JPS62210635A - Method and apparatus for isolating article - Google Patents

Abstract

PURPOSE:To decrease damages of individual isolated materials in isolating planar-shaped materials, by deforming a sheet at a part, to which a body to be isolated is attached, in a protruded form on the side where the body is attached, supporting the sheet, and thereafter relatively pushing up the body so as to isolate the body. CONSTITUTION:A pellet supporting part 9 is protruded toward the center of a pellet. Therefore, the pellet 2 to be isolated, is lifted up higher than neighboring pellets 2. Thus a fan shaped space facing upward is formed between the pellets 2. The center of the pellet is lifted up, and the end surface part of the pellet 2 becomes easy to be separated. A sheet 3 directly beneath the pellets 2 is sucked with vacuum in a recess part 10 and a vacuum areas 7 in a sucking jig 4 with respect to the pellet 2 to be isolated and the neighboring pellets 2. When pushing-up needles 12 are lifted, the sheet 3 is broken with the pushing-up needles 12, and only the pellet 2 is lifted up.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a technology for separating objects and a technology effective for separating plate-like objects, for example, a technology effective for separating semiconductor pellets. .

[Conventional technology]

Regarding the separation method of semiconductor wafers, see Japanese Patent Application Laid-Open No. 54-6
It is described in Publication No. 456. The outline of the process is to cut the wafer into K pieces (pellets) in which a sheet is adhered to the back surface by dicing, which produces a smooth and perpendicular surface regardless of the crystal direction of the semiconductor wafer. This is a method of picking up pellets.

[Problem that the invention seeks to solve]

The inventor used a separation method similar to that described above to
When separating semiconductor wafers (pellets), the following problems were found.

That is, when the needle is pushed up from the bottom surface of the sheet, the sheet deforms as the pellets rise, and the pellets and sheet remain in close contact with each other, making it difficult to separate the pellets.

In addition, as the pellets are pushed up to separate,
The problem is that the pellets adjacent to the pellets also rise together with the sheet, and the end faces of the pellets to be pushed up and the adjacent pellets rub against each other, resulting in damage to the pellets.

An object of the present invention is to provide a technique that allows the plate-like object to be easily separated from the sheet when separating the plate-like object stuck to the sheet.

Another object of the present invention is to provide a technique that can separate plate-like objects stuck to a sheet while reducing damage to individual separated objects when separating the plate-like objects.

The above and other objects and novel features of the present invention include:
It will become clear from the description herein and the accompanying drawings.

[Means for Solving the Problems] A brief summary of typical inventions disclosed in this application is as follows.

In other words, the vicinity of the pellet of the sheet to which the semiconductor wafer is attached, which is a plate-like object, is suctioned toward the center of the sheet with a jig that is formed in a high (convex shape) and that can suction and support the sheet. It is supported and pushed up from the jig side using a pushing up body.

[Effect]

According to the above-mentioned means, when the pellet is suction-supported by the jig through the sheet, the pellet is lifted up higher than the surrounding pellets to be separated, with the pellet in the center. Then, an upwardly fan-shaped space is created between the end face of the pellet and the surrounding pellets to be separated. Since the pellets are pushed up in this state, the pellets to be separated are less likely to come into contact with surrounding pellets, and the pellets can be separated with less damage to the pellets.

In addition, since the pellets are suction-supported through the sheet by the jig, the pellets to be separated are lifted while the sheets immediately below and in the vicinity are suctioned, and the end surface portions of the pellets tend to peel off from the sheet. Furthermore, when the sheet is pushed up by the push-up body, since the sheet is attracted to the jig, deformation of the sheet is reduced, and only the pellet can be pushed up. Therefore, the pellet can be easily separated from the sheet.

〔Example〕

FIG. 1 is a schematic cross-sectional view showing a suction jig and an object to be processed of a separation mechanism that is an embodiment of the present invention.

FIG. 2 is a perspective view showing a suction jig of a separation mechanism according to an embodiment of the present invention.

