JP2019081949A - Evaporation source device, film deposition apparatus, film deposition method, and manufacturing method of electronic device - Google Patents

Abstract

To mitigate an influence of radiation heat on a substrate.SOLUTION: In an evaporation source device including a plurality of crucibles for storing a vapor deposition material, including a first crucible and a second crucible, a deposition prevention plate covering the first crucible, and having an opening on the second crucible, and a movable-type evaporation source shutter for putting the second crucible into a shielded state and in an open state by changing the position, when the second crucible is put into the open state by the evaporation source shutter, the evaporation source shutter is overlapped on the deposition prevention plate and the first crucible covered with the deposition prevention plate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an evaporation source apparatus, a film forming apparatus, a film forming method, and a method of manufacturing an electronic device.

  An organic electronic device such as an organic EL display is manufactured through an evaporation process in which an organic material, a metal material, or the like is evaporated. The evaporation source apparatus used in the vapor deposition process has a plurality of crucibles, and heats the vapor deposition material stored in the crucible, raises the temperature of the vapor deposition material to evaporate, and adheres to the surface of the substrate. Perform film formation.

  Patent Document 1 discloses a vacuum deposition including a vacuum chamber, a plurality of evaporation sources (crucibles) for forming a thin film on a substrate, and one shutter for opening and shielding a vapor of a material evaporated from the evaporation source. An apparatus is disclosed. It is described that the shutter can sequentially open one of the plurality of evaporation sources to prevent the occurrence of contamination among the plurality of evaporation sources.

  In addition, Patent Document 2 discloses a plurality of evaporation sources, a first heating device, a second heating device, and a deposition shielding plate. Conventionally, when an evaporation source device having a plurality of evaporation sources heats the deposition material stored in the evaporation source to raise the temperature, it takes a long time to start heating the deposition material at the time of deposition (main heating) . Therefore, prior to deposition, preheating is performed to raise the temperature of the evaporation source to a temperature at which the deposition material becomes vapor. That is, for the plurality of evaporation sources, the evaporation source for which preheating has been performed, and the evaporation source for main heating used for film formation on the substrate surface while maintaining the temperature at which the contained deposition material becomes vapor. Is included. In the configuration of Patent Document 2, the deposition shield covers the evaporation source at the preheating position.

JP 2007-332433 A JP, 2006-249575, A

  By the way, the heating temperature of the evaporation source is high, and even under vacuum, the substrate or the mask to be placed is deformed by heat expansion or the like under the influence of radiant heat from the evaporation source, so that the film forming accuracy is lowered. And problems such as quality deterioration of the formed film occur. As in the conventional example, when only the shutter or only the deposition shielding plate is disposed on the evaporation source which does not perform evaporation, it is difficult to sufficiently reduce the influence of the radiation heat from the evaporation source to the substrate Met. In particular, the effects of radiant heat from the preheating evaporation source and the evaporation source immediately after deposition are significant.

  The present invention has been made in view of the above problems. An object of the present invention is to provide an evaporation source device that reduces the influence of radiant heat on a substrate.

In order to achieve the above object, the present invention adopts the following configuration. That is,
A plurality of crucibles including a first crucible and a second crucible and containing a deposition material;
An adhesion preventing plate covering the first crucible and having an opening on the second crucible;
An evaporation source device comprising: a movable evaporation source shutter for opening and closing the second crucible by changing the position;
When the evaporation source shutter is in an open state of the second crucible, the evaporation source shutter overlaps the adhesion preventing plate and the first crucible covered with the adhesion preventing plate. It is an evaporation source device to be

  According to the present invention, it is possible to provide an evaporation source device in which the influence of radiant heat on a substrate is reduced.

