JP5485546B2 - 接合体、ハニカムセグメント接合体、及びそれを用いたハニカム構造体 - Google Patents
接合体、ハニカムセグメント接合体、及びそれを用いたハニカム構造体 Download PDFInfo
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- JP5485546B2 JP5485546B2 JP2008509733A JP2008509733A JP5485546B2 JP 5485546 B2 JP5485546 B2 JP 5485546B2 JP 2008509733 A JP2008509733 A JP 2008509733A JP 2008509733 A JP2008509733 A JP 2008509733A JP 5485546 B2 JP5485546 B2 JP 5485546B2
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- bonding material
- honeycomb
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- material layer
- body according
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- 239000000463 material Substances 0.000 claims description 125
- 239000000945 filler Substances 0.000 claims description 56
- 239000000203 mixture Substances 0.000 claims description 35
- 239000000835 fiber Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 11
- 239000004927 clay Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 9
- 239000012784 inorganic fiber Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 229910021647 smectite Inorganic materials 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000008119 colloidal silica Substances 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- 229910052878 cordierite Inorganic materials 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 239000010445 mica Substances 0.000 claims description 5
- 229910052618 mica group Inorganic materials 0.000 claims description 5
- 239000000454 talc Substances 0.000 claims description 5
- 229910052623 talc Inorganic materials 0.000 claims description 5
- 229910000505 Al2TiO5 Inorganic materials 0.000 claims description 4
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000391 magnesium silicate Substances 0.000 claims description 4
- 229910052919 magnesium silicate Inorganic materials 0.000 claims description 4
- 235000019792 magnesium silicate Nutrition 0.000 claims description 4
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 claims description 4
- 229910000323 aluminium silicate Inorganic materials 0.000 claims description 3
- FGZBFIYFJUAETR-UHFFFAOYSA-N calcium;magnesium;silicate Chemical compound [Mg+2].[Ca+2].[O-][Si]([O-])([O-])[O-] FGZBFIYFJUAETR-UHFFFAOYSA-N 0.000 claims description 3
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 3
- 229910000166 zirconium phosphate Inorganic materials 0.000 claims description 3
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 51
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 7
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- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
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- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- 229910002060 Fe-Cr-Al alloy Inorganic materials 0.000 description 1
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- 229910003564 SiAlON Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
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- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
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Images
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- F01N3/02—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust
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Description
本発明のハニカム構造体1は、図1及び図2に示すように、多孔質の隔壁6によって区画、形成された流体の流路となる複数のセル5がハニカム構造体1の中心軸方向に互いに並行するように配設された構造を有し、それぞれが全体構造の一部を構成する形状を有するとともに、ハニカム構造体1の中心軸に対して垂直な方向に組み付けられることによって全体構造を構成することになる形状を有する複数のハニカムセグメント2が、本発明の接合材組成物(接合材)から形成された接合材層9によって一体的に接合されたハニカムセグメント接合体として構成されてなるものである。
