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JP6668749B2 - ホルダジョイント - Google Patents

ホルダジョイント Download PDF

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Publication number
JP6668749B2
JP6668749B2 JP2015255604A JP2015255604A JP6668749B2 JP 6668749 B2 JP6668749 B2 JP 6668749B2 JP 2015255604 A JP2015255604 A JP 2015255604A JP 2015255604 A JP2015255604 A JP 2015255604A JP 6668749 B2 JP6668749 B2 JP 6668749B2
Authority
JP
Japan
Prior art keywords
holder
opening hole
joint
flat surfaces
mounting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015255604A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017119348A (ja
Inventor
良太 阪口
良太 阪口
吉也 佐々木
吉也 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2015255604A priority Critical patent/JP6668749B2/ja
Priority to TW105138549A priority patent/TWI599462B/zh
Priority to KR1020160169511A priority patent/KR101895778B1/ko
Priority to CN201611170308.6A priority patent/CN106914994A/zh
Publication of JP2017119348A publication Critical patent/JP2017119348A/ja
Application granted granted Critical
Publication of JP6668749B2 publication Critical patent/JP6668749B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B26D7/2621—Means for mounting the cutting member for circular cutters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Forests & Forestry (AREA)
  • Mining & Mineral Resources (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
JP2015255604A 2015-12-28 2015-12-28 ホルダジョイント Active JP6668749B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015255604A JP6668749B2 (ja) 2015-12-28 2015-12-28 ホルダジョイント
TW105138549A TWI599462B (zh) 2015-12-28 2016-11-24 Hold the connector
KR1020160169511A KR101895778B1 (ko) 2015-12-28 2016-12-13 홀더 조인트
CN201611170308.6A CN106914994A (zh) 2015-12-28 2016-12-16 保持具接头

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015255604A JP6668749B2 (ja) 2015-12-28 2015-12-28 ホルダジョイント

Publications (2)

Publication Number Publication Date
JP2017119348A JP2017119348A (ja) 2017-07-06
JP6668749B2 true JP6668749B2 (ja) 2020-03-18

Family

ID=59271589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015255604A Active JP6668749B2 (ja) 2015-12-28 2015-12-28 ホルダジョイント

Country Status (4)

Country Link
JP (1) JP6668749B2 (ko)
KR (1) KR101895778B1 (ko)
CN (1) CN106914994A (ko)
TW (1) TWI599462B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019188649A (ja) 2018-04-20 2019-10-31 三星ダイヤモンド工業株式会社 ホルダユニット
CN110405954B (zh) * 2018-04-27 2022-10-21 三星钻石工业股份有限公司 保持器单元及销
JP7209349B2 (ja) 2018-04-27 2023-01-20 三星ダイヤモンド工業株式会社 ホルダユニットおよびピン
JP2019209506A (ja) 2018-05-31 2019-12-12 三星ダイヤモンド工業株式会社 ホルダユニットおよびスクライブ方法
JP7357892B2 (ja) * 2018-12-27 2023-10-10 三星ダイヤモンド工業株式会社 ホルダジョイント、ホルダユニット、およびスクライブ装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4948725B2 (ja) * 2000-12-05 2012-06-06 三星ダイヤモンド工業株式会社 チップホルダー
JP2003071789A (ja) * 2001-08-30 2003-03-12 Honda Electronic Co Ltd 超音波カッター
WO2007063979A1 (ja) * 2005-12-01 2007-06-07 Mitsuboshi Diamond Industrial Co., Ltd. スクライブ装置、スクライブ方法及びチップホルダ
EP2153961A4 (en) * 2007-06-06 2017-04-26 Mitsuboshi Diamond Industrial Co., Ltd. Tip holder for hand cutter, and hand cutter having the tip holder
JP5353085B2 (ja) 2008-06-23 2013-11-27 三星ダイヤモンド工業株式会社 ホルダジョイント、ホルダユニット、スクライブヘッド及びスクライブ装置
KR20120052007A (ko) * 2010-11-15 2012-05-23 신한다이아몬드공업 주식회사 스크라이버 홀더
JP5447994B2 (ja) 2011-07-25 2014-03-19 三星ダイヤモンド工業株式会社 ホルダジョイント、スクライブヘッド及びスクライブ装置
JP2014008714A (ja) * 2012-06-29 2014-01-20 Mitsuboshi Diamond Industrial Co Ltd チップホルダ収納体
JP5906148B2 (ja) * 2012-06-29 2016-04-20 三星ダイヤモンド工業株式会社 チップホルダ収納体
JP2014008711A (ja) * 2012-06-29 2014-01-20 Mitsuboshi Diamond Industrial Co Ltd チップホルダ及びチップホルダ収納セット
CN104129912A (zh) * 2014-07-29 2014-11-05 北京沃尔德超硬工具有限公司 一种易于拆卸的防尘刀轮

Also Published As

Publication number Publication date
CN106914994A (zh) 2017-07-04
KR20170077789A (ko) 2017-07-06
KR101895778B1 (ko) 2018-09-07
TWI599462B (zh) 2017-09-21
TW201722667A (zh) 2017-07-01
JP2017119348A (ja) 2017-07-06

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