JP6176163B2 - 有機ケイ素化合物及び接着性組成物並びに物品 - Google Patents
有機ケイ素化合物及び接着性組成物並びに物品 Download PDFInfo
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- JP6176163B2 JP6176163B2 JP2014061196A JP2014061196A JP6176163B2 JP 6176163 B2 JP6176163 B2 JP 6176163B2 JP 2014061196 A JP2014061196 A JP 2014061196A JP 2014061196 A JP2014061196 A JP 2014061196A JP 6176163 B2 JP6176163 B2 JP 6176163B2
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- 150000007523 nucleic acids Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- QROGIFZRVHSFLM-UHFFFAOYSA-N prop-1-enylbenzene Chemical group CC=CC1=CC=CC=C1 QROGIFZRVHSFLM-UHFFFAOYSA-N 0.000 description 1
- 125000006410 propenylene group Chemical group 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/002—Priming paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5455—Silicon-containing compounds containing nitrogen containing at least one group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/548—Silicon-containing compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/12—Ceramic
- C09J2400/123—Ceramic in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
Description
〔1〕
下記式(1)で表される有機ケイ素化合物。
〔2〕
前記R 1 〜R 4 が、各々独立に水素原子、並びに下記式(7)及び(15)で表される有機基から選ばれるが、R 1 〜R 4 の少なくとも一つは下記式(7)及び(15)で表される有機基のいずれかである〔1〕記載の有機ケイ素化合物。
〔3〕
前記R 1 〜R 4 が、各々独立に水素原子、並びに下記式(7)及び(15)で表される有機基から選ばれるが、R 1 〜R 4 の一つは下記式(7)及び(15)で表される有機基のいずれかである〔1〕記載の有機ケイ素化合物。
〔4〕
前記R 7 が、炭素数1〜10のアルキル基である〔1〕記載の有機ケイ素化合物。
〔5〕
前記mが、3である〔1〕〜〔4〕のいずれか記載の有機ケイ素化合物。
〔6〕
〔1〕〜〔5〕のいずれかに記載の有機ケイ素化合物を含有する接着性組成物。
〔7〕
〔6〕記載の接着性組成物にて表面処理された基材を含む物品。
〔8〕
表面処理される基材が、ガラスクロス、ガラステープ、ガラスマット、ガラスペーパーから選ばれるガラス繊維製品である〔7〕記載の物品。
〔9〕
表面処理される基材が、無機フィラーである〔7〕記載の物品。
〔10〕
表面処理される基材が、セラミック又は金属である〔7〕記載の物品。
本発明の有機ケイ素化合物(シランカップリング剤)の特徴として、下記構造(i)、(ii)を共に有することが挙げられる。
(i)加水分解性シリル基
(ii)カテコール基
(式中、R1〜R4は各々独立に水素原子;置換基を有してもよく、エーテル結合、チオエーテル結合、カルボニル結合及びチオカルボニル結合から選ばれる1以上の結合が介在してもよい一価の炭化水素基;及び下記式(2)〜(5)で表される有機基から選ばれるが、R1〜R4の少なくとも一つは下記式(2)〜(5)で表される有機基のいづれかである。)
(式中、R5は置換基を有してよく、エーテル結合、チオエーテル結合、カルボニル結合、チオカルボニル結合、アミノ結合、ウレタン結合及びウレア結合から選ばれる1以上の結合が介在してもよい二価の炭化水素基であり、R6は炭素数1〜10のアルキル基又は炭素数6〜10のアリール基であり、R7は炭素数1〜20のアルキル基、炭素数2〜10のアルケニル基、炭素数6〜10のアリール基、又は炭素数1〜20のアシル基であり、nは1〜3の整数を表す。波線はベンゼン環に対する結合位置を示す。)
また、pH調整剤として、酸又は塩基を使用してもよく、この場合、組成物のpHは2〜13、特に3〜12であることが好ましい。
低分子材料の配合量は、組成物中好ましくは99質量%以下、更に好ましくは50質量%以下、特に好ましくは1〜30質量%である。
高分子材料の配合量は、組成物中好ましくは99質量%以下、更に好ましくは50質量%以下、特に好ましくは1〜30質量%である。