FIG. 1: is a schematic diagram which shows a part of structure of the manufacturing apparatus of an organic electronic device. FIG. 2: is a schematic diagram which shows the (a) shielding state of a structure of the evaporation source apparatus concerning Embodiment 1, and (b) open state. FIG. 3 is a schematic view showing the configuration of the evaporation source shutter according to the second embodiment. FIG. 4 is a schematic view showing the configuration of the evaporation source shutter according to the third embodiment. FIG. 5 is a schematic view showing the configuration of the evaporation source apparatus according to the fourth embodiment. FIG. 6 is a schematic view showing the configuration of the evaporation source apparatus according to the fifth embodiment. FIG. 7 is a schematic view showing a state of the evaporation source shutter of the evaporation source device according to the fifth embodiment as viewed from the side. FIG. 8 is a schematic view showing the configuration of the evaporation source apparatus according to the sixth embodiment. FIG. 9 is a view showing the structure of the organic EL display device.

  Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the device, the process flow, the manufacturing conditions, the dimensions, the materials, the shape, etc. limit the scope of the present invention to only those unless otherwise specified. It is not for the purpose.

  The present invention relates to an evaporation source device and a control method thereof, and particularly to an evaporation source device for forming a thin film on a deposition target by vapor deposition and a control method thereof. The present invention can also be grasped as a program that causes a computer to execute a control method or a storage medium that stores the program. The storage medium may be a non-transitory storage medium readable by a computer. The present invention can be preferably applied to, for example, an apparatus for forming a thin film (material layer) of a desired pattern by vacuum deposition on the surface of a substrate which is a deposition target. As a material of the substrate, any material such as glass, resin, metal can be selected. The deposition target of the film forming apparatus is not limited to a flat substrate. For example, mechanical parts having asperities and openings may be used as the deposition object. In addition, as the vapor deposition material, any material such as an organic material or an inorganic material (metal, metal oxide or the like) can be selected. In addition to the organic film, it is also possible to form a metal film. Specifically, the technology of the present invention is applicable to manufacturing apparatuses such as organic electronic devices (for example, organic EL display devices, thin film solar cells), optical members and the like.

First Embodiment
<Schematic Configuration of Film Forming Apparatus>
FIG. 1 is a cross-sectional view schematically showing the structure of a vapor deposition apparatus (film formation apparatus). The film forming apparatus 6 has a vacuum chamber 13. The inside of the vacuum chamber 13 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

  A substrate 7 which is a substance to be deposited generally held by a substrate holder 8, a mask 9 held by a mask holder 10, and a magnet plate 12 for attracting the mask 9 to the substrate 7 by a magnetic force. , And an evaporation source device 1 are provided.

  The substrate holder 8 holds the substrate by a support such as a receiving claw (a finger) for supporting the substrate 7 or a pressing device such as a clamp (not shown) for pressing and holding the substrate. The substrate 7 is transported into the vacuum chamber 13 by a transport robot (not shown), and then held by the substrate holder 8 and fixed so as to be parallel to the horizontal plane (XY plane) at the time of film formation. The mask 9 is a mask having an opening pattern corresponding to a thin film pattern of a predetermined pattern formed on the substrate 7 and is, for example, a metal mask. At the time of film formation, the substrate 7 is placed on the mask 9.

  Further, the evaporation source device 1 is provided with a first crucible 3, a second crucible 2, a deposition prevention plate 4 having an opening, and an evaporation source shutter 5. The first crucible 3 is covered with the adhesion prevention plate 4, and the second crucible 2 is disposed below the opening of the adhesion prevention plate 4. A vapor deposition material is stored in each of the first crucible 3 and the second crucible 2, and vapor is generated by heating the vapor deposition material. Furthermore, the evaporation source shutter 5 is a movable shutter which is provided above the opening of the adhesion preventing plate 4 and which makes the opening of the adhesion preventing plate 4 open and closed.

