JPS5992544A - Jig for cleaning and drying operation - Google Patents
Jig for cleaning and drying operationInfo
- Publication number
- JPS5992544A JPS5992544A JP57202135A JP20213582A JPS5992544A JP S5992544 A JPS5992544 A JP S5992544A JP 57202135 A JP57202135 A JP 57202135A JP 20213582 A JP20213582 A JP 20213582A JP S5992544 A JPS5992544 A JP S5992544A
- Authority
- JP
- Japan
- Prior art keywords
- jig
- wafer
- pellet
- cleaning
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
Description
【発明の詳細な説明】
本発明に、牛導体つェハｒ保持し、洗浄、乾燥ケ行う治
具でめり、主として、ダイシング（完全９１断又は数十
μｍの埋さに切残しｉｔを装丁不完全切断）さｎたウェ
ハを対象とする治具に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention mainly involves dicing (complete 91-cut or embedding several tens of micrometers with uncut parts). The present invention relates to a jig for cutting wafers with incomplete binding (incomplete cutting).
中導体ウェハをペレタイズするにあたり行なうダイシン
グにあっては、ウェハ厚さの２７３根度切込む溝を入れ
る不完全切断と、粘着テープ（シート）をウェハ裏向に
貼付後、完全切断を行う方式がめる。この際、両切断と
もに切削屑が発生し、ウェハ表面に付層するため、ダイ
シング後には洗浄、乾燥全行なわなくてはならない。The dicing process used to pelletize medium-conductor wafers involves incomplete cutting, in which a groove is cut 273 times the thickness of the wafer, and complete cutting after applying an adhesive tape (sheet) to the back of the wafer. . At this time, cutting waste is generated in both cuts and is deposited on the wafer surface, so cleaning and drying must be carried out after dicing.
洗浄、乾燥方法は不完全切断用として超音波を印加し、
切削屑を除外する超音波洗浄、乾燥と、高圧純水をウェ
ハ表面に噴きつけるジェット洗浄。The cleaning and drying method involves applying ultrasonic waves for incomplete cutting.
Ultrasonic cleaning and drying to remove cutting debris, and jet cleaning that sprays high-pressure pure water onto the wafer surface.
乾燥の２方法があるが、完全切断用として上記２方法を
その１１使用するのは非常に困難である。There are two drying methods, but it is very difficult to use the above two methods for complete cutting.
丁なわち、完全切断後のウェハは、丁でにウェハの形態
をとらず１つ１つのペレットの群れとなって粘着テープ
に固定さｎている（しかし、説明の便宜上置にウェハと
呼ぶ）、この状態は非常に不安？であり、ウェハとして
の平板状を保っていない。このため、高圧ジェット洗浄
方法でに自動搬送、収納及び洗浄時にウェハ真空吸着機
構を用いるが、この機Ｗ＃はウェハが平板状でなければ
使用できず、完全切断を行ったウェハ、丁なわち、平板
状をなしていないものは適用小町である。、また、超音
波洗浄方法も前方法と同様にウエノ・を平板状に保って
おかないと、隣接ペレットと干渉を起こし、割ｎ、欠は
不良が発生する。In other words, the wafer after being completely cut does not take the form of a wafer, but instead is a group of individual pellets that are fixed to the adhesive tape (however, for convenience of explanation, they are called wafers). , this condition is very disturbing? Therefore, it does not maintain a flat shape as a wafer. For this reason, the high-pressure jet cleaning method uses a wafer vacuum suction mechanism during automatic transport, storage, and cleaning, but this machine W# cannot be used unless the wafer is flat; , those that do not have a flat plate shape are applicable small towns. In addition, in the ultrasonic cleaning method, as with the previous method, if the Ueno pellets are not kept in a flat shape, interference with adjacent pellets will occur, resulting in defects such as cracks and chips.