また、代表的な硬化条件としては、加熱・乾燥が挙げられ、表面処理後に60〜180℃、好ましくは80〜150℃で5分〜2時間加熱・乾燥し、溶媒の除去と同時に表面処理剤中の主成分であるシランカップリング剤と基材表面とを化学反応させることが好ましい。
[合成例1]
撹拌機、還流冷却器、滴下ロート及び温度計を備えた2Lセパラブルフラスコに、4−アリルカテコール150g(1モル)、白金−1,3−ジビニル−1,1,3,3−テトラメチルジシロキサン錯体のトルエン溶液(白金原子として1×10-4モル)を納め、トリメトキシシラン122g(1モル)を内温75〜85℃で2時間かけて滴下した。その後、80℃で1時間撹拌し、室温まで冷却した後、メタノールを1088g投入した。得られた有機ケイ素化合物(16)を含有する溶液をシラン溶液Aとする。
撹拌機、還流冷却器、滴下ロート及び温度計を備えた2Lセパラブルフラスコに、4−アリルカテコール150g(1モル)、2,2’−アゾビス(2−メチルブチロニトリル)(和光純薬製、V−59)3.5gを納め、3−メルカプトプロピルトリエトキシシラン196g(1モル)を内温75〜85℃で1時間かけて滴下した。その後、80℃で1時間撹拌し、室温まで冷却した後、メタノール1384gを投入した。得られた有機ケイ素化合物(17)を含有する溶液をシラン溶液Bとする。
撹拌機、還流冷却器、滴下ロート及び温度計を備えた1Lセパラブルフラスコに、ピロガロール126g(1モル)、ジオクチルスズオキサイド0.25g、MIBK662gを納め、3−イソシアネートプロピルトリエトキシシラン205g(1モル)を内温90℃で1時間かけて滴下した。その後、90℃で1時間撹拌し、室温まで冷却した後、メタノール662gを投入した。得られた有機ケイ素化合物(18)を含有する溶液をシラン溶液Cとする。
[実施例1〜3、比較例1,2]
上記で得られたシラン溶液A〜C又は3−アミノプロピルトリエトキシシラン(信越化学工業(株)製、KBE−903)が1質量%となるように水、メタノールで希釈したものを表面処理剤とし、ガラス繊維(直径20μm)に処理した後、100℃で30分間乾燥することで表面処理ガラス繊維を得た。該表面処理ガラス繊維上に、エポキシ樹脂(ジャパンエポキシレジン社製:JER828)と硬化剤(トリエチレンテトラミン)より構成される熱硬化組成物の直径数十μm〜数百μmの液滴を、液滴同士が接触しないように付着させた後、熱硬化(80℃で1.5時間処理した後、100℃で2時間処理)して球状樹脂成型物を成形し、複合界面特性評価装置(東栄産業社製:HM410)を用いたマイクロドロップレット法により表面処理ガラス繊維−エポキシ樹脂間のせん断強度を測定した。ここで、繊維の直径をD[μm]、球状樹脂成型物に埋め込まれた部分の繊維の長さをL[μm]、該球状樹脂成型物を繊維軸方向に引き抜く際の荷重をF[mN]とすると、単位面積あたりのせん断強度τ[MPa]はτ=F/πDLによって求められる。使用した表面処理剤の主成分とせん断強度の結果を表1に示す。
Claims (10)
- 下記式(1)で表される有機ケイ素化合物。
- 前記R 1 〜R 4 が、各々独立に水素原子、並びに下記式(7)及び(15)で表される有機基から選ばれるが、R 1 〜R 4 の少なくとも一つは下記式(7)及び(15)で表される有機基のいずれかである請求項1記載の有機ケイ素化合物。
- 前記R 1 〜R 4 が、各々独立に水素原子、並びに下記式(7)及び(15)で表される有機基から選ばれるが、R 1 〜R 4 の一つは下記式(7)及び(15)で表される有機基のいずれかである請求項1記載の有機ケイ素化合物。
- 前記R 7 が、炭素数1〜10のアルキル基である請求項1記載の有機ケイ素化合物。
- 前記mが、3である請求項1〜4のいずれか1項記載の有機ケイ素化合物。
- 請求項1〜5のいずれか1項記載の有機ケイ素化合物を含有する接着性組成物。
- 請求項6記載の接着性組成物にて表面処理された基材を含む物品。
- 表面処理される基材が、ガラスクロス、ガラステープ、ガラスマット、ガラスペーパーから選ばれるガラス繊維製品である請求項7記載の物品。
- 表面処理される基材が、無機フィラーである請求項7記載の物品。
- 表面処理される基材が、セラミック又は金属である請求項7記載の物品。
Priority Applications (5)
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JP2014061196A JP6176163B2 (ja) | 2014-03-25 | 2014-03-25 | 有機ケイ素化合物及び接着性組成物並びに物品 |
EP15155933.3A EP2924043B1 (en) | 2014-03-25 | 2015-02-20 | Organosilicon compound, adhesive composition and article |
US14/632,182 US9303048B2 (en) | 2014-03-25 | 2015-02-26 | Organosilicon compound, adhesive composition and article |
CN201510131665.0A CN104945429A (zh) | 2014-03-25 | 2015-03-25 | 有机硅化合物、粘合剂组合物和制品 |
US14/921,268 US9464100B2 (en) | 2014-03-25 | 2015-10-23 | Organosilicon compound, adhesive composition and article |
