JP6277555B2 - 太陽電池 - Google Patents
太陽電池 Download PDFInfo
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- JP6277555B2 JP6277555B2 JP2014549800A JP2014549800A JP6277555B2 JP 6277555 B2 JP6277555 B2 JP 6277555B2 JP 2014549800 A JP2014549800 A JP 2014549800A JP 2014549800 A JP2014549800 A JP 2014549800A JP 6277555 B2 JP6277555 B2 JP 6277555B2
- Authority
- JP
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- Prior art keywords
- texture
- solar cell
- textures
- amorphous silicon
- silicon layer
- Prior art date
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- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 238000002508 contact lithography Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000004050 hot filament vapor deposition Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Description
Claims (6)
- 表面に複数のテクスチャを有する半導体基板を備える太陽電池であって、
前記複数のテクスチャのそれぞれは、略四角錐状の凸形状を有し、
前記複数のテクスチャは、第1テクスチャと、前記第1テクスチャと互いに隣り合う第2テクスチャとを含み、
前記第1テクスチャの頂点の曲率半径は、前記第1テクスチャと前記第2テクスチャとの間の谷部の曲率半径より大きい、太陽電池。 - 表面に複数のテクスチャを有する半導体基板を備える太陽電池であって、
前記複数のテクスチャのそれぞれは、凸形状を有し、
前記凸形状は、その表面に前記半導体基板の(111)面が露出するように形成され、
前記複数のテクスチャは、第1テクスチャと、前記第1テクスチャと互いに隣り合う第2テクスチャとを含み、
前記第1テクスチャの頂点の曲率半径は、前記第1テクスチャと前記第2テクスチャとの間の谷部の曲率半径より大きい、太陽電池。 - 前記第1のテクスチャは、谷から頂点に向かって傾きが小さくなるように折れ曲がる、
請求項1に記載の太陽電池。 - 前記表面は受光面である請求項1または2に記載の太陽電池。
- 前記表面は裏面である請求項1または2に記載の太陽電池。
- 前記表面上に形成された非晶質シリコン層と、
前記非晶質シリコン層上に形成された透明導電層と、をさらに備えた、
請求項1または2に記載の太陽電池。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012260876 | 2012-11-29 | ||
JP2012260876 | 2012-11-29 | ||
PCT/JP2013/006797 WO2014083804A1 (ja) | 2012-11-29 | 2013-11-19 | 太陽電池 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014083804A1 JPWO2014083804A1 (ja) | 2017-01-05 |
JP6277555B2 true JP6277555B2 (ja) | 2018-02-14 |
Family
ID=50827466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014549800A Expired - Fee Related JP6277555B2 (ja) | 2012-11-29 | 2013-11-19 | 太陽電池 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20150228817A1 (ja) |
JP (1) | JP6277555B2 (ja) |
WO (1) | WO2014083804A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017051635A1 (ja) * | 2015-09-24 | 2017-03-30 | シャープ株式会社 | 半導体基板、光電変換素子、半導体基板の製造方法および光電変換素子の製造方法 |
EP3591717A1 (en) | 2017-03-31 | 2020-01-08 | Kaneka Corporation | Solar cell, solar cell module, and solar cell manufacturing method |
KR102541379B1 (ko) * | 2017-05-29 | 2023-06-08 | 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | 페로브스카이트 실리콘 탠덤 태양전지 및 제조 방법 |
WO2021201030A1 (ja) * | 2020-03-30 | 2021-10-07 | 株式会社カネカ | 太陽電池および太陽電池の製造方法 |
CN113540269B (zh) * | 2021-09-14 | 2022-04-12 | 浙江晶科能源有限公司 | 太阳能电池及其制备方法、光伏组件 |
CN116722054B (zh) * | 2022-06-10 | 2024-05-10 | 浙江晶科能源有限公司 | 太阳能电池及太阳能电池的制备方法、光伏组件 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63150975A (ja) * | 1986-12-15 | 1988-06-23 | Nisshin Steel Co Ltd | アモルフアスシリコン太陽電池基板の製造方法 |
JP3271990B2 (ja) * | 1997-03-21 | 2002-04-08 | 三洋電機株式会社 | 光起電力素子及びその製造方法 |
JP2003142708A (ja) * | 2001-10-31 | 2003-05-16 | Sony Corp | 単結晶半導体薄膜の製造方法および薄膜半導体素子の製造方法 |
JP2010278401A (ja) * | 2009-06-01 | 2010-12-09 | Sharp Corp | シリコンシート、太陽電池およびその製造方法 |
JP2011009548A (ja) * | 2009-06-26 | 2011-01-13 | Toppan Printing Co Ltd | 反射保護シート及びこれを用いた半導体発電装置 |
NL2003390C2 (en) * | 2009-08-25 | 2011-02-28 | Stichting Energie | Solar cell and method for manufacturing such a solar cell. |
JP5537101B2 (ja) * | 2009-09-10 | 2014-07-02 | 株式会社カネカ | 結晶シリコン系太陽電池 |
US8124437B2 (en) * | 2009-12-21 | 2012-02-28 | Du Pont Apollo Limited | Forming protrusions in solar cells |
JP5675476B2 (ja) * | 2011-04-18 | 2015-02-25 | 株式会社カネカ | 結晶シリコン系太陽電池 |
-
2013
- 2013-11-19 JP JP2014549800A patent/JP6277555B2/ja not_active Expired - Fee Related
- 2013-11-19 WO PCT/JP2013/006797 patent/WO2014083804A1/ja active Application Filing
-
2015
- 2015-04-24 US US14/695,670 patent/US20150228817A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20150228817A1 (en) | 2015-08-13 |
WO2014083804A1 (ja) | 2014-06-05 |
JPWO2014083804A1 (ja) | 2017-01-05 |
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