  In addition, the vacuum chamber 13 may be provided with an open / close substrate shutter 11 for controlling the vapor from the evaporation source device 1 reaching the substrate 7. In addition, the magnet plate 12 may include a cooling plate (not shown) that suppresses the temperature rise of the substrate 7. Furthermore, on the vacuum chamber 13, a mechanism for alignment of the substrate 7 and the mask 9, for example, driving means such as an actuator in the X direction or Y direction, a substrate holder actuator for holding the substrate, or the substrate 7 A camera (not shown) for imaging may be provided.

  The evaporation source device 1 is provided with a plurality of crucibles including a first crucible 3 and a second crucible 2. A crucible is one example of an evaporation source. Further, the evaporation source device 1 includes a movable support (not shown) capable of moving the first crucible 3 and the second crucible 2. In the present embodiment, main heating to be used for vapor deposition is performed on one of the plurality of crucibles. Also, one of the plurality of crucibles is preheated in preparation for deposition.

  The crucible in which the main heating is performed, or the crucible disposed at the position for performing the main heating is described as a second crucible 2 for convenience. Further, a crucible which is preheated or a crucible which is disposed at a position where it is preheated is described as a first crucible 3 for convenience. That is, the first crucible 3 is a crucible which is preheated to raise the temperature of the crucible to a temperature at which the vapor deposition material becomes vapor by heating the vapor deposition material contained in the crucible by a heater or the like. The second crucible 2 is a crucible that performs main heating that is continued heating by a heater or the like so as to maintain the temperature at which the vapor deposition material contained in the crucible becomes vapor.

  The first crucible 3 is moved by a movable support (not shown) after preheating is completed, and can be changed to a position for performing main heating. The position for performing the main heating is a position under the opening of the adhesion preventing plate 4. Therefore, the vapor deposition material in each crucible is made into a vapor by two steps of preheating and main heating.

<Detailed configuration of evaporation source device>
FIG. 2 shows the movable state of the evaporation source shutter 5 of the evaporation source device 1.
FIG. 2A shows the state of the shielding state of the evaporation source shutter 5. At this time, the vapor of the evaporation source material stored in the second crucible 2 is shielded by the evaporation source shutter 5, and the first crucible 3 is covered by the adhesion prevention plate 4. The shielding state may be a state in which at least a part of the vapor of the material from the second crucible 2 is covered by the evaporation source shutter 5 so as not to reach the substrate directly. It is not limited to the state of covering the whole. In addition, a gap may be provided between the second crucible 2 and the evaporation source shutter 5. Preferably, the entire second crucible 2 is covered by the evaporation source shutter 5 when viewed from the substrate side.
The first crucible 3 may be a preheated crucible or a crucible moved to a position where the crucible is cooled after vapor deposition.

FIG. 2 (b) shows the evaporation source shutter 5 in the open state. At this time, most of the vapor of the evaporation source material stored in the second crucible 2 reaches the substrate 7.
When the evaporation source shutter 5 is in the open state, the evaporation source shutter 5 moves to a position overlapping with both the adhesion preventing plate 4 and the first crucible 3 covered by the adhesion preventing plate 4. In one aspect, a virtual line connecting the first crucible 3 and the substrate 7 passes through the deposition prevention plate 4 and the evaporation source shutter 5. In addition, it is preferable that the adhesion preventing plate 4 and the evaporation source shutter 5 overlap over the entire first crucible 3 when viewed from the substrate side.

  The overlapping order when viewed from the first crucible 3 may be the deposition prevention plate 4, the evaporation source shutter 5 or the evaporation source shutter 5, the deposition prevention plate 4. In the case of the evaporation source shutter 5 and the adhesion prevention plate 4, the evaporation source shutter 5 is provided between the first crucible 3 and the second crucible 2 and the adhesion prevention plate 4 in the overlapping order.

  According to the above-described configuration, both the adhesion preventing plate 4 and the evaporation source shutter 5 are interposed between the first crucible 3 and the substrate 7. Therefore, the influence of the radiation heat from the first crucible 3 on the substrate 7 can be reduced.

