JPS5613731A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5613731A JPS5613731A JP8828179A JP8828179A JPS5613731A JP S5613731 A JPS5613731 A JP S5613731A JP 8828179 A JP8828179 A JP 8828179A JP 8828179 A JP8828179 A JP 8828179A JP S5613731 A JPS5613731 A JP S5613731A
- Authority
- JP
- Japan
- Prior art keywords
- etched
- protective film
- mesa
- constitution
- stages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 230000001681 protective effect Effects 0.000 abstract 3
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract 1
- 229960002050 hydrofluoric acid Drugs 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229910017604 nitric acid Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
Abstract
PURPOSE:To prevent the cutting at stages of a protective film of a mesa upper end by a method wherein the whole surface of the surface of a substrate is etched before forming the protective film for the surface. CONSTITUTION:The whole surface of a wafer to which a mesa is formed is etched by a liquid, whose principal ingredients are nitric acid and fluoric acid, thickness it is etched, an SiO2 protective film 4 is formed, a resist mask is coated, and a window is opened. According to this constitution, since the corners of a mesa upper end portion are previously etched, the SiO2 film is not cut at stages, and the fixed electrode window can be formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8828179A JPS5613731A (en) | 1979-07-13 | 1979-07-13 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8828179A JPS5613731A (en) | 1979-07-13 | 1979-07-13 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5613731A true JPS5613731A (en) | 1981-02-10 |
Family
ID=13938509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8828179A Pending JPS5613731A (en) | 1979-07-13 | 1979-07-13 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5613731A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114639598A (en) * | 2022-05-10 | 2022-06-17 | 晶芯成(北京)科技有限公司 | Method for manufacturing semiconductor structure |
-
1979
- 1979-07-13 JP JP8828179A patent/JPS5613731A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114639598A (en) * | 2022-05-10 | 2022-06-17 | 晶芯成(北京)科技有限公司 | Method for manufacturing semiconductor structure |
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