foil for the manufacture of printed circuit boards and method of producing the same
TW289900B (ja) 1994-04-22 1996-11-01 Gould Electronics Inc
US6117300A (en) * 1996-05-01 2000-09-12 Honeywell International Inc. Method for forming conductive traces and printed circuits made thereby
US6270889B1 (en) * 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6319620B1 (en) 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
JP3612594B2 (ja) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法
US5903813A (en) * 1998-07-24 1999-05-11 Advanced Materials Products, Inc. Method of forming thin dense metal sections from reactive alloy powders
US6183880B1 (en) 1998-08-07 2001-02-06 Mitsui Mining & Smelting Co., Ltd. Composite foil of aluminum and copper
SG101924A1 (en) * 1998-10-19 2004-02-27 Mitsui Mining & Smelting Co Composite material used in making printed wiring boards
US6120693A (en) * 1998-11-06 2000-09-19 Alliedsignal Inc. Method of manufacturing an interlayer via and a laminate precursor useful for same
US6355322B1 (en) 1998-12-08 2002-03-12 3M Innovative Properties Company Release liner incorporating a metal layer
AU2395600A (en) * 1999-01-21 2000-08-07 Ga-Tek Inc. Process for recovering copper from a high acid mixed metal solution
ATE222046T1 (de) * 1999-03-23 2002-08-15 Circuit Foil Luxembourg Trading Sarl Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte und verbundfolie zur verwendung darin
LU90376B1 (en) * 1999-03-23 2000-09-25 Circuit Foil Luxembourg Trading Sarl Method for manufacturing a multilayer printed circuit board and composite foil for use therein
US6372113B2 (en) 1999-09-13 2002-04-16 Yates Foil Usa, Inc. Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
LU90532B1 (en) 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
US6569543B2 (en) 2001-02-15 2003-05-27 Olin Corporation Copper foil with low profile bond enahncement
MY120403A (en) * 2000-03-10 2005-10-31 Gbc Metals Llc Copper foil composite including a release layer
US6346335B1 (en) 2000-03-10 2002-02-12 Olin Corporation Copper foil composite including a release layer
JP3743702B2 (ja) * 2000-04-28 2006-02-08 三井金属鉱業株式会社 プリント配線板のセミアディティブ製造法
US6660406B2 (en) * 2000-07-07 2003-12-09 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit
US6447929B1 (en) 2000-08-29 2002-09-10 Gould Electronics Inc. Thin copper on usable carrier and method of forming same
US6893742B2 (en) 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
US6763575B2 (en) * 2001-06-11 2004-07-20 Oak-Mitsui Inc. Printed circuit boards having integrated inductor cores
US6770976B2 (en) 2002-02-13 2004-08-03 Nikko Materials Usa, Inc. Process for manufacturing copper foil on a metal carrier substrate
JP2003347149A (ja) * 2002-05-23 2003-12-05 Nitto Denko Corp 金属転写シート、金属転写シートの製造方法およびセラミックコンデンサの製造方法
ES2203324B1 (es) * 2002-05-23 2005-02-16 Antonio Rodriguez Siurana Lamina de cobre, material laminar compuesto que comprende dicha lamina de cobre y procedimiento para su obtencion.
WO2004014114A1 (ja) * 2002-07-31 2004-02-12 Sony Corporation 素子内蔵基板の製造方法および素子内蔵基板、ならびに、プリント配線板の製造方法およびプリント配線板
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
JP2006068920A (ja) * 2004-08-31 2006-03-16 Shin Etsu Chem Co Ltd フレキシブル銅箔ポリイミド積層板の製造方法
US20060108336A1 (en) * 2004-11-23 2006-05-25 Northrop Grumman Corporation Fabrication process for large-scale panel devices
CN1972557A (zh) * 2005-10-14 2007-05-30 三井金属矿业株式会社 挠性覆铜层压板和薄膜载带及其制造方法、以及挠性印刷电路板、半导体装置
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
US8449987B2 (en) * 2006-06-12 2013-05-28 Jx Nippon Mining & Metals Corporation Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil
DE102008022722B4 (de) * 2008-05-06 2010-02-11 Siemens Aktiengesellschaft Verfahren zum elektrochemischen Erzeugen eines Metallbandes
JP2009143233A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
US8329315B2 (en) * 2011-01-31 2012-12-11 Nan Ya Plastics Corporation Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method
US8828245B2 (en) 2011-03-22 2014-09-09 Industrial Technology Research Institute Fabricating method of flexible circuit board
US10057984B1 (en) * 2017-02-02 2018-08-21 Chang Chun Petrochemical Co., Ltd. Composite thin copper foil and carrier
JP7085419B2 (ja) * 2018-03-14 2022-06-16 東洋鋼鈑株式会社 圧延接合体及びその製造方法
LU503243B1 (en) 2022-12-22 2024-06-25 Circuit Foil Luxembourg Method for producing a composite copper foil and composite copper foil obtained therewith

