JPH0553266U - Multilayer printed wiring board - Google Patents

Abstract

(57) [Summary] [Structure] A multilayer printed wiring board 1 whose lower layer is composed of one or more substrates 1a to 1c each having a concave portion 4 having an electrode pattern formed on an end face thereof, and an upper portion thereof. The layer is formed of one or more substrates 1e provided so as to close the uppermost open end of the concave portion 4 formed in the lower layer substrates 1a to 1c. [Effect] The surface of the multilayer printed wiring board can be widely used, and the components mounted on the surface and the printed wiring pattern are separated from the electrode pattern formed in the concave portion of the end face by soldering. No short circuit will occur.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a multilayer printed wiring board used as an electronic component for surface mounting.

[0002]

[Prior Art]

 Hereinafter, a multilayer printed wiring board used as a conventional surface mount electronic component will be described with reference to the drawings. FIGS. 2A and 2B are a perspective view and a top view of a first conventional example of a multilayer printed wiring board. In FIGS. 2A and 2B, reference numeral 1 is a multilayer printed wiring board consisting of four boards 1a, 1b, 1c and 1d, and 2 is a printed wiring pattern, an electronic component or a printed circuit board. -The surface on which the rudder cover is mounted. Reference numeral 3 denotes a back surface which is adhered to the mother board when the multilayer printed wiring board 1 is mounted on the mother board (not shown). Reference numeral 4 is a concave portion provided on the end face of the multilayer printed wiring board 1 and formed by depositing an electrode pattern. When the multilayer printed wiring board 1 is mounted on a mother board (not shown), the electrode patterns of the recesses 4 are reflow soldered to the electrodes on the mother board (not shown). Used to be connected by etc.

Reference numeral 5 is a shield cover which is mounted on the surface 2 by forming an airtight structure with an adhesive or the like. The outer dimension of the shield cover 5 is smaller than that of the multilayer printed wiring board 1 in order to avoid the recess 4. On the surface 2, a wiring pattern (not shown) is printed in the shield cover 5 and electronic parts (not shown) are mounted.

FIGS. 3A and 3B are a perspective view and a top view of a second conventional example of a multilayer printed wiring board. 3 (A) and 3 (B) are intended to maximize the effective use of the area of the surface 2 of the first conventional example shown in FIGS. 2 (A) and 2 (B). In order to avoid the recess 4, a notch 6 is provided on the side surface of the shield cover 5 so that the outer dimension of the shield cover 5 is increased to the same as the outer dimension of the multilayer printed wiring board 1. The notch 6 is for preventing a short circuit between the electrode pattern formed in the recess 4 and the shield cover 5. By the way, in the second conventional example shown in FIGS. 3A and 3B, the cutout 6 is provided unlike the first conventional example shown in FIGS. -A closed structure cannot be formed between the surface of the cover 2 and the lid cover 5.

[0005]

[Problems to be solved by the device]

 However, in the above-mentioned conventional multilayer printed wiring board, there is a problem that the effective use area of the surface 2 of the multilayer printed wiring board 1 becomes small due to the concave portion 4 for forming the electrode pattern. Furthermore, when the multilayer printed wiring board 1 is soldered onto the mother board, the wiring patterns and electronic components and shield covers formed on the surface 2 and the electrodes formed in the recesses 4 are soldered. There is also a problem that the pattern and the pattern are easily short-circuited by the molten solder.

An object of the present invention is to solve the above problems, to effectively utilize the surface of a multilayer printed wiring board, and to make a recess on the end surface of the multilayer printed wiring board when soldering on a mother board. It is an object of the present invention to provide a multilayer printed wiring board which does not cause a short circuit between the provided electrode pattern, the wiring pattern printed on the surface of the multilayer printed wiring board, the mounted electronic parts and the shield cover.

[0007]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, the present invention is a multilayer printed wiring board, wherein the lower layer of the multilayer printed wiring board has one or more recesses having electrode patterns formed on the end faces. A substrate, wherein the upper layer of the multilayer printed wiring board is composed of one or more substrates provided so as to close the uppermost opening end of the recess formed in the substrate of the lower layer. To do.

[0008]

[Action]

 In the above-mentioned multilayer printed wiring board of the present invention, since the end face of the substrate of the upper layer does not have a recess, the surface becomes wide, and the wiring pattern and mounting printed on the uppermost surface of the upper layer are achieved by this upper layer. The electronic components and shield cover thus formed are reliably separated from the electrode pattern formed in the concave portion of the end surface of the lower substrate.

[0009]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. Incidentally, in the figure, the portions corresponding to those of the conventional example are designated by the same reference numerals and the description thereof will be omitted. 1A and 1B are a perspective view and a top view showing a multilayer printed wiring board according to an embodiment of the present invention.

In FIG. 1A, the points different from the conventional example are as follows. That is, the substrate 1e arranged on the uppermost part of the multilayer printed wiring board 1 does not have a recess on its end face. As a result, the shield cover 5 can have its outer dimensions increased to the same as the outer dimensions of the multilayer printed wiring board 1 without providing a notch on its side surface.

By the way, the substrate 1e does not have an electrode on the end face, but if an electrode is required, a sulfol is provided inside the substrate so that it can be connected to an electrode of another substrate. It is not necessary to provide an electrode pattern on the end face. In the top view of FIG. 1 (B), since the recess 4 is located inside the outer shape of the shield cover 5, it is shown by a broken line in a perspective view. Although the shield cover is mounted on the surface of the multilayer printed wiring board 1 in the above-described embodiment of the present invention, it is mounted on the surface of the multilayer printed wiring board 1. The material is not limited to the shield cover, and may be an electronic component, or a wiring pattern may be printed on the surface.

[0012]

[Effect of the device]

 As described above, the multilayer printed wiring board of the present invention has an effect that the surface can be widely used up to its outer dimensions because the end surface of the substrate of the upper layer does not have the concave portion. , The wiring pattern printed on the uppermost surface thereof, the mounted electronic components and shield cover are separated from the electrode pattern formed in the concave portion of the end face of the lower layer substrate, Electrodes formed on wiring patterns printed on the surface, mounted electronic components and shield covers, and recesses on the end surface of the lower substrate when soldering onto the mother board. It also has the effect of not causing a short circuit with the pattern due to molten solder or the like.

[Brief description of drawings]

FIG. 1 is a perspective view and a top view showing a multilayer printed wiring board according to an embodiment of the present invention.

FIG. 2 is a perspective view and a top view showing a multilayer printed wiring board which is a first conventional example.

FIG. 3 is a perspective view and a top view showing a multilayer printed wiring board which is a second conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multilayer printed wiring board 2 Front surface 3 Back surface 4 Recesses where electrode patterns are formed 5 Shield cover 6 Notches

Claims (1)

[Scope of utility model registration request] 1. A multi-layer printed wiring board, wherein a lower layer of the multi-layer printed wiring board comprises one or more substrates each having a recess having an electrode pattern formed on an end face thereof. The multilayer printed wiring board according to claim 1, wherein the upper layer comprises one or more substrates provided so as to close the uppermost opening end of the recess formed in the lower substrate.