(ハニカムセグメントの作製)
ハニカムセグメント原料として、SiC粉末及び金属Si粉末を80:20の質量割合で混合し、これに造孔材、有機バインダー、界面活性剤及び水を添加して、可塑性の坏土を作製した。この坏土を押出成形し、乾燥して隔壁の厚さが310μm、セル密度が約46.5セル/cm2(300セル/平方インチ)、断面が一辺35mmの正四角形、長さが152mmのハニカムセグメント成形体を得た。このハニカムセグメント成形体を、端面が市松模様状を呈するように、セルの両端面を目封じした。すなわち、隣接するセルが、互いに反対側の端部で封じられるように目封じを行った。目封じ材としては、ハニカムセグメント原料と同様な材料を用いた。セルの両端面を目封じし、乾燥させた後、大気雰囲気中約400℃で脱脂し、その後、Ar不活性雰囲気で約1450℃で焼成して、SiC結晶粒子をSiで結合させた、多孔質構造を有するハニカムセグメントを得た。
表1及び表2に示すフィラー種(フィラーA及び/又はフィラーB)を混合したものに、分散剤、発泡樹脂、スメクタイト系粘土及び有機バインダー(CMCとMC)を添加し、更にマトリックスとしてコロイダルシリカを混合し、ミキサーにて30分間混練を行い、表1及び表2に示す種類及び組成比の異なるペースト状の接合材組成物(接合材No.1〜27)をそれぞれ得た。尚、このときの接合材組成物中の全フィラーの割合は、表1及び表2の「接合材組成物中のフィラー体積分率」欄のフィラーAとフィラーBの合計である。例えば、接合材No.1の場合は、50%であり、また、接合材組成物中のマトリックスの割合は、表1の「接合材組成物中のフィラー体積分率」欄のフィラーAとフィラーBの合計を100から除したものである。例えば、接合材No.1の場合は、50%である。また、表1及び表2の「その他」の欄、分散剤、発泡樹脂及び有機バインダーは、全フィラーおよびマトリックスの合計に対し、外配で添加した。
ハニカムセグメントの外壁面に、厚さ約1mmとなるように接合材をコーティングして接合材層を形成し、その上に別のハニカムセグメントを載置する工程を繰り返し、4×4に組み合わした16個のハニカムセグメントからなるハニカムセグメント積層体を作製し、適宜、外部より圧力を加えるなどして、全体を接合させた後、140℃、2時間乾燥してハニカムセグメント接合体を、接合材(No.1〜27)ごとにそれぞれ得た。得られたハニカムセグメント接合体の外周を円筒状に切断後、その外周面をコーティング材で塗布し、700℃、2時間、乾燥硬化させ、ハニカム構造体をそれぞれ得た。
それぞれ得られたハニカム構造体の中の接合材層のヤング率、平均熱膨張係数、気孔率は、ハニカム構造体の接合材層を切断して所定の形状のサンプルを切り出し、JIS R1601に準じた3点曲げ試験における荷重-変位曲線よりヤング率を、JIS R1618に順じた平均線熱膨張係数を、アルキメデス法により気孔率をそれぞれ測定した。その結果を表3及び表4に示す。
得られたハニカム構造体の接合状態、急速加熱試験(バーナースポーリング試験B−sp)、急速冷却試験(電気炉スポーリング試験E−sp)及びエンジン試験(E/G試験)をそれぞれ行った。その結果を表3及び表4に示す。
接合・硬化後の接合部の状態を目視観察するとともに、接合強度を手の感触で観測した。尚、表3及び表4の表示では、◎の場合、強固な接合状態でクラックや欠陥が無い状態であり、○の場合、◎と比較してクラックや欠陥が若干ある接合状態であり、×の場合、簡単にはがれるあるいは外れる程度の接合状態、もしくはクラックや欠陥が多い状態を意味する。
ハニカム構造体にバーナーで加熱した空気を流すことにより中心部分と外側部分との温度差をつくり、ハニカム構造体のクラックの発生しない温度により耐熱衝撃性を評価する試験(温度が高いほど耐熱衝撃性が高い)である。尚、表3及び表4の数字はクラックの発生しない温度の上限を意味する。
ハニカム構造体を電気炉にて550℃×2h加熱し、均一な温度(450℃)にした後、室温に取り出し、ハニカム構造体のクラック発生の有無により耐熱衝撃性を評価する試験である。尚、表3及び表4の表示では、○の場合、クラック発生なし、×の場合、クラック発生ありを意味する。
フィルター再生のために堆積したパーティキュレートを燃焼させ、ハニカム中心部の温度が1000℃となる条件にて、ハニカム構造体のクラックの有無により耐熱衝撃性を評価する試験である。尚、表3及び表4の表示では、○の場合、クラック発生なし、×の場合、クラック発生ありを意味する。
表3及び表4の結果から、実施例1〜22は、接合材層のヤング率が被接合物の20%以下、且つ平均線熱膨張係数が、被接合物の70%以下であるため、各種試験後、それぞれのハニカム構造体にクラックや欠陥等の不良が見られず、良好な結果を得ることができた。
Claims (12)
- 二つ以上の被接合物が接合材層を介して一体化されてなる接合体であって、接合材層のヤング率が被接合物の20%以下、且つ平均線熱膨張係数が被接合物の70%以下であり、接合材層は、平均線熱膨張係数が2.0×10−6・K−1以下のフィラーを含有するフィラーとマトリックスが主成分である接合材組成物から作製されてなり、
前記平均線熱膨張係数が2.0×10−6・K−1以下のフィラーが、コージェライト、非晶質シリカ、チタン酸アルミニウム、リン酸ジルコニウム、アルミノシリケートファイバーの群から選択される少なくとも1種以上であるとともに、前記フィラー全体に対して50体積%以上であり、且つ、前記マトリックスが、コロイダルシリカであり、
前記接合材組成物として発泡樹脂を0.1〜5質量%含むとともに、前記接合材組成物に含まれる水分が、16〜40質量%である接合体。 - 前記接合材層の平均線熱膨張係数が、2.5×10−6・K−1以下である請求項1に記載の接合体。
- 前記接合材層の気孔率が、25〜85%である請求項1又は2に記載の接合体。
- 前記フィラーとして無機繊維を含有する請求項1〜3のいずれか1項に記載の接合体。
- 前記無機繊維が、アルミナファイバー、マグネシウムシリケートファイバー、カルシウムマグネシウムシリケートファイバーの群から選択される少なくとも1種以上である請求項4に記載の接合体。
- 前記フィラーとして板状粒子を含有する請求項1〜5のいずれか1項に記載の接合体。
- 前記板状粒子が、窒化ホウ素、タルク、マイカ、ガラスフレークの群から選択される少なくとも1種以上である請求項6に記載の接合体。
- 前記接合材組成物中に占めるフィラーの体積分率が、20〜80%である請求項1〜7のいずれか1項に記載の接合体。
- 前記接合材組成物の副成分として、有機バインダー、発泡樹脂、スメクタイト系粘土、分散剤、水の群から選択される少なくとも1種以上が含まれる請求項1〜8のいずれか1項に記載の接合体。
- 前記接合材組成物の副成分であるスメクタイト系粘土を0.1〜5質量%含む請求項1〜9のいずれか1項に記載の接合体。
- 請求項1〜10のいずれか1項に記載の接合体の接合材層に用いられる接合材組成物により、複数のハニカムセグメント同士を接合して作製されたハニカムセグメント接合体。
- 請求項11に記載のハニカムセグメント接合体から作製されたハニカム構造体。
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US7964263B2 (en) | 2011-06-21 |
US20090041975A1 (en) | 2009-02-12 |
EP2008985A4 (en) | 2010-06-02 |
EP2008985B1 (en) | 2015-06-24 |
KR20090007720A (ko) | 2009-01-20 |
KR101081638B1 (ko) | 2011-11-09 |
WO2007116665A1 (ja) | 2007-10-18 |
JPWO2007116665A1 (ja) | 2009-08-20 |
EP2008985A1 (en) | 2008-12-31 |
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