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CN108698974A (zh) | 2016-01-28 | 2018-10-23 | 阿卡特肖勒公司 | 光裂解底漆组合物和使用方法 |
EP3408272A1 (en) | 2016-01-28 | 2018-12-05 | Acatechol, Inc. | Surface primer compositions and methods of use |
WO2019198598A1 (ja) * | 2018-04-13 | 2019-10-17 | 国立研究開発法人産業技術総合研究所 | オイゲノール誘導体 |
CN108794042B (zh) * | 2018-07-13 | 2020-11-10 | 航天材料及工艺研究所 | 一种用于多孔陶瓷的粘结剂及其制备方法和使用方法 |
JP7327284B2 (ja) | 2020-06-01 | 2023-08-16 | 信越化学工業株式会社 | カテコール官能性オルガノポリシロキサン、その製造方法及び粉体処理剤 |
CN112480863B (zh) * | 2020-12-04 | 2023-01-17 | 江苏晟大元通新材料科技有限公司 | 一种有机硅灌封胶的制备方法 |
US11643574B2 (en) | 2021-05-28 | 2023-05-09 | Cohesys Inc. | Adhesive devices and uses thereof |
CN117965068B (zh) * | 2024-01-17 | 2024-07-12 | 惠州市德泰士达科技有限公司 | 一种高粘结强度的防水防腐涂料的制备方法和应用 |
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JPS61100587A (ja) * | 1984-10-22 | 1986-05-19 | Chisso Corp | 有機珪素化合物 |
JP2701695B2 (ja) * | 1993-06-07 | 1998-01-21 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP4232276B2 (ja) * | 1999-05-26 | 2009-03-04 | Jsr株式会社 | 加水分解性シラン化合物およびその製造方法 |
KR100707767B1 (ko) * | 1999-09-28 | 2007-04-17 | 후지필름 가부시키가이샤 | 포지티브 포토레지스트 조성물 |
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JP2001100418A (ja) * | 1999-09-28 | 2001-04-13 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
JP4543577B2 (ja) * | 2001-05-22 | 2010-09-15 | 東亞合成株式会社 | 保護されたカテコール基を有する有機ケイ素化合物及びその製造方法 |
JP4156858B2 (ja) * | 2002-04-03 | 2008-09-24 | 岡本化学工業株式会社 | シランカップリング剤 |
JP2009084318A (ja) * | 2007-09-27 | 2009-04-23 | Fujifilm Corp | 親水性樹脂組成物及びそれを用いた親水性部材 |
JP4844768B2 (ja) * | 2008-11-04 | 2011-12-28 | 信越化学工業株式会社 | 反応性紫外線吸収剤及び硬化性紫外線遮蔽膜形成用塗布液、紫外線遮蔽膜並びに該紫外線遮蔽膜が形成された紫外線遮蔽機能を有する基材 |
DE102008057684A1 (de) * | 2008-11-17 | 2010-05-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Dialkoxy- oder Dihydroxyphenylreste enthaltende Silane, daraus hergestellte Klebstoffe sowie Verfahren zur Herstellung der Silane und der Klebstoffe |
JP5317677B2 (ja) | 2008-12-22 | 2013-10-16 | 株式会社デンソー | メッキ基板の接着方法、表面改質メッキ基板および複合成型体 |
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JP2015182977A (ja) | 2015-10-22 |
US9303048B2 (en) | 2016-04-05 |
CN104945429A (zh) | 2015-09-30 |
US20150274759A1 (en) | 2015-10-01 |
US9464100B2 (en) | 2016-10-11 |
US20160039849A1 (en) | 2016-02-11 |
EP2924043B1 (en) | 2017-12-20 |
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