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JPH03128946U - - Google Patents

Info

Publication number
JPH03128946U
JPH03128946U JP3630090U JP3630090U JPH03128946U JP H03128946 U JPH03128946 U JP H03128946U JP 3630090 U JP3630090 U JP 3630090U JP 3630090 U JP3630090 U JP 3630090U JP H03128946 U JPH03128946 U JP H03128946U
Authority
JP
Japan
Prior art keywords
resin
chip
semiconductor device
embedded
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3630090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3630090U priority Critical patent/JPH03128946U/ja
Publication of JPH03128946U publication Critical patent/JPH03128946U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例による半導体素子
を示す透視図及び断面図、第2図は従来の半導体
素子を示す透視図及び断面図である。 1は半導体チツプ、2はモールド樹脂、3はリ
ード、4はボンデイングワイヤ、5,6は金属板
である。なお、図中同一符号は同一、又は相当部
分を示す。
FIG. 1 is a perspective view and a sectional view of a semiconductor device according to an embodiment of the invention, and FIG. 2 is a perspective view and a sectional view of a conventional semiconductor device. 1 is a semiconductor chip, 2 is a molding resin, 3 is a lead, 4 is a bonding wire, and 5 and 6 are metal plates. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプを樹脂でモールドした半導体素子
において、そのチツプをモールドしている樹脂中
に金属平板を埋め込んだことを特徴とする半導体
素子。
1. A semiconductor device comprising a semiconductor chip molded with resin, characterized in that a flat metal plate is embedded in the resin molding the chip.
JP3630090U 1990-04-04 1990-04-04 Pending JPH03128946U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3630090U JPH03128946U (en) 1990-04-04 1990-04-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3630090U JPH03128946U (en) 1990-04-04 1990-04-04

Publications (1)

Publication Number Publication Date
JPH03128946U true JPH03128946U (en) 1991-12-25

Family

ID=31542411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3630090U Pending JPH03128946U (en) 1990-04-04 1990-04-04

Country Status (1)

Country Link
JP (1) JPH03128946U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319014A (en) * 2005-05-11 2006-11-24 Sharp Corp Electronic component for receiving high-frequency signal reception

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319014A (en) * 2005-05-11 2006-11-24 Sharp Corp Electronic component for receiving high-frequency signal reception

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