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US510013A (en) * 1893-12-05 Carl endbuweit
US454381A (en) * 1891-06-16 Alexander gael seinfeld
US2433441A (en) * 1947-12-30 Electrolytic production of thin
US2105440A (en) * 1938-01-11 Manufacture of metal coated paper
US676357A (en) * 1897-12-31 1901-06-11 Carl Endruweit Process of making metal paper in endless strips.
US880484A (en) * 1904-06-29 1908-02-25 Edison Storage Battery Co Process of producing very thin sheet metal.
GB117872A (en) * 1917-11-08 1918-08-08 Michael Alfred Bolton Improvements in and relating to the Deposition of Metals by Electrolysis.
US1574055A (en) * 1920-05-15 1926-02-23 Madsenell Corp Fabrication of metal sheets by electrodeposition
US1494152A (en) * 1921-10-12 1924-05-13 Cowper-Coles Sherard Osborn Continuous automatic process for the production of metal sheets, wire, tubes, cylinders, and other articles
GB230456A (ja) * 1924-03-04 1926-06-03 Carl Muller
US1589564A (en) * 1924-06-27 1926-06-22 Anaconda Sales Co Process of electrodeposition
US1760028A (en) * 1924-12-01 1930-05-27 Gen Motors Res Corp Process of producing metal sheets by electrodeposition
FR619284A (fr) * 1926-07-14 1927-03-30 Procédé et dispositif pour la production de dépôts métalliques lamellaires
GB275221A (en) 1926-07-27 1928-01-12 Edmund Breuning Process for the production by electrolysis of thin superposed nickel sheets and for separating them one from another
US1924410A (en) * 1931-03-12 1933-08-29 Chrysler Corp Method and means for forming separable plated coatings on metal surfaces
US2203253A (en) * 1936-09-26 1940-06-04 Western Electric Co Electroplating process
NL108173C (ja) * 1954-06-25
GB853422A (en) 1958-05-30 1960-11-09 Angus George Co Ltd Improvements in and relating to coating fluorocarbon materials with metal
US3293109A (en) * 1961-09-18 1966-12-20 Clevite Corp Conducting element having improved bonding characteristics and method
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
FR1571857A (ja) 1968-07-03 1969-06-20
US3617450A (en) * 1968-08-07 1971-11-02 Mitsubishi Metal Mining Co Ltd Automatic stripping of electrodeposited starting sheets
BE792930A (fr) * 1971-05-26 1973-06-18 Fortin Laminating Corp Procede de production d'un stratifie revetu d'un clinquant metallique
BE788117A (fr) * 1971-08-30 1973-02-28 Perstorp Ab Procede de production d'elements pour circuits imprimes

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0996318A3 (en) * 1998-10-19 2002-02-20 Mitsui Mining & Smelting Co., Ltd. Novel composite foil, process for producing the same and copper-clad laminate
JP2006022406A (ja) * 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔
JP4728723B2 (ja) * 2000-09-22 2011-07-20 古河電気工業株式会社 キャリア付き極薄銅箔
JP2002368365A (ja) * 2001-06-04 2002-12-20 Nikko Materials Co Ltd 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
JP4672907B2 (ja) * 2001-06-04 2011-04-20 Ｊｘ日鉱日石金属株式会社 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板

Also Published As

Publication number Publication date
BE822888A (fr) 1975-06-03
LU71409A1 (ja) 1976-04-13
DE2413669B2 (de) 1980-05-14
FI61425B (fi) 1982-04-30
NL155892B (nl) 1978-02-15
FI297874A (ja) 1975-06-04
DE2413669C3 (de) 1981-02-12
DE2413669A1 (de) 1975-06-12
JPS5086431A (ja) 1975-07-11
SE7403540L (ja) 1975-06-04
FR2252920A1 (ja) 1975-06-27
IT1004471B (it) 1976-07-10
FR2252920B1 (ja) 1980-05-30
US3998601A (en) 1976-12-21
NL7404880A (nl) 1975-06-05
FI61425C (fi) 1982-08-10
GB1458259A (en) 1976-12-15
SE409160B (sv) 1979-07-30

Similar Documents

Publication Publication Date Title
AR201758A1 (ja)
FR2252920B1 (ja)
AU476761B2 (ja)
AR201235Q (ja)
AR201231Q (ja)
AU474838B2 (ja)
AU476714B2 (ja)
AR201229Q (ja)
AU476696B2 (ja)
AR199451A1 (ja)
AU477823B2 (ja)
AR197627A1 (ja)
AR210729A1 (ja)
AU476873B1 (ja)
AR200885A1 (ja)
AR201432A1 (ja)
AU477824B2 (ja)
AR200256A1 (ja)
AR196382A1 (ja)
AR196123Q (ja)
AR196212Q (ja)
AU479496A (ja)
AU479420A (ja)
AU479539A (ja)
AU479522A (ja)