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JPS5286064A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5286064A
JPS5286064A JP205476A JP205476A JPS5286064A JP S5286064 A JPS5286064 A JP S5286064A JP 205476 A JP205476 A JP 205476A JP 205476 A JP205476 A JP 205476A JP S5286064 A JPS5286064 A JP S5286064A
Authority
JP
Japan
Prior art keywords
semiconductor device
completely
heat sink
power transistor
semiconductor pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP205476A
Other languages
Japanese (ja)
Inventor
Yoshio Nonaka
Kenji Yoshinaga
Kazuo Kanbayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP205476A priority Critical patent/JPS5286064A/en
Publication of JPS5286064A publication Critical patent/JPS5286064A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To solder semiconductor pellets, such as power transistor, completely on the heat sink.
COPYRIGHT: (C)1977,JPO&Japio
JP205476A 1976-01-12 1976-01-12 Semiconductor device Pending JPS5286064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP205476A JPS5286064A (en) 1976-01-12 1976-01-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP205476A JPS5286064A (en) 1976-01-12 1976-01-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5286064A true JPS5286064A (en) 1977-07-16

Family

ID=11518612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP205476A Pending JPS5286064A (en) 1976-01-12 1976-01-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5286064A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515246A (en) * 1978-07-18 1980-02-02 Matsushita Electronics Corp Bonding method for semiconductor substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515246A (en) * 1978-07-18 1980-02-02 Matsushita Electronics Corp Bonding method for semiconductor substrate

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