JPS5898940A - Semiconductor element separating device - Google Patents

Abstract

PURPOSE:To separate a semiconductor element effectively from a plastic sheet without displacement of the position by adsorbing the sheet at the adsorber mounted in the cavity of a holding base. CONSTITUTION:A plastic sheet 3, to which a semiconductor wafer is bonded, divided into individual semiconductor elements 2, 2' is fixed to a holding jig. An adsorber 9 mounted in the cavity of a holding base which is horizontally movable to place the bolding jig adsorbs the sheet 3. In this case, an area which corresponds to one element is allowed to remain at the center of the adsorber 9, and a concentric adsorbing groove 10 is formed at the periphery. A lifting rod 7 which lifts only the element 2 which is moved to the center of the adsorber 9 via the sheet is provided. Then, the element 2 is adsorbed and isolated by a collet 6, but the adjacent element 2' is sucked by the sheet 3. Accordingly, the element 2' is not isolated nor displaced.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for manufacturing semiconductor elements, and more particularly to an apparatus for peeling and taking out individually divided semiconductor elements from a plastic sheet one by one.

Usually, a semiconductor wafer (hereinafter referred to simply as a wafer), in which a plurality of semiconductor elements (hereinafter simply referred to as elements) are formed in an array, is divided into individual elements and the manufacturing process of the element is carried out as follows. FIG. 1 is a top view (a) and a cross-sectional view (b) showing a state in which a sheet to which a wafer is bonded is fixed to a holding jig. In FIG. 1, a square 1 has an element 2 formed on its entire surface.

The opposite side is fixed to an adhesive plastic sheet (hereinafter simply referred to as a sheet) 3, and the sheet 3 is placed on a retaining ring 4 and secured with a presser ring 5. 1 After dividing into individual elements 2, the sheet is removed from the sheet. The individual elements are separated, taken out one by one, and mounted on the floor of an element mounting stand such as a lead frame. Figure 2 is a cross-sectional view of a conventional semiconductor device extraction device (
It is a round sectional view (b) which is an enlarged view of a) and a part thereof. Conventionally, in order to separate the element 2 from the sheet 3, a method has been used in which the element 2 is vacuum-adsorbed from above with a collet 6 and then peeled off. However, in order to peel it off from the sheet using only the negative pressure of this and that, the adhesive force of the sheet must be made to be OK, even if it is weak, and this has the disadvantage that the wafer and the sheet separate before they can be peeled off with this and that. Ta.

Therefore, the adhesive strength was strengthened. 11 Push up rod 7 from the sheet side.
A method was devised in which the element 2 was pushed up and removed from the sheet.

However, since the sheet 3 is lifted up in a conical shape as shown in FIG. 2(b), the adhesion area of the undesired adjacent elements 2' to the sheet is reduced, the adhesive strength is weakened, and the undesired adjacent elements 2' are detached or displaced. Some products come out and the manufacturing yield is poor.
It was also an obstacle to process automation.

The present invention has been made to eliminate the above-mentioned conventional drawbacks, and provides a device for taking out semiconductor elements that can reliably remove elements that have been bonded to such a degree that there is no problem in handling them from a sheet and without misalignment. It is something to do.

Next, this invention will be explained in detail using the drawings.

FIG. 3 is a cross-sectional view showing the semiconductor element extraction device of the present invention;
FIG. 4 is a partially enlarged sectional view, and FIG. 5 is an enlarged plan view of the upper surface of the suction portion. The sheet 3 to which the divided elements 2 are glued is held by a retaining ring 4 and its presser ring 5 at its outer periphery, as in the conventional case. 8
Attach to. The holding table 8 has a movement mechanism (not shown) that enables vertical and horizontal movement. Further, a suction section 9 is fixed in the cavity of the holding table 8 so that its upper surface is flush with the upper surface of the retaining ring 4 . As shown in FIG. 5, in the suction section 9, an area equivalent to one element is left in the center of the upper surface, and a concentric suction groove lO is provided around the area, and this is suctioned from the suction port 11 to form a sheet. By adsorbing the gas, it is possible to reduce the pressure inside the groove and return it to normal pressure. In addition, a vertically movable push-up rod 7 is passed through the center of the concentric groove of this suction portion 9, so that it can be pushed upward, and the push-up rod 7 is selected by moving the holding table 8 in the horizontal direction. K is set so that any element 2 can be pushed up a certain amount.

When an arbitrary element 2 selected in such a table structure moves to the center of the upper surface of the adsorption section 9.

The pressure inside the suction port 11 is reduced and the sheet 3 is suctioned. Next, push up the push-up rod 7 to push up the sheet 2 from the back side of the sheet 3,
By reducing the bonding area between the element 2 and the sheet 3, the adhesive force is weakened, and the element is easily removed by the negative pressure of the push-up rod 7, which is provided above the sheet 3 and located coaxially with the push-up rod 7. It can be removed from the seat. At this time, the sheets of the adjacent elements 2' are not pushed up because they are sucked by the suction section 9, and therefore the adjacent elements 2' are not displaced by one detachment position. Also, the range in which the sheet can be pushed up is small.

The amount of pushing up is small, and the adhesive strength of the sheet can be easily selected. After taking out the desired element in this way, the suction section is returned to normal pressure, and the holding table is moved to move on to the next ice cube.

As described above, according to the present invention, it is easy to select the sheet and adjust the amount of pushing up, and elements can be easily removed from the sheet, and since adjacent elements are not removed or moved, it can also contribute to process automation.

[Brief explanation of drawings]

Fig. 1 is a top view (a) and a cross-sectional view (b) showing a state in which a sheet to which wax is glued is fixed to a holding table Jli, and Fig. 2 is a cross-sectional view (1) showing a conventional semiconductor device extraction device.
3 is a sectional view of the semiconductor device extraction device of the present invention, FIG. 4 is a sectional view of a partially enlarged sectional view, and FIG. 5 is an enlarged sectional view of a part thereof. FIG. 3 is an enlarged plan view. 1...Semiconductor sea urchin/1.2...Semiconductor element, 2'...Adjacent semiconductor bare hand, 3...
...Plastic sheet, 4..Retaining ring, 5..Press ring, 6..Here, 7..Pushing rod, end... ...Holding stand. 9...Adsorption part, 10...Adsorption groove, 11
...Suction port.

Claims (1)

[Claims] The holding jig is mounted in a semiconductor device extraction device in which a plastic sheet or a plastic sheet to which a semiconductor sheet divided into individual semiconductor elements is glued is fixed to a holding jig, and the individual elements are adsorbed with a collet and peeled off from the plastic sheet. a horizontally movable holding table, a suction part installed in the cavity of the holding table and having suction grooves arranged concentrically on the upper surface for adsorbing the plastic or sheet; A device for taking out a semiconductor device, which is equipped with a push-up rod that moves up and down and pushes up only the device above the center through a plastic sheet.