  In the above description, the configuration in which one adhesion prevention plate 4 having an opening is provided is described as an example, but two or three adhesion prevention plates 4 may be overlapped, and also in this case, the evaporation source shutter as described above By adopting the moving configuration, the influence of the radiant heat from the first crucible 3 on the substrate 7 can be more effectively reduced.

Second Embodiment
Embodiment 2 of the present invention will be described with reference to the drawings. The same reference numerals as in the first embodiment denote the same parts as in the first embodiment, and a description thereof will be omitted.

  FIG. 3 is a schematic cross-sectional view from the top (FIGS. 3 (a) and 3 (c)) and a side view showing elements of the cooling mechanism of the evaporation source shutter 5 in the evaporation source device of this embodiment. It is a schematic sectional drawing (FIG.3 (b), FIG.3 (d)).

  FIGS. 3A and 3B schematically show the arrangement of the cooling water channels 14 provided in the evaporation source shutter 5 as a cooling mechanism. Thus, even if the evaporation source shutter 5 is heated by the radiant heat from the first crucible 3 or the like, heat can be released from the evaporation source shutter 5 by causing the cooling medium to flow through the cooling water passage 14.

  Furthermore, the evaporation source shutter 5 shown in FIGS. 3C and 3D includes the cooling water passage 14 and the first crucible 3 on the surface of the evaporation source shutter 5 facing the first crucible 3. A surface processing 15 is applied which absorbs heat more easily than the opposite surface of the opposite surface. Specific surface processing 15 is application of a material with high emissivity (black material), or a film of Teflon (registered trademark, resin containing hydrogen fluoride) or the like.

  As another example, the member of the surface facing the first crucible 3 of the evaporation source shutter 5 has a member (not shown) whose thermal conductivity is higher than the member of the surface opposite to the surface facing the first crucible 3 (not shown) ) May be used.

By using the surface processing 15 or a member having a high thermal conductivity, the substrate 7 can easily transmit the heat of the radiant heat received from the first crucible 3 or the like to the cooling water channel 14 provided in the evaporation source shutter 5. Can reduce the effects of radiant heat.

Embodiment 3
Embodiment 3 of the present invention will be described with reference to the drawings. The same reference numerals as in the first embodiment denote the same parts as in the first embodiment, and a description thereof will be omitted.

  FIG. 4 is a schematic cross-sectional view from the top of the evaporation source shutter 5 (FIG. 4 (a)) and a schematic cross-sectional view from the side (FIG. 4 (b)) in the evaporation source device of this embodiment. A reflector 16 is provided on the surface of the evaporation source shutter 5 facing the first crucible 3 shown in FIG. 4B.

A specific configuration of the reflector 16 is to apply surface processing or a material having a lower emissivity than the surface opposite to the surface facing the first crucible 3. As another specific configuration of the reflector 16, the surface processing or material with a low emissivity through the space between the evaporation source shutter 5 and the main surface of the evaporation source shutter 5 on the surface facing the first crucible 3. There is a structure which arranges another plate material formed.
As a specific material, molybdenum and tantalum can be considered.
Further, by using stainless steel or aluminum as the material, and polishing and mirror-finishing these, a surface with a low emissivity can be formed.

By providing the reflector 16 on the evaporation source shutter 5 in this manner, the radiation heat from the first crucible 3 and the like can be reflected to reduce the influence of the radiation heat on the substrate 7.
Furthermore, the radiation heat is returned to the first crucible 3 to improve the thermal efficiency of heating the first crucible.
The evaporation source shutter 5 of the present embodiment may be combined with the cooling mechanism described in the second embodiment.

Fourth Embodiment
Embodiment 4 of the present invention will be described with reference to the drawings. The same components as in the first embodiment are given the same reference numerals to simplify the description.

  FIG. 5 shows a view from the top of the evaporation source shutter 5 of the evaporation source device 1 provided with four crucibles including the first crucible 3 and the second crucible 2 on the movable movable support 17. FIG. 5 shows the evaporation source shutter 5 in an open state, and shows the position of the evaporation source shutter 5 when the opening of the deposition preventing plate 4 is in an open state.

