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JPS52125273A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS52125273A
JPS52125273A JP4213076A JP4213076A JPS52125273A JP S52125273 A JPS52125273 A JP S52125273A JP 4213076 A JP4213076 A JP 4213076A JP 4213076 A JP4213076 A JP 4213076A JP S52125273 A JPS52125273 A JP S52125273A
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
efficiency
face
heat radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4213076A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4213076A priority Critical patent/JPS52125273A/en
Publication of JPS52125273A publication Critical patent/JPS52125273A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To obtain a face-up system semiconductor device excelling in the efficiency of heat radiation by forming integrally a semiconductor pellet and a substrate.
COPYRIGHT: (C)1977,JPO&Japio
JP4213076A 1976-04-14 1976-04-14 Semiconductor device Pending JPS52125273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4213076A JPS52125273A (en) 1976-04-14 1976-04-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4213076A JPS52125273A (en) 1976-04-14 1976-04-14 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS52125273A true JPS52125273A (en) 1977-10-20

Family

ID=12627343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4213076A Pending JPS52125273A (en) 1976-04-14 1976-04-14 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS52125273A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61251659A (en) * 1985-04-30 1986-11-08 Koei Chem Co Ltd Production of 2-or 3-aminomethylpiperidine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61251659A (en) * 1985-04-30 1986-11-08 Koei Chem Co Ltd Production of 2-or 3-aminomethylpiperidine

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