JPH11191540A - Dicing method for solid material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a dicing method in which a generated compound is hard to deposit, by a method wherein, when cutting and working operation of a solid material is performed by a dicing operation, an interfacial active agent is deposited on the surface of the solid material. SOLUTION: A dicing sheet is constituted of two layers, i.e., of an adhesive layer 2 and of a base material 3. A solid material 1 to be diced is pasted on the upper part of the adhesive layer 2, and the adhesive layer 2 is coated with a interfacial active agent 4. Then, by using a dicing apparatus, the solid material 1 is cut fully by a dicing blade 5, and solid chips are formed. Then, the interfacial active agent 4 and a generated compound 8 on the surface of every solid chip 6 are washed away by cleaning wafer 7. Then, a visual inspection is performed, a defective product due to dust particles on the surface of every solid chip 6 and due to the deposition of the generated compound 8 is detected, and a bad mark 9 is put on the defective product. In addition, before the solid material 1 is bonded to the dicing sheet, the solid material 1 may be coated with the interfacial active agent 4 in advance, or the interfacial active agent 4 may be mixed with cutting water used in a dicing operation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for treating a solid material using a dicing sheet in a dicing process technology.

[0002]

2. Description of the Related Art FIGS. 1A to 1G are views showing a conventional dicing process, and FIGS. 1H, 1I and 1J.
(K) is a diagram showing the state of adhesion of dust, generated compounds, and the like on the surface of the solid chip in FIGS. 1 (d), (e), (f), and (g).

As shown in FIG. 1A, the dicing sheet is composed of an adhesive layer 2 and a base material 3, and a solid material 1 to be diced on the adhesive layer 2 is formed as shown in FIG. 1B. to paste together. Next, as shown in FIG. 1C, the solid material 1 is fully cut by a dicing blade 5 using a dicing device as shown in FIG. 1D to form a solid chip 6. Next, as shown in FIG. 1 (e), the generated compound 8 (FIG. 1 (h)) on the surface of the solid chip 6 is washed away with the washing water 7. Then, as shown in FIGS. 1 (f) and 1 (i), an appearance inspection is performed to detect dust on the surface of the solid chip 6, adhesion of the generated compound 8 or chip chipping, and defective products due to cracks 10.
Bad marks 9 are applied to defective products as shown in FIGS. The solid chip 6 is formed by using such a dicing process.

[0004]

In the conventional method using a dicing process, when the solid material 1 is fully cut to form the solid material 6, the dicing of the adhesive layer 2 and the base material 3 is performed by cutting a dicing sheet. The product compound 8 as garbage is generated.

[0005] Since the resulting compound 8 has adhesiveness, it is easily bound to the dicing blade 5, thereby reducing the cutting ability of the dicing blade 5, and eventually causing chipping of the solid chip 6 and generation of cracks 10. In addition, there arises a problem that the life of the dicing blade 5 is shortened.

Further, since the produced compound 8 is very easily attached to the surface of the solid chip 6, washing with the washing water 7 is often insufficient, and as a result, a defective product is produced by an appearance inspection and the yield is reduced. There is also a problem such as inviting.

[0007] The present invention has been made to solve the above-mentioned problems, and has as its object to provide a method which is less likely to adhere a produced compound than conventional methods.

[0008]

According to a solid material dicing method according to the present invention (claim 1), when a solid material is cut by dicing, a surfactant is attached to the surface of the solid material. Achieve the above objectives.

The solid material dicing method according to the present invention (claim 2) includes a step of bonding a solid material to a dicing sheet; a step of applying a surfactant to a surface of the solid material bonded to the sheet; The above object is achieved by having at least a step of dicing a solid material and a step of washing a solid chip, wherein the surfactant is removed by the washing step.

[0010] In the solid material dicing method according to the present invention (claim 3), a step of applying a surfactant to one principal surface of the solid material, and a step of dicing the other surface of the solid material coated with the surfactant into a dicing sheet A step of bonding the solid material, a step of dicing the solid material, and a step of washing the solid chip, wherein the washing step removes the surfactant, To achieve.

As a method of applying a surfactant to a solid material, it is preferable to drop the surfactant using a dropper, a nozzle or the like.

The solid material dicing method according to the present invention (claim 4) includes at least a step of attaching a solid material to a dicing sheet, a step of dicing the solid material, and a step of washing a solid chip. The object is achieved by mixing a surfactant into the cutting water used in the dicing step and removing the surfactant by the washing step.

Here, the amount of the surfactant mixed into the cutting water is appropriately set according to the situation.

Further, even when a surfactant is mixed in cutting water, the surfactant may be applied to a solid material in advance.

The above object is achieved by the solid material according to the present invention (claim 5) having a laminated structure of one or more of a glass material, a semiconductor material, a dielectric material, and a metal material. .

Here, the surfactant is preferably one which can be easily removed by city water used for washing, and more preferably a commercially available neutral detergent for household use.

The operation of the present invention will be described below. As in the present invention, by attaching a surfactant to the surface of a solid material with which the dicing blade contacts, a film of the surfactant is formed on the surface of the dicing blade as well as the solid material, and a sticky product compound is bound. It becomes difficult to do. Therefore, chipping and cracking of solid chips can be reduced, and the cutting accuracy, cutting life,
It is possible to improve the cutting speed. Also,
The adhesion of the produced compound on the surface of the solid chip is also reduced.

Further, by removing the surfactant from the solid chip in a subsequent washing step, the surfactant does not affect the performance of the solid chip at all.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIGS. 2A to 2G are views showing a dicing process according to the present invention, and FIGS. 2H, 2I and 2J.
(K) is a diagram showing the state of adhesion of dust, generated compounds and the like on the surface of the solid chip in FIGS. 2 (d), (e), (f) and (g), respectively.

As shown in FIG. 2A, the dicing sheet is composed of two layers of an adhesive layer 2 and a base material 3, and a solid material 1 to be diced on the adhesive layer 2 is formed as shown in FIG. 2B. After bonding, a surfactant 4 is applied on the adhesive layer 2. Next, as shown in FIG. 2 (c), the solid material 1 is
The solid chip 6 is formed by full cutting as shown in FIG.
Next, as shown in FIG. 2E, the surfactant 4 and the generated compound 8 (FIG.
(H) Wash off. Then, as shown in FIGS. 2 (f) and 2 (i), appearance inspection is performed to detect dust on the surface of the solid chip 6 and a defective product due to adhesion of the generated compound 8, and FIGS.
A bad mark 9 is applied to the defective product as shown in FIG. The solid chip 6 is formed by using such a dicing process.

Here, a commercially available neutral detergent for household use was used as the surfactant.

In the present embodiment, the surfactant is applied to the solid material adhered to the dicing sheet. However, the present invention is not limited to this. May be applied, or a surfactant may be applied to cutting water used at the time of dicing.

As the solid material, any one of a glass material, a semiconductor material, a dielectric material, and a metal material or a laminated material of a plurality of kinds can be used.

[0025]

According to the present invention, the surface of a solid material is protected by a surfactant during dicing, thereby reducing chipping and cracking of a solid chip, improving the life and cutting speed of a dicing blade, and cutting. Accuracy and cutting ability are improved. In addition, adhesion of the generated compound on the surface of the solid chip is reduced. Therefore, cost reduction and man-hour reduction can be achieved by improving the yield of the dicing process.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a conventional example.

FIG. 2 is a diagram for explaining one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solid material 2 Adhesive layer 3 Substrate 4 Surfactant 5 Dicing blade 6 Solid chip 7 Washing water 8 Generated compound 9 Bad mark 10 Crack, chipping

Claims (5)

[Claims] 1. A dicing method for a solid material, wherein a surface active agent is attached to the surface of the solid material when cutting the solid material by dicing. 2. A step of bonding a solid material to a dicing sheet, a step of applying a surfactant to a surface of the solid material bonded to the sheet, a step of dicing the solid material, and a step of dicing the solid material The method according to claim 1, further comprising at least a step of washing (hereinafter, a solid chip), wherein the surfactant is removed by the washing step. 3. A step of applying a surfactant to one main surface of the solid material, a step of attaching the other surface of the solid material to which the surfactant is applied to a dicing sheet, and a step of dicing the solid material The solid material dicing method according to claim 1, further comprising: at least a step of washing the solid chip, wherein the surfactant removes the surfactant by the washing step. 4. A step of attaching a solid material to a dicing sheet, a step of dicing the solid material, and a step of washing a solid chip, wherein the cutting water used in the dicing step is 2. The method according to claim 1, further comprising mixing a surfactant and removing the surfactant by the washing step. 3. 5. The semiconductor device according to claim 1, wherein the solid material has a laminated structure of one or more of a glass material, a semiconductor material, a dielectric material, and a metal material.
Or the dicing method for a solid material according to any of 4.