JP5237088B2 - 粉末材料または粒状材料の制御可能な供給 - Google Patents
粉末材料または粒状材料の制御可能な供給 Download PDFInfo
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- JP5237088B2 JP5237088B2 JP2008510033A JP2008510033A JP5237088B2 JP 5237088 B2 JP5237088 B2 JP 5237088B2 JP 2008510033 A JP2008510033 A JP 2008510033A JP 2008510033 A JP2008510033 A JP 2008510033A JP 5237088 B2 JP5237088 B2 JP 5237088B2
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- 239000008187 granular material Substances 0.000 title claims description 23
- 239000012254 powdered material Substances 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims description 63
- 239000000843 powder Substances 0.000 claims description 17
- 230000008016 vaporization Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000011236 particulate material Substances 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims 2
- 238000001704 evaporation Methods 0.000 description 25
- 230000008020 evaporation Effects 0.000 description 25
- 239000011368 organic material Substances 0.000 description 13
- 238000009834 vaporization Methods 0.000 description 10
- 239000002019 doping agent Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000011364 vaporized material Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Manufacturing And Processing Devices For Dough (AREA)
Description
(a)粉末材料または粒状材料を受け取る回転スクリューを用意し、その回転スクリューを回転させてその粉末材料または粒状材料を供給路に沿って供給位置に移動させる操作と;
(b)供給位置に少なくとも1つの開口部を設け、回転スクリューがその供給位置において回転することによって発生する圧力を利用し、粉末材料または粒状材料を制御可能な状態でその開口部を通過させて加熱された面へと送る操作と;
(c)回転スクリューを用いて粉末材料または粒状材料を供給位置の近くで撹拌または流動化することにより、その粉末材料または粒状材料を開口部を容易に通過させて加熱された面へと送り、その面においてその粉末材料または粒状材料を気化させる操作を含む方法によって達成される。
10 有機材料
15 容器
20 回転スクリュー
22 スクリュー・ケース
24 スクリュー・ケースの開口部
30 供給位置
35 開口部
36 部材
40 加熱された面
42 ヒート・シンク
45 モータ
50 センサー
55 制御装置
60 ぜんまいバネ
65 スプレッダ
70 振動アクチュエータ
75 スクリーン
Claims (5)
- 粉末材料または粒状材料を加熱された面から50〜100μm離れたところで計量供給してその材料を真空環境中で気化させる方法であって、
(a)粉末材料または粒状材料を受け取る回転スクリューを用意し、その回転スクリューを回転させてその粉末材料または粒状材料を供給路に沿って供給位置に移動させる操作と;
(b)上記供給位置の部材に少なくとも1つの開口部を設け、上記回転スクリューがその供給位置において回転することによって発生する圧力を利用し、上記粉末材料または粒状材料を制御可能な状態でその開口部を通過させて上記加熱された面へと送る操作と;
(c)上記回転スクリューを用いて上記粉末材料または粒状材料を上記供給位置の近くで上記部材によって撹拌または流動化することにより、その粉末材料または粒状材料を上記部材の上記開口部を容易に通過させて上記加熱された面へと送り、その面においてその粉末材料または粒状材料を気化させる操作を含む方法。 - 上記粉末材料または粒状材料を撹拌または流動化する上記操作を、上記供給位置において開口部を設けた1つ以上の面を移動することによって実現する、請求項1に記載の方法。
- 粉末材料または粒状材料を加熱された面から50〜100μm離れたところで計量供給してその材料を真空環境中で気化させる装置であって、
(a)粉末材料または粒状材料を受け取る回転スクリューを備えていて、その回転スクリューが回転するにつれてその粉末材料または粒状材料が供給路に沿って供給位置に移動し;
(b)上記供給位置に開口部を規定する構造を備えていて、上記回転スクリューがその供給位置において回転することによって発生する圧力を利用して、上記粉末材料または粒状材料が制御可能な状態でその開口部を通過して上記加熱された面へと送られ;
(c)上記回転スクリューを用いて上記粉末材料または粒状材料を上記供給位置の近くで上記部材によって撹拌または流動化する手段を備えていて、その粉末材料または粒状材料が上記部材の上記開口部を容易に通過する構成の装置。 - 上記供給位置と上記部材の上記開口部とが断熱層でコーティングされている、請求項1に記載の方法。
- 上記供給位置の熱伝導率を高くし、かつ、ヒートシンクへの熱伝導路を設ける、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/121,242 US7625602B2 (en) | 2005-05-03 | 2005-05-03 | Controllably feeding powdered or granular material |
US11/121,242 | 2005-05-03 | ||
PCT/US2006/015351 WO2006118837A2 (en) | 2005-05-03 | 2006-04-25 | Method for feeding powdered or granular material |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008540829A JP2008540829A (ja) | 2008-11-20 |
JP2008540829A5 JP2008540829A5 (ja) | 2009-04-16 |
JP5237088B2 true JP5237088B2 (ja) | 2013-07-17 |
Family
ID=37103274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008510033A Active JP5237088B2 (ja) | 2005-05-03 | 2006-04-25 | 粉末材料または粒状材料の制御可能な供給 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7625602B2 (ja) |
EP (1) | EP1893785B1 (ja) |
JP (1) | JP5237088B2 (ja) |
WO (1) | WO2006118837A2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5179739B2 (ja) * | 2006-09-27 | 2013-04-10 | 東京エレクトロン株式会社 | 蒸着装置、蒸着装置の制御装置、蒸着装置の制御方法および蒸着装置の使用方法 |