つ１）、従来完全切断後のウェハの洗浄、乾燥の技術が
確立していないため完全切断の通用が進められない。不
完全切断でに、この洗浄、乾燥後、１つ１つのペレット
にするため分割する作業がある。これは、ウェハの上を
テフロンのローラーで押しながらころが丁作業であるが
、この時に、ペレットの割れ、欠は不艮が発生する。ま
た、このペレットは人手にニジ、ベレント整列治具皿に
真空ビンセットを用いて１つ１つ詰めてｈるため大巾な
工数１人手をついやしで偽る。また、その後の組立１根
では、上記のペレット整列治具皿をペレット付機に供給
する方式と不完全切断層、粘着テープを、ウェハ裏面に
貼付し、リング構造の治具に固定し、ペレット付機に供
給するダイレクトピックアップペレット付方式とあり、
後方式は、ペレット整列治具詰め作業を目的としてｈる
が小児全切断においては、切残し部分が８１（シリコン
）のへき開件の為パリ状鮨となる。こｎがペレット付の
ピンクアップ時に隣接ペレットと干渉を起こし、割れ欠
は不艮が発生する。この方式であると上記問題があるた
め、限定さｎたものについてしか、このペレット付方式
は行なわれていない。1) Conventionally, the technology for cleaning and drying wafers after complete cutting has not been established, so complete cutting cannot be implemented. After incomplete cutting, after washing and drying, there is a step of dividing the pellets into individual pellets. This is done by pressing the top of the wafer with a Teflon roller, but at this time, the pellets may crack, chip, or fail. In addition, the pellets are packed one by one into the Berendt alignment jig tray using a vacuum bottle set, which requires a large amount of man-hours. In addition, in the subsequent first assembly, the method of feeding the above-mentioned pellet alignment jig plate to the pelletizing machine, the incompletely cut layer, and the adhesive tape are pasted on the back side of the wafer, fixed to a ring-structured jig, and the pellets are There is a method with direct pickup pellets that are supplied to the attaching machine.
The latter method is used for the purpose of pellet alignment jig filling work, but in the case of complete cutting of children, the uncut portion is cleaved at 81 (silicon), resulting in crispy pieces. This causes interference with adjacent pellets when pinking up with pellets, resulting in cracks and failure. Since this method has the above-mentioned problems, this pellet attachment method is only used for a limited number of products.
本発明の目的は、半導体ウェハをダイシングによって、
７、全切断する製造システムの採用が可能となる半導体
ウニ・・の洗浄、乾燥治具全提供することにある。The purpose of the present invention is to process a semiconductor wafer by dicing it.
7. We provide all cleaning and drying jigs for semiconductor sea urchins that enable the adoption of a manufacturing system that involves complete cutting.
このような目的を達成するために本発明に、ペレット群
を上面に貼着したテープを支持する板状の治具であって
、この治具に前記各ペレットの略中央に対応する位Ｉｔ
Ｋ真空吸着孔が穿たれているものであって、以下、実飽
列に１夛本発明を説明する。In order to achieve such an object, the present invention provides a plate-shaped jig for supporting a tape on which a group of pellets is attached, and a plate-like jig is provided at a position corresponding to approximately the center of each pellet.
The present invention will be described below in terms of a real saturation series.
第１図に本発明の一実施圀による洗浄、乾燥治具（以下
、治具とも称丁。）を示す刷視図、第２図に同じくウエ
ノ１状ペレット群を貼着したテープ奮ハｙり付ける状態
を示す州視図、第３図に本発明の治具１ｃよってウエノ
１状ベレット群を洗浄、乾燥する状態を示す概略平向図
である。Fig. 1 is a printed view showing a cleaning and drying jig (hereinafter also referred to as the jig) according to one embodiment of the present invention, and Fig. 2 is a drawing showing a tape assembly to which a group of Ueno 1-shaped pellets is attached. FIG. 3 is a schematic plan view showing a state in which a group of wafer pellets is washed and dried using the jig 1c of the present invention.
ダイシングに工って完全切断されたウエノ１（正侭にば
ウェハ形態のペレット群でめるが、前述のように説明の
便宜上ｊｐｌＣウエノ・とも称丁。）を洗浄、乾燥する
治具１に第１図に示す工うに、厚さＩＷ程度のプラスチ
ック、テフロンあるいに金属の円板２からなるとともに
、ウニ／−径３と同一の範囲内でかつ各ペレット４の中
央部に対応する位置に穿った０、 ７ ａｍφ程度の真
空吸着孔５群とからなっている。この治具１には完全切
断したウエノ１６を上面に貼り付けた円板状のテープ７
が載ぜらｎる。この際、ウエノ１６の各ペレット４が前
記真空吸着孔５の真上に位置するように載せる。この際
、あらかじめ、テープ（粘着テープ）７の裏面又は円板
２上に水滴を付けておく、すると、テープ７をのせるだ
けで水の表面張力によってテープ７は確実に固定される
。この治具１の貼付により、完全切断されたウエノ）６
は、円板２によって、平板状に保たれる。A jig 1 is used to clean and dry the waeno 1 (which is usually made up of wafer-shaped pellets, but as mentioned above, for convenience of explanation, it is also referred to as jplc ueno), which has been completely cut by dicing. The sea urchin shown in FIG. 1 consists of a disk 2 of plastic, Teflon, or metal with a thickness of about IW, and is located within the same range as the sea urchin diameter 3 and corresponding to the center of each pellet 4. It consists of 5 groups of vacuum suction holes of about 0.7 amφ drilled in the hole. This jig 1 has a disc-shaped tape 7 with a completely cut Ueno 16 pasted on the top surface.
is listed. At this time, each pellet 4 of Ueno 16 is placed directly above the vacuum suction hole 5. At this time, if a drop of water is placed on the back surface of the tape (adhesive tape) 7 or on the disc 2 in advance, then just by placing the tape 7 on it, the tape 7 will be securely fixed by the surface tension of the water. By pasting this jig 1, the wafer was completely cut) 6
is kept flat by the disk 2.
そこで、第３図に示すように高圧ジェット洗浄乾燥方法
で完全切断ウェハ７を洗浄、乾燥する。Therefore, as shown in FIG. 3, the completely cut wafer 7 is cleaned and dried using a high-pressure jet cleaning and drying method.
治具１に供給部８．自動搬送部９．洗浄乾燥部１０自動
搬送部１１．収納部１２と連続動作する。洗浄乾燥部１
０でに真空吸着機構の真空が治具１の真空吸着孔５を介
して各ペレット４に作用して確実にペレット４を保持す
るため、テープに固定された完全切断ウェハ６は良好に
洗浄・乾燥が施される。Supply section 8 to jig 1. Automatic transport section9. Washing/drying section 10 Automatic transport section 11. It operates continuously with the storage section 12. Washing and drying section 1
Since the vacuum of the vacuum suction mechanism acts on each pellet 4 through the vacuum suction hole 5 of the jig 1 and securely holds the pellet 4 at zero, the completely cut wafer 6 fixed to the tape can be cleaned and cleaned well. Drying is applied.
このような実施列によれば、治具１とウェハ６に真空吸
着及びその表面張力により、確実に固定されているので
、洗浄、乾燥処理中にはずれることになく、供給、自動
搬送、収納においてもはずれることにない。この治具１
に、円板２の大きさが供給、自動搬送、収納が容易にで
きる大きさであり、真空吸着孔５は、洗浄、乾燥部１０
で治具ｌを弁して粘着テープ７を真空吸着するためであ
る。このことから円板２の大きさ、材質、真空吸着孔５
の大きさ、孔数は任意に選定できる。洗浄。According to this implementation, the jig 1 and the wafer 6 are securely fixed by vacuum suction and their surface tension, so they do not come off during cleaning and drying processes, and can be easily used during supply, automatic transportation, and storage. It won't come off either. This jig 1
In addition, the size of the disk 2 is large enough to facilitate feeding, automatic transportation, and storage, and the vacuum suction hole 5 is large enough to facilitate cleaning and drying section 10.
This is to vacuum-adsorb the adhesive tape 7 by activating the jig 1. From this, the size and material of the disc 2, the vacuum suction hole 5
The size and number of holes can be selected arbitrarily. Washing.
乾燥後、上記治具１を取外下と＠は、粘着テープ７の９
！ｉｉ？：もち上ける碌におこぜば簡単ににずれる。After drying, remove the jig 1 and apply adhesive tape 7 to 9.
! ii? : If you raise it to a strong point, it will easily shift.
以上、実施列で説明した本発明の治具によれば、治具の
円板部に半導体ウェハと粘着テープを板状に保持する。According to the jig of the present invention described in the embodiments above, the semiconductor wafer and the adhesive tape are held in a plate shape on the disk portion of the jig.
また真空吸着孔は、洗浄、乾燥時に確実にウェハ（ペレ
ット群）を真空吸着全行う。Further, the vacuum suction holes ensure that the wafer (pellet group) is fully vacuum suctioned during cleaning and drying.
１之、ウェハにわずかな７Ｘ簡で治具に固定されること
もあって洗浄、乾燥中および鍜送中轡にはずれることが
ない。1. Since the wafer is fixed to the jig with a slight 7X fixation, it will not come off during cleaning, drying, and feeding.
したがって、本発明の治具を用いれば、冒圧ジェット洗
浄方法で洗浄、乾燥を行なえる。Therefore, by using the jig of the present invention, cleaning and drying can be performed using the high-pressure jet cleaning method.
１だ、本発明によれば完全切断ダイシングの量産適用化
に、従来洗浄、乾燥方法が確立していないため進められ
なかったが、本発明の治具によって、不完全切断ウェハ
と同様に、同一装置で容置に行なえることができ、完全
切断ダイシングの量産が行なえる。これにより不完全切
断方法に採用しなくとも工くなシ、溝入れ切断後の分割
作業が廃止できるため、この分割作業時のペレットの割
１−欠は不艮がなくなり、歩留シ向上が図れる。1. According to the present invention, it was not possible to apply fully cut dicing to mass production due to the lack of established cleaning and drying methods. It can be carried out in a container with the equipment, and mass production of complete cutting and dicing can be performed. As a result, there is no need to use an incomplete cutting method, and the dividing work after grooving and cutting can be eliminated, so there is no problem with pellets being broken or missing during this dividing work, and the yield is improved. I can figure it out.
さらに、ダイレクトピックアップ方式を取り入れたペレ
ット付の時ダイシング方法が溝入れ切断である場合、ピ
ンクアップ時のペレットの欠は不艮が発生している次め
限定されていたが、本発明のように完全切１１！ｌ？適
用することで、ダイレクトピックアンプペレット付が容
易に可能となり、歩留り向上が図れる。Furthermore, when dicing with pellets that incorporates a direct pick-up method, when the dicing method is groove cutting, the loss of pellets during pink-up is limited to the extent that discoloration occurs, but as in the present invention, Complete cut 11! l? By applying this method, direct pick amplifier pellet attachment can be easily achieved and yields can be improved.
また、本発明の治具を用い九製造系でにペレット治具詰
め作業、及びペレット整列治具が不要となるため、大巾
な１斂、コスト低減が図ｎる。Furthermore, using the jig of the present invention eliminates the need for pellet jig packing work and pellet alignment jig in a manufacturing system, resulting in a significant cost reduction.
以上のように、本発明は、顕著な効果を奏するものであ
る。As described above, the present invention has remarkable effects.
本発明に、上記実施例に駆足されるものでない。The present invention is not limited to the above embodiments.
例えば、本発明の治具に、完全切断ダイシングを行う前
からウエノ１に固定し、その後、ダイジググー洗浄、乾
燥とすることができる。又、溝入れ切断ダイシングでも
上記同様に洗浄、乾燥で本発明の治具を用いることがで
きるっFor example, the jig of the present invention can be fixed to the wafer 1 before complete cutting and dicing, and then washed and dried. Additionally, the jig of the present invention can be used for grooving, cutting, and dicing by cleaning and drying in the same manner as described above.
第１図に本発明の一実施例による洗浄、乾燥治具を示す
州視図、
第２図に同じくペレット群を貼着したテープをＩｌｖり
付ける状態を示す廁視図、
第３図に同じく治具を用込てテープを洗浄、乾燥する状
態ケ示す概略平面図である。
１・・・治具、２・・・円板、４・・・ペレット、５・
・・真空成層孔、６・・・完全切断ウエノ１．１・・・
テープ、８・・・供給部、９．１１・・・自動搬送部、
ｌＯ・・・洗浄乾燥部、１２・・・収納部。
第 １ 図
第 ２ 図FIG. 1 is a perspective view showing a cleaning and drying jig according to an embodiment of the present invention, FIG. FIG. 3 is a schematic plan view showing a state in which a tape is cleaned and dried using a jig. 1... Jig, 2... Disc, 4... Pellet, 5...
...Vacuum layered hole, 6...Completely cut Ueno 1.1...
Tape, 8... supply section, 9.11... automatic conveyance section,
lO: Washing/drying section, 12: Storage section. Figure 1 Figure 2
Claims (1)
の治具であって、この治具は前記各ペレットの略中夫に
対応する位置に真空吸着孔が穿たれていることｒ待機と
する洗浄、乾燥用治具。1. A plate-shaped jig that supports the tape attached to the upper surface of the pellet group, and this jig must have vacuum suction holes drilled at positions approximately corresponding to the cores of each pellet. Cleaning and drying jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57202135A JPS5992544A (en) | 1982-11-19 | 1982-11-19 | Jig for cleaning and drying operation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57202135A JPS5992544A (en) | 1982-11-19 | 1982-11-19 | Jig for cleaning and drying operation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5992544A true JPS5992544A (en) | 1984-05-28 |
Family
ID=16452534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57202135A Pending JPS5992544A (en) | 1982-11-19 | 1982-11-19 | Jig for cleaning and drying operation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5992544A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6231137A (en) * | 1985-08-02 | 1987-02-10 | Matsushita Electric Ind Co Ltd | Dice bonding device |
| JP2018006395A (en) * | 2016-06-28 | 2018-01-11 | 株式会社ディスコ | Transport method |
-
1982
- 1982-11-19 JP JP57202135A patent/JPS5992544A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6231137A (en) * | 1985-08-02 | 1987-02-10 | Matsushita Electric Ind Co Ltd | Dice bonding device |
| JP2018006395A (en) * | 2016-06-28 | 2018-01-11 | 株式会社ディスコ | Transport method |
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