  Four crucibles including the first crucible 3 and the second crucible 2 are provided on the movable movable support 17 respectively. The movable supports 17 can move the positions of the respective crucibles, for example, by moving all at once in the direction of the arrow in the moving direction of the movable supports shown. The moving direction of the movable support 17 may be opposite to that of the arrow.

  In the fourth embodiment of FIG. 5, there are four crucibles. One of the four crucibles is located below the opening of the adhesion preventing plate 4 and is in a position for main heating. The crucible is referred to as a second crucible 2. In addition, one of the three crucibles other than the second crucible is at a position covered by the adhesion prevention plate 4 and the evaporation source shutter 5 and is at a position for preheating. The other crucible is referred to as a first crucible 3.

The evaporation source shutter 5 can move in the opening / closing direction of the evaporation source shutter shown in FIG.
Also in the present embodiment, as in the first to third embodiments, the influence of the radiation heat on the substrate 7 can be reduced.

Fifth Embodiment
Fifth Embodiment A fifth embodiment of the present invention will be described with reference to the drawings. The same components as in the first embodiment are given the same reference numerals to simplify the description.

  FIG. 6 shows a top view of the evaporation source shutter 5 of the evaporation source device 1 in which seven crucibles including the first crucible 3 and the second crucible 2 are provided on the rotatable rotary support 18. FIG. 6 shows the evaporation source shutter 5 in the open state, and shows the position of the evaporation source shutter 5 when the opening of the adhesion preventing plate 4 is opened. FIG. 7 shows (a) the open state of the opening of the deposition prevention plate 4 and (b) the blocked state of the opening of the deposition prevention plate 4 as viewed from the side of the evaporation source shutter 5.

  Seven crucibles including the first crucible 3 and the second crucible 2 are provided along the circumferential direction of the rotatable support 18. The rotary support 18 is moved in the direction of the rotation arrow of the illustrated rotary support, for example, to move the positions of the respective crucibles provided along the circumferential direction of the rotary support 18. Can. The direction of rotation of the rotary support 18 may be opposite to the arrow of the rotation of the rotary support.

  In the fifth embodiment of FIG. 6, there are seven crucibles. One of the seven crucibles is located below the opening of the adhesion prevention plate 4 and is in a position for main heating. The crucible is referred to as a second crucible 2. Further, one of the six crucibles other than the second crucible is at a position covered by the adhesion prevention plate 4 and the evaporation source shutter 5 and is in a position for preheating. The other crucible is referred to as a first crucible 3.

  Further, in the present embodiment, by setting the other crucibles to be arranged between the second crucible 2 and the first crucible 3, the thermal influence upon each of the preheating and the main heating is reduced. It is arranged.

The evaporation source shutter 5 can move in the opening / closing direction of the evaporation source shutter shown in FIG.
Also in the present embodiment, as in the first to fourth embodiments, the influence of radiant heat on the substrate 7 can be reduced.

Embodiment 6
Sixth Embodiment A sixth embodiment of the present invention will be described with reference to the drawings. The same components as in the first embodiment are given the same reference numerals to simplify the description.

  FIG. 8 shows a top view of the evaporation source shutter 5 of the evaporation source device 1 in which seven crucibles including the first crucible 3 and the second crucible 2 are provided on the rotatable rotary support 18. FIG. 6 shows the evaporation source shutter 5 in the open state, and shows the position of the evaporation source shutter 5 when the opening of the adhesion preventing plate 4 is opened.

  Seven crucibles including the first crucible 3 and the second crucible 2 are provided along the circumferential direction of the rotatable support 18. The rotary support 18 is moved in the direction of the rotation arrow of the illustrated rotary support, for example, to move the positions of the respective crucibles provided along the circumferential direction of the rotary support 18. Can. The direction of rotation of the rotary support 18 may be opposite to the arrow of the rotation of the rotary support.

