JPS59180448U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS59180448U JPS59180448U JP7549783U JP7549783U JPS59180448U JP S59180448 U JPS59180448 U JP S59180448U JP 7549783 U JP7549783 U JP 7549783U JP 7549783 U JP7549783 U JP 7549783U JP S59180448 U JPS59180448 U JP S59180448U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- encapsulated semiconductor
- recorded
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来仕様品（ＳＣ−５９，５ＯＴ−ｆ３．９、
Ｔｏ−２３６）の斜視図、第２図は第１図の側面図であ
る。第３図は本考案の斜視図、第４図は第３図の側面図
、第５図、第６図、第８図は外部リード４本のうち１本
を他のリードと異なる形状にして容易に方向判別が出来
る様にしたものの側面図、第７図は樹脂部に凹凸の方向
゛マークを付けたものの側面図である。
１・・・・・・樹脂部、２・・・・・・外部リード、３
．３’。
３″・・・・・・異形外部リード、４・・・・・・樹脂
部の凹゛凸マーク。Figure 1 shows the conventional specification product (SC-59,5OT-f3.9,
FIG. 2 is a side view of FIG. 1. Fig. 3 is a perspective view of the present invention, Fig. 4 is a side view of Fig. 3, and Figs. 5, 6, and 8 show one of the four external leads in a shape different from the other leads. FIG. 7 is a side view of a device in which the direction can be easily determined, and FIG. 1...Resin part, 2...External lead, 3
．． 3'. 3''...Irregular external lead, 4...Concave and convex marks on the resin part.
Claims (1)
各々２本の外部リードが出ていることを特徴とする半導
体装置。 ′A resin-sealed semiconductor device, characterized in that two external leads protrude from a molded portion on each side. ′
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7549783U JPS59180448U (en) | 1983-05-20 | 1983-05-20 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7549783U JPS59180448U (en) | 1983-05-20 | 1983-05-20 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59180448U true JPS59180448U (en) | 1984-12-01 |
Family
ID=30205562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7549783U Pending JPS59180448U (en) | 1983-05-20 | 1983-05-20 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59180448U (en) |
-
1983
- 1983-05-20 JP JP7549783U patent/JPS59180448U/en active Pending
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