US7883583B2 (en) * | 2008-01-08 | 2011-02-08 | Global Oled Technology Llc | Vaporization apparatus with precise powder metering |
US7972443B2 (en) * | 2008-11-14 | 2011-07-05 | Global Oled Technology Llc | Metering of particulate material and vaporization thereof |
US8062427B2 (en) * | 2008-11-14 | 2011-11-22 | Global Oled Technology Llc | Particulate material metering and vaporization |
US8048230B2 (en) * | 2008-11-14 | 2011-11-01 | Global Oled Technology Llc | Metering and vaporizing particulate material |
JP4974036B2 (ja) * | 2009-11-19 | 2012-07-11 | 株式会社ジャパンディスプレイセントラル | 有機el装置の製造方法 |
CN106119781B (zh) * | 2016-07-27 | 2018-10-30 | 京东方科技集团股份有限公司 | 蒸发装置、蒸镀设备和蒸镀方法 |
KR20240012506A (ko) | 2021-05-21 | 2024-01-29 | 메르크 파텐트 게엠베하 | 적어도 하나의 기능성 물질의 연속 정제 방법 및 적어도 하나의 기능성 물질의 연속 정제를 위한 디바이스 |
CN115595550B (zh) * | 2022-10-24 | 2024-07-23 | 广东振华科技股份有限公司 | 一种af颗粒膜料自动换料连续蒸发镀膜装置及方法 |
Family Cites Families (16)
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US2447789A (en) | 1945-03-23 | 1948-08-24 | Polaroid Corp | Evaporating crucible for coating apparatus |
JPS50109182A (ja) * | 1974-02-07 | 1975-08-28 | ||
SU779441A1 (ru) | 1978-07-31 | 1980-11-15 | Институт Механики Металлополимерных Систем Ан Белорусской Сср | Дозирующий питатель |
DE3530106A1 (de) * | 1985-08-23 | 1987-02-26 | Kempten Elektroschmelz Gmbh | Aufdampfgut zum aufdampfen anorganischer verbindungen mittels einer photonen-erzeugenden strahlungsheizquelle in kontinuierlich betriebenen vakuumbedampfungsanlagen |
US4885211A (en) | 1987-02-11 | 1989-12-05 | Eastman Kodak Company | Electroluminescent device with improved cathode |
US4769292A (en) | 1987-03-02 | 1988-09-06 | Eastman Kodak Company | Electroluminescent device with modified thin film luminescent zone |
JPH0645213Y2 (ja) * | 1988-02-08 | 1994-11-16 | 住友電気工業株式会社 | 高精度粉体供給装置 |
EP0585848A1 (de) * | 1992-09-02 | 1994-03-09 | Hoechst Aktiengesellschaft | Verfahren und Vorrichtung zur chemischen Gasphasenabscheidung dünner Schichten |
JP2000248358A (ja) * | 1999-03-01 | 2000-09-12 | Casio Comput Co Ltd | 蒸着装置および蒸着方法 |
IT1310745B1 (it) | 1999-11-26 | 2002-02-22 | Lawer Spa | Dispositivo per l'erogazione dosata di prodotti scorrevoli. |
JP2003293121A (ja) * | 2002-04-05 | 2003-10-15 | Cluster Ion Beam Technology Kk | 蒸着材料供給手段を備えた蒸着用坩堝 |
US7118783B2 (en) * | 2002-06-26 | 2006-10-10 | Micron Technology, Inc. | Methods and apparatus for vapor processing of micro-device workpieces |
US6837939B1 (en) | 2003-07-22 | 2005-01-04 | Eastman Kodak Company | Thermal physical vapor deposition source using pellets of organic material for making OLED displays |
US7339139B2 (en) * | 2003-10-03 | 2008-03-04 | Darly Custom Technology, Inc. | Multi-layered radiant thermal evaporator and method of use |
US7288285B2 (en) * | 2004-09-21 | 2007-10-30 | Eastman Kodak Company | Delivering organic powder to a vaporization zone |
US7213347B2 (en) | 2005-05-03 | 2007-05-08 | Eastman Kodak Company | Metering material to promote rapid vaporization |
-
2005
- 2005-05-03 US US11/121,242 patent/US7625602B2/en active Active
-
2006
- 2006-04-25 WO PCT/US2006/015351 patent/WO2006118837A2/en active Application Filing
- 2006-04-25 JP JP2008510033A patent/JP5237088B2/ja active Active
- 2006-04-25 EP EP06751155A patent/EP1893785B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1893785B1 (en) | 2012-07-11 |
US20060251811A1 (en) | 2006-11-09 |
US7625602B2 (en) | 2009-12-01 |
JP2008540829A (ja) | 2008-11-20 |
WO2006118837A3 (en) | 2007-04-05 |
EP1893785A2 (en) | 2008-03-05 |
WO2006118837A2 (en) | 2006-11-09 |
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