FIG. 3 is a schematic plan view of a pellet jig filling machine as an object separation processing apparatus equipped with a separation mechanism, which is an embodiment of the present invention.

FIG. 4 is a partially exploded perspective view showing the wafer, ring, and sheet after dicing.

In FIGS. 1 and 2, 1 is a wafer, which is attached to a sheet to be described later. 2 is a pellet, which forms the wafer 1. 3 is a sheet, the surface of which is coated with an adhesive material (not shown), and the wafer 1 is pasted thereon. Reference numeral 4 denotes a suction jig, which is enclosed and slightly larger than one pellet.

Reference numeral 5 denotes an outer wall, which constitutes the suction jig 4.

Reference numeral 6 denotes an inner wall that constitutes the suction jig 4. 7 is a vacuum region, which is formed by the outer wall 5 and the inner wall 6. , 8 is a vacuum hole, which is connected to a vacuum pump (not shown) and communicates with the vacuum region 7, for evacuating the inside of the vacuum region 7. 9 is a pellet support part;
It is formed integrally with the inner wall 6 in a circular shape, and its main surface is formed to bulge toward the center so that it can support the pellets 2 in a convex shape for separation. Reference numeral 10 denotes a recess, which is formed on the main surface of the pellet support section 9 in the diametrical direction thereof. This recess 10 communicates with the vacuum area 7 and is adapted to be able to vacuum the sheet 3 stuck near the center of the pellet 2 to be separated. 11
is a through hole provided in the pellet support part 9,
Two elongated holes are provided with the recess 10 in between. This through hole 11 is for a push-up needle to be described later to protrude. Reference numeral 12 denotes a push-up needle, which moves the sheet 3 from the through hole 11 by a vertical movement mechanism (not shown).
It is designed to break through and push pellet 2 up. Although only two push-up needles 12 are shown in FIG. 1, four push-up needles are provided in order to stably push up the pellet 2 in a horizontal state.

In FIG. 3, reference numeral 13 is a pellet jig packing machine, which can divide the wafer after dicing (not shown) into pellets, and store them in a jig (hereinafter referred to as pellet tray) (not shown) in an aligned manner. It is.

Note that during dicing, the wafer is attached to a sheet attached to a ring, and is processed in that state even when it is in a pellet jig filling machine.

Reference numeral 14 denotes a wafer station, in which wafers after dicing are stored in multiple stages in racks (not shown), and each rack is set. At wafer station 14,
It has an elevator mechanism (not shown) that levels the wafers one by one on a conveyance surface in order to supply the wafers one by one to a pellet separation section, which will be described later. The wafer station 14 is also capable of collecting rings and sheets after pellet separation, and serves as a loader and an unloader. Reference numeral 15 denotes a pellet separating section, which is equipped with an X-Y table (not shown) capable of positioning and fixing the wafer and also movable in the X-Y direction. This pellet separating section 15 is provided with a separating mechanism, which is an embodiment of the present invention, within its XY table so as to be movable up and down.

Reference numeral 16 denotes a wafer transfer arm, which transfers the wafer from the wafer station 14 to the pellet separating section 15, and also collects and transfers the wafer to a ring, a sheet rack, and a rack (not shown) of the wafer station 14 after pellet separation. It has become. This wafer transfer arm 1
Reference numeral 6 clamps the ring portion and is expandable and retractable in the wafer transport direction. Reference numeral 17 denotes a pellet plate loader, which stores empty pellet plates (not shown) stacked in multiple stages and is equipped with a transport claw (not shown) for transporting the lowest pellet plates one by one. . Note that the stacked pellet plates are sequentially dropped to the conveyance level by their own weight. 18 is a pellet alignment section, which separates the pellets in the pellet separation section 15,
It has the function of aligning and storing pellets in a tray. The pellet alignment section 18 is provided with an X-Y table (not shown),
The pellet tray is movable in the X-Y directions. The pellets are aligned by moving a suction arm and an XY table, which will be described later. Reference numeral 19 denotes a pellet tray unloader, which is provided with an elevator mechanism (not shown) so that pellet trays in which pellets are arranged and stored can be stored in multiple stages. Note that the pellet plate is conveyed by a pusher (not shown).