The sixth embodiment is configured to reduce the influence of radiant heat from the evaporation source immediately after deposition. When evaporation from the crucible is completed, the crucible that is main-heated at the vapor deposition position is moved to a position where the crucible is cooled by the rotating support 18, and the crucible at the preheating position is moved to the vapor deposition position to deposit Although it will continue, the evaporation completion crucible moved to the cooling position is still hot because of residual heat. In the sixth embodiment, the influence of radiant heat on the substrate 7 by the crucible immediately after the deposition can be reduced.

  That is, in the sixth embodiment of FIG. 8, there are seven crucibles. One of the seven crucibles is located below the opening of the adhesion prevention plate 4 and is in a position for main heating. The crucible is referred to as a second crucible 2. In addition, one of the six crucibles other than the second crucible is a crucible immediately after deposition which has been deposited and moved to a position where it is cooled by rotation of the rotary support 18. And a position covered by the evaporation source shutter 5. In the present embodiment, this crucible is referred to as a first crucible 3.

  Further, in the present embodiment, by setting the other crucibles to be arranged between the second crucible 2 and the first crucible 3, the thermal influence upon each of the preheating and the main heating is reduced. It is arranged.

The evaporation source shutter 5 can move in the opening / closing direction of the evaporation source shutter shown in FIG. In the present embodiment and the fifth embodiment, the rotation axis for moving the evaporation source shutter 5 in the opening and closing direction is the outer side of the evaporation source as shown in FIG. It may be outside, and as shown in FIG. 6, it may be inside the evaporation source (radially inside of the rotary support 18 where the crucible is provided in the circumferential direction).
Also in the present embodiment, as in the first to fifth embodiments, the influence of radiant heat on the substrate 7 can be reduced, and in particular, the influence of radiant heat from the evaporation source immediately after deposition can be reduced.

<Example of film forming method of film forming apparatus>
Next, an example of a film forming method using the evaporation source apparatus or the film forming apparatus of the present embodiment will be described with reference to FIGS. 1 and 2.

  The film forming method of the present embodiment includes the step of heating the first crucible 3 and the second crucible 2 of the evaporation source device 1. First, as a preheating step, there is a step of heating the deposition material accommodated in the first crucible 3 provided at the preheating position, and raising the temperature of the crucible to a temperature at which the deposition material becomes vapor. Also, as the main heating step, the crucible warmed in the preheating step is moved to the main heating position to make the second crucible 2 and maintain the temperature at which the vapor deposition material contained in the second crucible 2 becomes vapor There is a step of maintaining the temperature in the second crucible 2.

  Furthermore, the film forming method of the present embodiment includes the step of opening and closing the evaporation source shutter 5 provided at the opening of the deposition prevention plate 4 of the evaporation source device 1. First, as a step of shielding the evaporation source shutter 5, there is a step of shielding the vapor of the heated deposition material in the second crucible 2. In the opening step, the evaporation source shutter 5 overlaps the first crucible 3 covered by the adhesion preventing plate 4 to open the vapor of the heated vapor deposition material in the second crucible 2 and open the substrate holder. There is a step of forming a film on the substrate 7 held at 8.

Thus, the evaporation source shutter 5 covers the first crucible 3 covered with the adhesion preventing plate 4 during film formation, thereby reducing the influence of the radiation heat from the first crucible 3 to the substrate 7 Can be provided.
As a result, it is possible to suppress deterioration in film formation accuracy due to thermal deformation of the substrate 7 during film formation due to radiant heat, and deterioration in quality of the film formed by the radiant heat.

<Example of Method of Manufacturing Electronic Device>
Next, an example of a method of manufacturing an electronic device using the film forming method of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be illustrated as an example of the electronic device.

  First, an organic EL display device to be manufactured will be described. FIG. 9 (a) is a general view of the organic EL display device 60, and FIG. 9 (b) shows a cross-sectional structure of one pixel.

