JP6634748B2 - 回路構成体 - Google Patents
回路構成体 Download PDFInfo
- Publication number
- JP6634748B2 JP6634748B2 JP2015180301A JP2015180301A JP6634748B2 JP 6634748 B2 JP6634748 B2 JP 6634748B2 JP 2015180301 A JP2015180301 A JP 2015180301A JP 2015180301 A JP2015180301 A JP 2015180301A JP 6634748 B2 JP6634748 B2 JP 6634748B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- terminal
- conductor
- conductive member
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 121
- 239000004020 conductor Substances 0.000 claims description 116
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 238000010586 diagram Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- -1 conductive member Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/08—Distribution boxes; Connection or junction boxes
- H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Civil Engineering (AREA)
- Architecture (AREA)
- Thermal Sciences (AREA)
- Structural Engineering (AREA)
- Ceramic Engineering (AREA)
- Geometry (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Connection Or Junction Boxes (AREA)
Description
10 基板
10a 一方の面
10b 他方の面
10c レジスト(絶縁層)
11 開口
12 端子接続部
13 第一外部接続部(外部接続用手段の一部)
14 第二外部接続部(外部接続用手段の一部)
15 第一固定部
16 第二固定部
101 配線パターン
102 第一外部接続用パターン(外部接続用手段の一部)
103 第二外部接続用パターン(外部接続用手段の一部)
20 導電部材
21 第一導電体
211 第一電気的接続部
212 第一機械的接続部
213 切欠き部
22 第二導電体
221 第二電気的接続部
222 第二機械的接続部
21a、22a 端子部
30 電子部品
31 本体部
32 第一端子
33 第二端子
34 第三端子
40 リード部材
Claims (4)
- 一方の面に配線パターンが形成された基板と、
互いに離れた状態で前記基板の他方の面側に固定される第一導電体および第二導電体を有する導電部材と、
前記導電部材の第一導電体に電気的に接続される第一端子、前記導電部材の第二導電体に電気的に接続される第二端子、および、前記基板に形成された配線パターンに電気的に接続される第三端子を有する電子部品と、
を備え、
前記基板の他方の面には、前記配線パターンに繋がる端子接続部が前記導電部材に重ならないように設けられており、
前記電子部品の前記第三端子は、リード部材を介して前記端子接続部と電気的に接続されており、
前記導電部材は、外部の電気的要素と接続される部分を除いて前記基板と重なっていることを特徴とする回路構成体。 - 前記基板には、前記導電部材を外部の電気的要素と電気的に接続するための外部接続用手段が設けられ、
前記導電部材には、前記外部接続用手段に電気的に接続される電気的接続部が設けられ、
前記導電部材の全体が、前記基板と重なっていることを特徴とする請求項1に記載の回路構成体。 - 前記導電部材には、前記基板に固定される機械的接続部が設けられていることを特徴とする請求項1または請求項2に記載の回路構成体。
- 一方の面に配線パターンが形成され、他方の面に絶縁層が形成された基板の当該他方の面側に、外部の電気的要素と接続される部分を除く部分が前記基板に重なるように、かつ、前記配線パターンに繋がる部分であって前記基板の他方の面に設けられた端子接続部に重ならないように、第一導電体および第二導電体を互いに離れた状態で当該基板に固定する導電部材接続工程と、
前記導電部材接続工程と同時に行う、前記基板の他方の面側においてリード部材を前記端子接続部に接続するリード部材接続工程と、
前記導電部材接続工程および前記リード部材接続工程の後に行う、複数の端子を有する電子部品を実装する工程であって、前記電子部品の第一端子を前記第一導電体に、前記電子部品の第二端子を前記第二導電体に、前記電子部品の第三端子を前記リード部材に接続して前記基板に形成された配線パターンに電気的に接続する電子部品実装工程と、
を含むことを特徴とする回路構成体の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015180301A JP6634748B2 (ja) | 2015-09-14 | 2015-09-14 | 回路構成体 |
DE112016004150.0T DE112016004150T5 (de) | 2015-09-14 | 2016-08-31 | Schaltungsanordnung und Verfahren zur Herstellung derselben |
CN201680050566.2A CN108029188B (zh) | 2015-09-14 | 2016-08-31 | 电路结构体及其制造方法 |
US15/759,332 US20190074244A1 (en) | 2015-09-14 | 2016-08-31 | Circuit assembly and method for manufacturing same |
PCT/JP2016/075429 WO2017047383A1 (ja) | 2015-09-14 | 2016-08-31 | 回路構成体およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015180301A JP6634748B2 (ja) | 2015-09-14 | 2015-09-14 | 回路構成体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017059560A JP2017059560A (ja) | 2017-03-23 |
JP6634748B2 true JP6634748B2 (ja) | 2020-01-22 |
Family
ID=58288906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015180301A Active JP6634748B2 (ja) | 2015-09-14 | 2015-09-14 | 回路構成体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20190074244A1 (ja) |
JP (1) | JP6634748B2 (ja) |
CN (1) | CN108029188B (ja) |
DE (1) | DE112016004150T5 (ja) |