Reference numeral 20 denotes a suction arm which, after sucking up pellets to be separated in the pellet separating section 15, rotates to the pellet aligning section 18 and can store the pellets in a pellet tray. Reference numeral 21 denotes a control section, which instructs the operations of the pellet jig packing machine, such as a wafer transport system and a pellet pan transport system.

In FIG. 4, reference numeral 22 denotes a cylinder, to which the sheet 3 is attached under tension from the back side, and the wafer 1 after dicing is attached to the main surface of the sheet 3. Note that dicing is also processed in such a state.

In this example, the suction jig is cylindrical, but various shapes such as a triangular prism shape are possible depending on the shape of the object to be separated.

Furthermore, in this example, the sheet is vacuum-adsorbed, but
Adsorption methods other than vacuum adsorption may be used, and if the sheet and the object to be separated are stuck together with weak force, adsorption may be performed without adsorption.

That is, any shape may be used as long as the object to be separated can be supported at a position displaced from surrounding objects to be separated and separated.

In addition, in this example, it was applied to a pellet jig packing machine, but
It can also be applied to a direct pickup type pellet bonder (one that takes pellets directly from a wafer after dicing and performs pellet bonding as is), and there are various ways to use it.

Note that in this example, the suction jig side is raised;
The wafer side may be lowered. An embodiment of the present invention having the above-described configuration will be described below.

Waeno after dicing as shown in Figure 4) 1
are stored in multiple stages in a rack (not shown).

Next, the pellet jig packing machine 13 shown in FIG.
The entire rack is set in the wafer station 14. The wafers are leveled by an elevator mechanism (not shown), and the leveled wafers are transported to the pellet separating section 15 by the wafer transport arm 16 . The transported wafer is positioned and fixed on an X-Y table (not shown), and the pellets to be separated are placed on the second
The X-Y table is moved so that it is positioned directly above the suction jig 4 shown in the figure. Thereafter, the suction jig 4 rises and lifts the area immediately below and in the vicinity of the pellet 2 while drawing a vacuum through the sheet 3 in order to separate it. At this time, since the pellet support part 9 shown in FIG. A fan-shaped space is created towards the Further, the center portion of the pellet 2 is lifted, and the end surface portion of the pellet 2 is easily peeled off from the sheet 3. Also, in order to separate the pellet 2
, and the sheet immediately below the adjacent pellets 2 are vacuum suctioned by the recess 10 of the suction jig 4 and the vacuum area 7, respectively.

When the push-up needle 12 rises in this state, the push-up needle 12 tears the sheet 3 and lifts only the pellet 2, as shown in FIG.

Next, the separated pellets are suctioned by the suction arm 20 shown in FIG. 3, supplied from the pellet tray loader 17, and aligned in a pellet tray (not shown) waiting in the pellet alignment section 18.

Thereafter, the next pellet 2 to be separated is moved directly above the suction jig by the X-Y table, and the above-described operation is repeated. At this time, in the pellet alignment section 18, the pellet tray is also moved by the XY table, and the pellets are aligned.

When the separation of the pellets of one wafer is completed by repeating these operations, the wafer transfer arm 16 shown in FIG. are collected in the rack of the wafer station 14. Thereafter, the next wafer to be processed is leveled by an elevator (not shown) and processed in the same manner as above.

Similarly, a pellet pan full of pellets is transported to the pellet pan unloader 19 by a transport claw (not shown), while an empty pellet pan is transported to the pellet pan loader 19.
7 and set on an X-Y table (not shown) in the pellet alignment section 18.

(1) Support the center of the pellet to be separated, lift it to a higher position than the adjacent pellets, and the sheet to which the pellet is attached is sucked downward by a suction jig. As a result, a gap is formed between the pellet to be separated and the pellet adjacent to it, and the lifting of the sheet together with the pellet is reduced due to the rise of the push-up needle. Even when the pellet is being separated, the pellet can be pushed up while maintaining the gap between the pellet and the adjacent pellet.Therefore, contact with the adjacent pellet can be reduced, reducing damage to the pellet and separating the pellet. This has the effect of being able to.

(2) Separation (lifting the pellet by supporting its center part) makes it easier for the end face of the pellet to peel off from the sheet.Furthermore, since the sheet is adsorbed from the back side by a suction jig, When the pellets are pushed up with the push-up needle, the sheet is less likely to be lifted up together with the pellets, so the effect is that the pellets are more easily peeled off from the sheet.

(3) Since damage to the pellets can be reduced and pellets can be separated, yields can be improved.

(4) Since damage to the pellets can be reduced and the pellets can be separated, it is possible to perform an external appearance inspection to inspect the pellets for scratches, etc., not by inspecting all the pellets but by sampling them.

(5) Since the pellets are more easily peeled off from the sheet, the pellet jig packing machine has the effect of reducing manual work associated with poor peeling.

(6) Since the pellets are more easily peeled off from the sheet, the pellet jig packing machine has the effect of improving the operating rate.

(7) When applied to a direct pick amplifier type pellet bonder, pellet separation defects can be reduced.
The effect is that the operating rate is improved.

(8) When applied to a direct pickup type pellet bonder, it reduces chipping of pellets,
Since pellet bonding is possible, the assembly yield can be improved.

Although the invention made by the present inventor has been specifically explained above based on Examples, the present invention is not limited to the above-mentioned Examples, and can be modified in various ways without departing from the gist thereof.

In the above explanation, the invention made by the present inventor was mainly applied to the technology for assembling semiconductor devices, which is the background field of application, but the invention is not limited to this. The object that has been
It can be applied to anything that can be separated.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

That is, when an object pasted on a sheet is separated from the sheet, it can be separated without damaging the object.

Furthermore, the object tends to peel off from the sheet when it is separated.

[Brief explanation of drawings]

FIG. 1 is a schematic sectional view showing a suction jig and an object to be processed in a separation mechanism that is an embodiment of the present invention, and FIG. FIG. 3 is a schematic plan view of a pellet jig packing machine as an object separation processing apparatus equipped with a separation mechanism according to an embodiment of the present invention; FIG. 4 is a perspective view showing the pellets after dicing. FIG. 2 is a partially exploded perspective view showing a wafer, a ring, and a sheet. 1... Wafer, 2... Pellet (object), 3...
・Sheet, 4... Suction jig (jig), 5... Outer wall,
6...Inner wall, 7...Vacuum area, 8...Vacuum extraction hole, 9
... Pellet support portion, 10... Recess, 11... Penetration opening, 12... Push-up needle (push-up body), 13...
・Bellet jig packing machine, 14... Wafer station, 15... Pellet separation section, 16... Wafer transfer arm, 17... Belen) plate 0-1", 18... Pellet alignment section , 19... Pellet dish unloader, 20
...Adsorption arm, 21...Control unit, 22...Ring. Figure 3 @ Figure 4

Claims (1)

[Claims] 1. An object separation method for separating an object pasted on a sheet from the sheet, wherein the object is pasted on a portion of the sheet where the object to be separated is pasted. A method for separating an object, which comprises deforming the object into a convex shape and supporting it, and then pushing the object up relatively to separate it. 2. The method for separating an object according to claim 1, wherein the object is a semiconductor pellet. 3. An object separation and processing device that separates and processes an object pasted on a sheet from the sheet, which includes a jig that deforms the sheet into a convex shape toward the side where the object is pasted, and a push-up device that pushes up the object. An object separation and processing device characterized by having a body. 4. The object separation processing apparatus according to claim 3, wherein the object is a semiconductor pellet.