JPS6113943U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS6113943U JPS6113943U JP9821284U JP9821284U JPS6113943U JP S6113943 U JPS6113943 U JP S6113943U JP 9821284 U JP9821284 U JP 9821284U JP 9821284 U JP9821284 U JP 9821284U JP S6113943 U JPS6113943 U JP S6113943U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- encapsulated semiconductor
- exterior member
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は本考案の一実施例を示す樹脂封止型
半導体装置の斜視図及び側面図、第３図は第１図の半導
体装置の実装時の側面図、第４図乃至第８図は本考案の
他の各実施例を示す樹脂封止型半導体装置の斜視図であ
る。
Ａ−Ｆ・・・・・・半導体装置、１・・・・・・外装部
材、３・・・・・・凹部、４，４′・・・・・・電子部
品、９・・・・・・外装部材、１０・・・・・・凹部、
１２・・・・・・外装部材、１３，１３′・・・・・・
凹部、１５．１５’・・・・・・電子部品、１７・・・
・・・外装部材、１８・・・・・・凹部、１９・・・・
・・外装部材、２０・・・・・・凹部、２１・・・・・
・電子部品。1 and 2 are a perspective view and a side view of a resin-sealed semiconductor device showing an embodiment of the present invention, FIG. 3 is a side view of the semiconductor device of FIG. 1 when it is mounted, and FIGS. FIG. 8 is a perspective view of a resin-sealed semiconductor device showing other embodiments of the present invention. A-F... Semiconductor device, 1... Exterior member, 3... Concavity, 4, 4'... Electronic component, 9...・Exterior member, 10... recess,
12... Exterior member, 13, 13'...
Recessed portion, 15.15'...Electronic component, 17...
... Exterior member, 18 ... Recess, 19 ...
... Exterior member, 20 ... Recess, 21 ...
・Electronic parts.
Claims (1)
特徴とする樹脂封止型半導体装置。A resin-sealed semiconductor device characterized in that a recess for mounting electronic components is formed on the outer surface of an exterior member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9821284U JPS6113943U (en) | 1984-06-28 | 1984-06-28 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9821284U JPS6113943U (en) | 1984-06-28 | 1984-06-28 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6113943U true JPS6113943U (en) | 1986-01-27 |
Family
ID=30657761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9821284U Pending JPS6113943U (en) | 1984-06-28 | 1984-06-28 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6113943U (en) |
-
1984
- 1984-06-28 JP JP9821284U patent/JPS6113943U/en active Pending
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