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JPS5463843A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS5463843A
JPS5463843A JP13126177A JP13126177A JPS5463843A JP S5463843 A JPS5463843 A JP S5463843A JP 13126177 A JP13126177 A JP 13126177A JP 13126177 A JP13126177 A JP 13126177A JP S5463843 A JPS5463843 A JP S5463843A
Authority
JP
Japan
Prior art keywords
tantalum boride
resistor
thermal head
thin film
prepared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13126177A
Other languages
Japanese (ja)
Other versions
JPS6016083B2 (en
Inventor
Akira Niimi
Toshitami Hara
Masahisa Fukui
Yoshiaki Shirato
Yoshiki Hajimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP52131261A priority Critical patent/JPS6016083B2/en
Priority to US05/906,359 priority patent/US4296309A/en
Priority to DE19782821950 priority patent/DE2821950A1/en
Publication of JPS5463843A publication Critical patent/JPS5463843A/en
Priority to US06/552,013 priority patent/US4545881A/en
Publication of JPS6016083B2 publication Critical patent/JPS6016083B2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006Thin film resistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Adjustable Resistors (AREA)
  • Electronic Switches (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To make a thermal head difficult to be oxidized and to stabilize the resistanece by using a tantalum boride as a thin film exothermic resistor. CONSTITUTION:A substrate 1 such as ceramic glass, which is prepared by the heat treatment at 200 to 500 deg.C, is formed with a thin film exothermic resistor 2 of tantalum boride in the atmosphere of Ar of 1X10<-3> to 5X10<-1>(preferably, 1X10<-2> to 1X10<-1>) Torrs by the sputtering method using a target which is prepared by sintering tantalum boride in advance at a temperature higher than 1100 deg.C through the vacuum hot press, followed by the heat treatment at 200 to 650 deg.C. An electric conductor 3 for supplying electricity to the resistor 2 is further formed there on, and a protecting layer such as SiO2 is then formed by the vacuum evaporation and sputtering method using electron beams.
JP52131261A 1977-05-19 1977-10-31 thermal head Expired JPS6016083B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP52131261A JPS6016083B2 (en) 1977-10-31 1977-10-31 thermal head
US05/906,359 US4296309A (en) 1977-05-19 1978-05-15 Thermal head
DE19782821950 DE2821950A1 (en) 1977-05-19 1978-05-19 Head for thermal printing with stable resistance - obtd. by sputtering a metal boride resistance heating element onto a glazed substrate
US06/552,013 US4545881A (en) 1977-05-19 1983-11-16 Method for producing electro-thermal transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52131261A JPS6016083B2 (en) 1977-10-31 1977-10-31 thermal head

Publications (2)

Publication Number Publication Date
JPS5463843A true JPS5463843A (en) 1979-05-23
JPS6016083B2 JPS6016083B2 (en) 1985-04-23

Family

ID=15053779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52131261A Expired JPS6016083B2 (en) 1977-05-19 1977-10-31 thermal head

Country Status (1)

Country Link
JP (1) JPS6016083B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112789420A (en) * 2018-11-29 2021-05-11 Nok株式会社 Sealing device
US11105374B2 (en) 2016-04-12 2021-08-31 Ntn Corporation Rolling bearing unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6414988U (en) * 1987-07-16 1989-01-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11105374B2 (en) 2016-04-12 2021-08-31 Ntn Corporation Rolling bearing unit
CN112789420A (en) * 2018-11-29 2021-05-11 Nok株式会社 Sealing device

Also Published As

Publication number Publication date
JPS6016083B2 (en) 1985-04-23

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