JPS53126275A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS53126275A JPS53126275A JP4038077A JP4038077A JPS53126275A JP S53126275 A JPS53126275 A JP S53126275A JP 4038077 A JP4038077 A JP 4038077A JP 4038077 A JP4038077 A JP 4038077A JP S53126275 A JPS53126275 A JP S53126275A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- tab
- chip
- mounting
- providing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To reduce thermal resistance of the device by providing a heat sink to a tab for mounting a chip in performing packaging.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4038077A JPS53126275A (en) | 1977-04-11 | 1977-04-11 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4038077A JPS53126275A (en) | 1977-04-11 | 1977-04-11 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53126275A true JPS53126275A (en) | 1978-11-04 |
Family
ID=12579038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4038077A Pending JPS53126275A (en) | 1977-04-11 | 1977-04-11 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53126275A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1983003712A1 (en) * | 1982-04-05 | 1983-10-27 | Motorola Inc | A self-positioning heat spreader |
US4541005A (en) * | 1982-04-05 | 1985-09-10 | Motorola, Inc. | Self-positioning heat spreader |
-
1977
- 1977-04-11 JP JP4038077A patent/JPS53126275A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1983003712A1 (en) * | 1982-04-05 | 1983-10-27 | Motorola Inc | A self-positioning heat spreader |
US4541005A (en) * | 1982-04-05 | 1985-09-10 | Motorola, Inc. | Self-positioning heat spreader |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS528785A (en) | Semiconductor device electrode structure | |
JPS5394875A (en) | Package for semiconductor element | |
JPS5389688A (en) | Semiconductor device | |
JPS53126276A (en) | Heat dissipation construction of multichip mounting substrate | |
JPS53126275A (en) | Semiconductor device | |
JPS5251879A (en) | Semiconductor integrated circuit | |
JPS5314561A (en) | Packaging device of semiconductor device | |
JPS53135579A (en) | Liquid sealing semiconductor device | |
JPS5236980A (en) | Heat sink for semiconductor devices | |
JPS53135280A (en) | Exfoliating unit of semiconductor chip | |
JPS51147290A (en) | Semiconductor device | |
JPS52147065A (en) | Semiconductor device | |
JPS53121490A (en) | Semiconductor device | |
JPS5350674A (en) | Semiconductor device | |
JPS52117075A (en) | Semiconductor device | |
JPS5286064A (en) | Semiconductor device | |
JPS5418280A (en) | Resin sealed semiconductor device | |
JPS5412270A (en) | Integrated circuit rackage | |
JPS5432278A (en) | Semiconductor device | |
JPS53144262A (en) | Bonding unit for semiconductor device | |
JPS52132778A (en) | Manufacture for semiconductor device | |
JPS53113479A (en) | Semiconductor device | |
JPS53137668A (en) | Manufacture for semiconductor device | |
JPS54578A (en) | Resin seal semiconductor device | |
JPS52129292A (en) | Semiconductor laser device |