  As shown in FIG. 9A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The term “pixel” as used herein refers to the minimum unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device according to the present example, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit light different from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element and a white light emitting element It is not limited.

  FIG. 9B is a schematic partial cross-sectional view taken along line A-B in FIG. The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, one of light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. , And an organic EL element comprising Among these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layer. Further, in the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light emitting elements (sometimes described as organic EL elements) that emit red, green, and blue, respectively. In addition, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrodes 64 and the second electrodes 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is degraded by moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

  In order to form the organic EL layer in light emitting element units, a method of forming a film through a mask is used. In recent years, high definition of a display device has been advanced, and a mask having an opening width of several tens of μm is used to form an organic EL layer. In the case of film formation using such a mask, if the mask receives heat from the evaporation source during film formation and is thermally deformed, the position of the mask and the substrate will be shifted, and the thin film pattern formed on the substrate is desired. It will be formed out of position. Then, the film-forming apparatus (vacuum vapor deposition apparatus) concerning this invention is used suitably for film-forming of these organic electroluminescent layers.

Next, an example of a method of manufacturing an organic EL display device will be specifically described.
First, a circuit 63 (not shown) for driving the organic EL display device and the substrate 63 on which the first electrode 64 is formed are prepared.

  An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the portion where the first electrode 64 is formed. Form 69 The opening corresponds to a light emitting region in which the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is carried into the first film forming apparatus, the substrate is held by the substrate holder, and the hole transport layer 65 is a layer common to the first electrode 64 in the display area. Form a film. The hole transport layer 65 is deposited by vacuum evaporation. In practice, the hole transport layer 65 is formed to have a size larger than that of the display area 61, so a high definition mask is not necessary.

  Next, the substrate 63 on which the hole transport layer 65 has been formed is carried into the second film forming apparatus, and is held by the substrate holder. Alignment between the substrate and the mask is performed, the substrate is placed on the mask, and the light emitting layer 66R emitting red is formed on the portion of the substrate 63 where the element emitting red is disposed. According to this example, the mask and the substrate can be favorably superimposed, and highly accurate film formation can be performed.

  Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green is formed by the third film forming apparatus, and the light emitting layer 66B emitting blue is formed by the fourth film forming apparatus. After film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

  The substrate on which the electron transport layer 67 is formed is moved to a sputtering apparatus, the second electrode 68 is formed, and then the plasma CVD apparatus is moved to form a protective layer 70, thereby completing the organic EL display 60. Do.

  After the substrate 63 on which the insulating layer 69 is patterned is carried into a film forming apparatus and the film is exposed to an atmosphere containing moisture or oxygen until the film formation of the protective layer 70 is completed, the light emitting layer made of the organic EL material It may be degraded by moisture or oxygen. Therefore, in the present embodiment, the loading and unloading of the substrate between the film forming apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

  In the organic EL display device thus obtained, the light emitting layer is formed with high accuracy for each light emitting element. Therefore, the use of the above-described manufacturing method can suppress the occurrence of defects in the organic EL display device due to the displacement of the light emitting layer.

  The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea thereof. For example, in the above embodiment, the substrate is moved by the substrate holder, but the mask as the mounting body, or both the substrate and the mask may be moved. In that case, in addition to the means for moving the substrate, means for moving the mounting body may be provided.

