JPS6387843U - - Google Patents
Info
- Publication number
- JPS6387843U JPS6387843U JP18106686U JP18106686U JPS6387843U JP S6387843 U JPS6387843 U JP S6387843U JP 18106686 U JP18106686 U JP 18106686U JP 18106686 U JP18106686 U JP 18106686U JP S6387843 U JPS6387843 U JP S6387843U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- insulating tape
- semiconductor device
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000000465 moulding Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示すリードフレーム
の部分裏面図、第２図は本考案のリードフレーム
を用いたＩＣチツプのモールド時の樹脂の流れを
示す断面図、第３図は従来のリードフレームの部
分平面図、第４図は従来のＩＣチツプのモールド
時の樹脂の流れを示す断面図である。
１……リードフレームのアイランド部、２……
リードフレームのインナーリード部、３……リー
ドフレームのアウターリード部、１１……モール
ド金型、１２……モールド樹脂の注入口、１３…
…ワイヤ、１４……ＩＣチツプ、２１……絶縁性
のテープ、２２……樹脂の流れ。
Fig. 1 is a partial back view of a lead frame showing an embodiment of the present invention, Fig. 2 is a sectional view showing the flow of resin when molding an IC chip using the lead frame of the present invention, and Fig. 3 is a conventional FIG. 4, which is a partial plan view of the lead frame, is a sectional view showing the flow of resin during molding of a conventional IC chip. 1...Island part of lead frame, 2...
Inner lead part of lead frame, 3... Outer lead part of lead frame, 11... Mold die, 12... Injection port for mold resin, 13...
... wire, 14 ... IC chip, 21 ... insulating tape, 22 ... resin flow.
Claims (1)
ナーリード部に絶縁性のテープを貼り付けたこと
を特徴とする半導体素子用リードフレーム構造。 A lead frame structure for a semiconductor device, characterized in that an insulating tape is attached to an island portion and an inner lead portion on the back side of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18106686U JPS6387843U (en) | 1986-11-27 | 1986-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18106686U JPS6387843U (en) | 1986-11-27 | 1986-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387843U true JPS6387843U (en) | 1988-06-08 |
Family
ID=31125598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18106686U Pending JPS6387843U (en) | 1986-11-27 | 1986-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387843U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02229457A (en) * | 1989-03-02 | 1990-09-12 | Hitachi Ltd | Lead frame, manufacture thereof and semiconductor device using same |
-
1986
- 1986-11-27 JP JP18106686U patent/JPS6387843U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02229457A (en) * | 1989-03-02 | 1990-09-12 | Hitachi Ltd | Lead frame, manufacture thereof and semiconductor device using same |