JPH0262774U - - Google Patents
Info
- Publication number
- JPH0262774U JPH0262774U JP14229388U JP14229388U JPH0262774U JP H0262774 U JPH0262774 U JP H0262774U JP 14229388 U JP14229388 U JP 14229388U JP 14229388 U JP14229388 U JP 14229388U JP H0262774 U JPH0262774 U JP H0262774U
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- board
- wiring board
- electronic components
- solder mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例のプリント配線板に
おけるねじ穴部の構成を示す断面図、第２図は第
１図の平面図、第３図は本考案の他の実施例を説
明するための斜視図、第４図は従来からのプリン
ト配線板におけるねじ穴部の構成を示す断面図、
第５図はその半田付け処理後の状態を示す断面図
である。
１１……基板、１２……導体層、１３……ソル
ダーレジスト層、１４……ねじ穴。
Fig. 1 is a sectional view showing the structure of a screw hole in a printed wiring board according to an embodiment of the present invention, Fig. 2 is a plan view of Fig. 1, and Fig. 3 explains another embodiment of the present invention. FIG. 4 is a cross-sectional view showing the structure of a screw hole in a conventional printed wiring board.
FIG. 5 is a sectional view showing the state after the soldering process. 11...Substrate, 12...Conductor layer, 13...Solder resist layer, 14...Screw hole.
Claims (1)
電子部品の実装面の反対側に設けられた導体層と
、この導体層上の半田付け不要部分に設けられた
ソルダーマスク層とを備えたプリント配線板にお
いて、前記ソルダーマスク層を、前記基板および
導体層を貫通して設けた配線板固定用穴部で、前
記導体層の厚み部分を部分的または全体的に覆つ
て設けたことを特徴とするプリント配線板。 A printed circuit board comprising a board on which electronic components are mounted, a conductor layer provided on the opposite side of the board to the surface on which the electronic components are mounted, and a solder mask layer provided on the conductor layer in areas that do not require soldering. In the wiring board, the solder mask layer is provided so as to partially or completely cover the thickness of the conductor layer with a wiring board fixing hole provided through the substrate and the conductor layer. Printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14229388U JPH0262774U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14229388U JPH0262774U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262774U true JPH0262774U (en) | 1990-05-10 |
Family
ID=31408119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14229388U Pending JPH0262774U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262774U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022187018A (en) * | 2019-12-02 | 2022-12-15 | 株式会社大一商会 | game machine |
| JP2022187019A (en) * | 2019-12-02 | 2022-12-15 | 株式会社大一商会 | game machine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508885B1 (en) * | 1970-07-13 | 1975-04-08 |
-
1988
- 1988-10-31 JP JP14229388U patent/JPH0262774U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508885B1 (en) * | 1970-07-13 | 1975-04-08 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022187018A (en) * | 2019-12-02 | 2022-12-15 | 株式会社大一商会 | game machine |
| JP2022187019A (en) * | 2019-12-02 | 2022-12-15 | 株式会社大一商会 | game machine |