1: Evaporation source device 2: Second crucible 3: First crucible 4: Adhesion plate 5: Evaporation source shutter 6: Film forming device 7, 63: Substrate 8: Substrate holder 9: Mask 10: Mask holder 11: Substrate shutter 12: Magnet plate 13: Vacuum chamber 14: Cooling water channel 15: Surface processing 16: reflector 17: moving support 18: rotating support

Claims (14)

A plurality of crucibles including a first crucible and a second crucible and containing a deposition material;
An adhesion preventing plate covering the first crucible and having an opening on the second crucible;
An evaporation source device comprising: a movable evaporation source shutter for opening and closing the second crucible by changing the position;
When the evaporation source shutter is in an open state of the second crucible, the evaporation source shutter overlaps the adhesion preventing plate and the first crucible covered with the adhesion preventing plate. Evaporation source device.   The evaporation source device according to claim 1, wherein the plurality of crucibles are configured by the first crucible, the second crucible, and the other crucibles.   The evaporation source device according to claim 1, wherein the evaporation source shutter is provided with a cooling mechanism that cools the evaporation source shutter.   The surface of the evaporation source shutter facing the plurality of crucibles has higher heat conductivity or higher emissivity than the surface of the evaporation source shutter opposite to the surface facing the plurality of crucibles. The evaporation source device according to claim 3, characterized in that:   The evaporation source device according to any one of claims 1 to 4, wherein a reflector mechanism that reflects heat is provided on a surface of the evaporation source shutter facing the plurality of crucibles.   The plurality of crucibles are provided on a movable movable support, and the one movable crucible is disposed at a position for preheating one of the plurality of crucibles by movement of the movable support. The second crucible is characterized in that the other crucible is the second crucible by disposing the first crucible as the first crucible and arranging another crucible of the plurality of crucibles at a position for main heating. The evaporation source apparatus according to any one of 5. The plurality of crucibles are provided along the circumferential direction of the rotatable support.
By arranging the one of the plurality of crucibles at a position for preheating one of the plurality of crucibles by rotation of the rotary support, the one crucible is used as the first crucible, and another one of the plurality of crucibles is used. The evaporation source device according to any one of claims 1 to 5, wherein the other crucible is the second crucible by arranging the crucible at a position for main heating.   The plurality of crucibles are provided on a movable movable support, and the movement of the movable support positions the one crucible of the plurality of crucibles at a position immediately after deposition, thereby disposing the one crucible. The first crucible according to any one of claims 1 to 5, wherein the other crucible is used as the second crucible by arranging another crucible of the plurality of crucibles at a position for main heating. The evaporation source apparatus according to any one of the above. The plurality of crucibles are provided along the circumferential direction of the rotatable support.
By arranging one of the plurality of crucibles at a position immediately after deposition by rotation of the rotary support, the one crucible is used as a first crucible, and another of the plurality of crucibles is used as a first crucible. The evaporation source device according to any one of claims 1 to 5, wherein the other crucible is the second crucible by being disposed at a position for heating. An evaporation source device according to any one of claims 1 to 9,
A substrate holder for disposing a substrate at a position facing the evaporation source device;
A film forming apparatus, comprising: a substrate shutter for bringing the substrate of the substrate holder into an open state and a closed state with respect to the evaporation source device, between the substrate holder and the evaporation source device. A deposition method for depositing a vapor deposition material stored in the crucible on a substrate provided at a position facing the evaporation source device by the evaporation source device according to any one of claims 1 to 9, ,
A preheating step of heating the vapor deposition material contained in the first crucible and raising the temperature of the first crucible to a temperature at which the vapor deposition material becomes vapor;
A main heating step of maintaining a temperature at which the vapor deposition material contained in the second crucible becomes a vapor;
A shielding step of shielding the vapor of the heated deposition material in the second crucible;
The evaporation source shutter is overlapped with the first crucible covered by the adhesion preventing plate to open the vapor of the heated vapor deposition material in the second crucible and open the film on the substrate And a step of forming a film. A method of manufacturing an electronic device having an organic film formed on a substrate, comprising:
A method of manufacturing an electronic device, wherein the organic film is formed by the film forming method according to claim 11. A method of manufacturing an electronic device having a metal film formed on a substrate, comprising:
A method of manufacturing an electronic device, wherein the metal film is formed by the film forming method according to claim 11.   The method of manufacturing an electronic device according to claim 12, wherein the electronic device is a display panel of an organic EL display device.

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