JP5308108B2 - 回路装置の製造方法 - Google Patents
回路装置の製造方法 Download PDFInfo
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- JP5308108B2 JP5308108B2 JP2008233781A JP2008233781A JP5308108B2 JP 5308108 B2 JP5308108 B2 JP 5308108B2 JP 2008233781 A JP2008233781 A JP 2008233781A JP 2008233781 A JP2008233781 A JP 2008233781A JP 5308108 B2 JP5308108 B2 JP 5308108B2
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- circuit board
- resin
- mold
- sealing resin
- resin sheet
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 229920005989 resin Polymers 0.000 claims description 213
- 239000011347 resin Substances 0.000 claims description 213
- 238000007789 sealing Methods 0.000 claims description 123
- 238000000034 method Methods 0.000 claims description 23
- 229920001187 thermosetting polymer Polymers 0.000 claims description 22
- 239000000945 filler Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000001723 curing Methods 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
12 回路基板
14 封止樹脂
14A 第1封止樹脂
14B 第2封止樹脂
16 導電パターン
17 リード
18 絶縁層
20A 半導体素子
20B チップ素子
22 金属細線
30 金型
32 上金型
34 下金型
36 キャビティ
38 ランナー
40,40A,40B,40C ポッド
42 樹脂シート
44 ゲート
46 エアベント
48 タブレット
50 プランジャー
52 当接ピン
Claims (6)
- 導電パターンおよび回路素子から成る混成集積回路を回路基板の上面に組み込む工程と、
前記回路基板をモールド金型のキャビティに収納させて、前記キャビティに封止樹脂を注入することで、前記回路基板の上面、側面および下面を、熱硬化性樹脂を含む封止樹脂により封止する工程と、を備え、
前記封止する工程では、熱硬化性樹脂を含む樹脂シートを、前記回路基板と前記モールド金型の内壁下面との間に介在させ、溶融した前記樹脂シートにより前記回路基板の下面を被覆し、
前記回路基板の対向する側辺から導出されるリードを前記モールド金型で狭持することにより、前記樹脂シートが前記回路基板の下面に押圧された状態で固定され、
溶融した前記樹脂シートから成る封止樹脂により前記回路基板の下面が被覆される厚さは、前記樹脂シートよりも薄いことを特徴とする回路装置の製造方法。 - 前記封止する工程では、前記樹脂シートを溶融させた後に、前記モールド金型のゲートから前記キャビティに液状の封止樹脂を注入し、
前記樹脂シートを、前記注入される前記封止樹脂よりも先に加熱硬化させることを特徴とする請求項1に記載の回路装置の製造方法。 - 前記樹脂シートは、加熱硬化する前の粉体の前記熱硬化性樹脂を加圧して成形されることを特徴とする請求項1または請求項2に記載の回路装置の製造方法。
- 前記モールド金型のゲートから前記キャビティに注入される樹脂と、前記樹脂シートとは組成が同じであることを特徴とする請求項1から請求項3の何れかに記載の回路装置の製造方法。
- 前記樹脂シートの大きさを前記回路基板よりも大きく形成し、前記回路基板の下面全域を前記樹脂シートにより被覆することを特徴とする請求項1から請求項4の何れかに記載の回路装置の製造方法。
- 溶融した前記樹脂シートから成り前記回路基板の下面を被覆する前記封止樹脂に含まれるフィラーは、前記モールド金型のゲートから注入されて前記回路基板の上面を被覆する前記封止樹脂に含まれるフィラーよりも、均一に分散した状態であることを特徴とする請求項1から請求項5の何れかに記載の回路装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008233781A JP5308108B2 (ja) | 2008-09-11 | 2008-09-11 | 回路装置の製造方法 |
US12/557,882 US8084301B2 (en) | 2008-09-11 | 2009-09-11 | Resin sheet, circuit device and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008233781A JP5308108B2 (ja) | 2008-09-11 | 2008-09-11 | 回路装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2010067852A JP2010067852A (ja) | 2010-03-25 |
JP5308108B2 true JP5308108B2 (ja) | 2013-10-09 |
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JP2008233781A Active JP5308108B2 (ja) | 2008-09-11 | 2008-09-11 | 回路装置の製造方法 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012004435A (ja) * | 2010-06-18 | 2012-01-05 | On Semiconductor Trading Ltd | 回路装置の製造方法および樹脂封止装置 |
JP5563917B2 (ja) | 2010-07-22 | 2014-07-30 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置及びその製造方法 |
JP5607447B2 (ja) | 2010-07-22 | 2014-10-15 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置 |
KR20130138010A (ko) * | 2012-06-08 | 2013-12-18 | 현대모비스 주식회사 | 휴대용 전자통신 장치 및 이의 제조 방법 |
JP2015215061A (ja) * | 2014-05-12 | 2015-12-03 | 日本精工株式会社 | 転がり軸受 |
CN117334644B (zh) * | 2023-11-29 | 2024-02-13 | 四川弘智远大科技有限公司 | 一种集成电路封装的实时固化结构 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05102216A (ja) * | 1991-10-09 | 1993-04-23 | Hitachi Ltd | 半導体装置 |
JP2781689B2 (ja) * | 1992-01-22 | 1998-07-30 | 九州日本電気株式会社 | 半導体装置の製造方法 |
JP2758769B2 (ja) * | 1992-02-28 | 1998-05-28 | 九州日本電気株式会社 | 半導体装置製造方法 |
JP3455116B2 (ja) * | 1998-09-30 | 2003-10-14 | 株式会社三井ハイテック | 半導体装置の製造方法 |
JP4623871B2 (ja) * | 2001-06-28 | 2011-02-02 | 三洋電機株式会社 | 混成集積回路装置 |
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- 2008-09-11 JP JP2008233781A patent/JP5308108B2/ja active Active
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