WO (1) | WO2017047383A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6638262B2 (ja) * | 2015-02-03 | 2020-01-29 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP2018190767A (ja) * | 2017-04-28 | 2018-11-29 | 株式会社オートネットワーク技術研究所 | 回路基板と回路部品とを備えた回路装置、該回路装置の製造方法 |
JP6740959B2 (ja) | 2017-05-17 | 2020-08-19 | 株式会社オートネットワーク技術研究所 | 回路装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5875091A (en) * | 1997-01-07 | 1999-02-23 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Busbars with filter capacitors |
JP2000164760A (ja) * | 1998-12-01 | 2000-06-16 | Sumitomo Metal Electronics Devices Inc | 半導体搭載用パッケージ及びその製造方法 |
JP3876563B2 (ja) * | 1999-03-19 | 2007-01-31 | 住友電装株式会社 | 電気接続箱 |
JP4002427B2 (ja) | 2001-11-26 | 2007-10-31 | 株式会社オートネットワーク技術研究所 | 回路構成体の製造方法 |
US7119437B2 (en) * | 2002-12-26 | 2006-10-10 | Yamaha Hatsudoki Kabushiki Kaisha | Electronic substrate, power module and motor driver |
JP2005268648A (ja) * | 2004-03-19 | 2005-09-29 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体 |
US7548411B2 (en) * | 2004-10-29 | 2009-06-16 | Hitachi, Ltd. | Electronic circuit structure, power supply apparatus, power supply system, and electronic apparatus |
JP4438004B2 (ja) * | 2005-01-05 | 2010-03-24 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP5169764B2 (ja) * | 2008-11-19 | 2013-03-27 | トヨタ自動車株式会社 | 電力変換装置 |
JP6638262B2 (ja) * | 2015-02-03 | 2020-01-29 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
-
2015
- 2015-09-14 JP JP2015180301A patent/JP6634748B2/ja active Active
-
2016
- 2016-08-31 US US15/759,332 patent/US20190074244A1/en not_active Abandoned
- 2016-08-31 WO PCT/JP2016/075429 patent/WO2017047383A1/ja active Application Filing
- 2016-08-31 CN CN201680050566.2A patent/CN108029188B/zh active Active
- 2016-08-31 DE DE112016004150.0T patent/DE112016004150T5/de active Pending
Also Published As
Publication number | Publication date |
---|---|
CN108029188B (zh) | 2020-08-11 |
JP2017059560A (ja) | 2017-03-23 |
DE112016004150T5 (de) | 2018-05-24 |
CN108029188A (zh) | 2018-05-11 |
US20190074244A1 (en) | 2019-03-07 |
WO2017047383A1 (ja) | 2017-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6112073B2 (ja) | 半導体装置 | |
US10090657B2 (en) | Circuit assembly, connected busbar structure, and electrical junction box | |
US20140198470A1 (en) | Printed circuit board stack | |
JP6330690B2 (ja) | 基板ユニット | |
JP6432792B2 (ja) | 回路構成体及び電気接続箱 | |
JP2015047031A (ja) | 回路構成体 | |
JP6634748B2 (ja) | 回路構成体 | |
JP6165025B2 (ja) | 半導体モジュール | |
JP6638262B2 (ja) | 回路構成体 | |
JP6256364B2 (ja) | 回路構成体 | |
US9974182B2 (en) | Circuit assembly | |
JP5295807B2 (ja) | 配線基板多数個取り用の母基板 | |
US20200099208A1 (en) | Circuit assembly and electrical junction box | |
JP6443265B2 (ja) | 実装基板 | |
WO2018123381A1 (ja) | 回路モジュールおよびその製造方法 | |
JP6667105B2 (ja) | 回路基板、回路構成体、及び回路基板の製造方法 | |
JP6028763B2 (ja) | 回路構成体及び連結バスバー | |
WO2016125544A1 (ja) | 回路構成体 | |
JP2016012591A (ja) | 電子回路体およびその製造方法 | |
JP2006253610A (ja) | 回路基板を備えた電子機器 | |
JP4562097B2 (ja) | 半導体装置の製造方法 | |
JP2015047032A (ja) | 回路構成体 | |
JPH04144188A (ja) | フレキシブルプリント回路 | |
JP2007250659A (ja) | 回路モジュールおよびその製造方法 | |
JP2017050479A (ja) | プリント基板積層体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171226 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190305 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190325 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190806 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190809 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191119 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191202 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6634748 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |