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JPH0371655U - - Google Patents

Info

Publication number
JPH0371655U
JPH0371655U JP13320389U JP13320389U JPH0371655U JP H0371655 U JPH0371655 U JP H0371655U JP 13320389 U JP13320389 U JP 13320389U JP 13320389 U JP13320389 U JP 13320389U JP H0371655 U JPH0371655 U JP H0371655U
Authority
JP
Japan
Prior art keywords
semiconductor device
utility
lead frame
scope
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13320389U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13320389U priority Critical patent/JPH0371655U/ja
Publication of JPH0371655U publication Critical patent/JPH0371655U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図aおよびbは本考案の第1の実施例の、
第2図aおよびbは第2の実施例の夫々斜視図お
よび平面図、第3図aおよびbは従来の半導体装
置の斜視図および平面図である。 1……リード、2……吊りピン、3,3′……
アイランド、4……モールド樹脂パツケージ。
Figures 1a and b show the first embodiment of the present invention.
2A and 2B are a perspective view and a plan view, respectively, of a second embodiment, and FIGS. 3A and 3B are a perspective view and a plan view of a conventional semiconductor device. 1...Lead, 2...Hanging pin, 3,3'...
Island, 4...Mold resin package cage.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] モールド封入型パツケージを用いる半導体装置
において、半導体チツプを搭載するリードフレー
ムのアイランド部がプラスチツク樹脂で作られて
いることを特徴とする半導体装置。
A semiconductor device using a molded package, characterized in that an island portion of a lead frame on which a semiconductor chip is mounted is made of plastic resin.
JP13320389U 1989-11-15 1989-11-15 Pending JPH0371655U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13320389U JPH0371655U (en) 1989-11-15 1989-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13320389U JPH0371655U (en) 1989-11-15 1989-11-15

Publications (1)

Publication Number Publication Date
JPH0371655U true JPH0371655U (en) 1991-07-19

Family

ID=31680615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13320389U Pending JPH0371655U (en) 1989-11-15 1989-11-15

Country Status (1)

Country Link
JP (1) JPH0371655U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002342235A (en) * 2001-05-21 2002-11-29 Cognitive Research Laboratories Inc Advertisement distribution system for electronic mail
JP2006146824A (en) * 2004-11-24 2006-06-08 Osaka Univ Information display method, information display system, relay device, information display device, and computer program

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002342235A (en) * 2001-05-21 2002-11-29 Cognitive Research Laboratories Inc Advertisement distribution system for electronic mail
JP2006146824A (en) * 2004-11-24 2006-06-08 Osaka Univ Information display method, information display system, relay device, information display device, and computer program

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