JPH03128946U - - Google Patents
Info
- Publication number
- JPH03128946U JPH03128946U JP3630090U JP3630090U JPH03128946U JP H03128946 U JPH03128946 U JP H03128946U JP 3630090 U JP3630090 U JP 3630090U JP 3630090 U JP3630090 U JP 3630090U JP H03128946 U JPH03128946 U JP H03128946U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chip
- semiconductor device
- embedded
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図はこの考案の一実施例による半導体素子
を示す透視図及び断面図、第2図は従来の半導体
素子を示す透視図及び断面図である。
1は半導体チツプ、2はモールド樹脂、3はリ
ード、4はボンデイングワイヤ、5,6は金属板
である。なお、図中同一符号は同一、又は相当部
分を示す。
FIG. 1 is a perspective view and a sectional view of a semiconductor device according to an embodiment of the invention, and FIG. 2 is a perspective view and a sectional view of a conventional semiconductor device. 1 is a semiconductor chip, 2 is a molding resin, 3 is a lead, 4 is a bonding wire, and 5 and 6 are metal plates. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
において、そのチツプをモールドしている樹脂中
に金属平板を埋め込んだことを特徴とする半導体
素子。 1. A semiconductor device comprising a semiconductor chip molded with resin, characterized in that a flat metal plate is embedded in the resin molding the chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3630090U JPH03128946U (en) | 1990-04-04 | 1990-04-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3630090U JPH03128946U (en) | 1990-04-04 | 1990-04-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03128946U true JPH03128946U (en) | 1991-12-25 |
Family
ID=31542411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3630090U Pending JPH03128946U (en) | 1990-04-04 | 1990-04-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03128946U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006319014A (en) * | 2005-05-11 | 2006-11-24 | Sharp Corp | Electronic component for receiving high-frequency signal reception |
-
1990
- 1990-04-04 JP JP3630090U patent/JPH03128946U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006319014A (en) * | 2005-05-11 | 2006-11-24 | Sharp Corp | Electronic component for receiving high-frequency signal reception |
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