JP5054020B2 - シールされた補充容器を用いた堆積システム - Google Patents
シールされた補充容器を用いた堆積システム Download PDFInfo
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- JP5054020B2 JP5054020B2 JP2008540057A JP2008540057A JP5054020B2 JP 5054020 B2 JP5054020 B2 JP 5054020B2 JP 2008540057 A JP2008540057 A JP 2008540057A JP 2008540057 A JP2008540057 A JP 2008540057A JP 5054020 B2 JP5054020 B2 JP 5054020B2
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- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
(a)シールされたインターフェイスフィッティングを有する補充容器の中に粒子状材料を供給するステップと;
(b)その補充容器を、少なくとも1つの供給用開口部を画定する供給ホッパーに取り付け、インターフェイスフィッティングの位置でシールを破るステップと;
(c)補充容器から供給ホッパーに粒子状材料を移動させるステップと;
(d)供給用開口部を通過したその粒子状材料を供給路に沿って気化ゾーンまで移動させ、その気化ゾーンにおいてその粒子状材料の少なくとも1つの成分を気化させた後、表面に供給して層を形成するステップを含む方法によって達成される。
R1とR2は、それぞれ独立に、水素原子、アリール基、アルキル基のいずれかを表わすか、R1とR2は、合わさって、シクロアルキル基を完成させる原子を表わし;
R3とR4は、それぞれ独立にアリール基を表わ表わし、そのアリール基は、構造式(C)に示したように、ジアリール置換されたアミノ基によって置換されている。
それぞれのAreは、独立に、アリーレン基(例えばフェニレン部分またはアントラセン部分)の中から選択され;
nは1〜4の整数であり;
Ar、R7、R8、R9は、独立に、アリール基の中から選択される。
6 蒸発源
7 蒸発源
8 蒸発源
9 気柱
10 気化装置
15 基板
20 マニホールド
30 開口部
32 蒸着装置
40 供給装置
50 供給容器
52 供給ホッパー
54 インターフェイスフィッティング
60 供給路
72 補充容器
80 スクリュー構造
85 スクリュー
85a スクリュー
85b スクリュー
85c スクリュー
90 モータ
95 スクリュー構造
100 粒子状材料
105 スクリュー構造
110 スクリーン
115 螺旋状のネジ山
120 スクリーン
125 中央部
130 ピエゾ電気構造
135 山なし部分
140 ピエゾ電気構造
150 ピエゾ電気構造
155 ピエゾ電気構造
170 加熱素子
180 基部
190 底部
210 回転する螺旋式装置
220 ギア・ドライバ
230 開口部
240 モータ
250 第3の容器
260 第1の供給路
265 第2の供給路
270 真空曝露用開口部
275 装着用ロック装置
280 蒸着チェンバー
285 OLED基板
295 並進移動装置
300 真空源
310 OLEDデバイス
320 基板
330 アノード
335 正孔注入層
340 正孔輸送層
350 発光層
355 電子輸送層
360 電子注入層
370 有機層
390 カソード
400 補充装置
402 スライド式バルブ
404 Oリング
406 バルブ装置
408 シール
410 バルブ
412 バルブ
414 開口部
416 円板
420 蛇腹部
422 瓶
423、425 シール
424 アダプタ
428 開口部
430 真空チェンバー
432 圧力制御用フィッティング
434 ヒンジ
436 シール
438 障害物
440 袋部
442 振動装置
444 ピストン
448 バルブ
450 センサー
454 カバー
Claims (3)
- 粒子状材料を気化させて表面に堆積させることによって層を形成する方法であって、
(a)シールされたインターフェイスフィッティングを有する補充容器の中に粒子状材料を供給するステップと;
(b)その補充容器を、少なくとも1つの供給用開口部を画定する供給ホッパーに取り付け、インターフェイスフィッティングの位置でシールを破るステップと;
(c)上記補充容器から上記供給ホッパーに粒子状材料を移動させるステップと;
(d)上記供給用開口部を通過したその粒子状材料を供給路に沿って気化ゾーンまで移動させ、その気化ゾーンにおいてその粒子状材料の少なくとも1つの成分を気化させた後、表面に供給して層を形成するステップを含む方法。 - 上記補充容器の体積が上記供給ホッパーよりも大きい、請求項1に記載の方法。
- 上記供給路がスクリューによって画定される、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/273,268 | 2005-11-10 | ||
US11/273,268 US7638168B2 (en) | 2005-11-10 | 2005-11-10 | Deposition system using sealed replenishment container |
PCT/US2006/042605 WO2007058775A2 (en) | 2005-11-10 | 2006-11-01 | Deposition system using sealed replenishment container |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009516072A JP2009516072A (ja) | 2009-04-16 |
JP2009516072A5 JP2009516072A5 (ja) | 2010-02-18 |
JP5054020B2 true JP5054020B2 (ja) | 2012-10-24 |
Family
ID=37964945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008540057A Active JP5054020B2 (ja) | 2005-11-10 | 2006-11-01 | シールされた補充容器を用いた堆積システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US7638168B2 (ja) |
EP (1) | EP1971702B1 (ja) |
JP (1) | JP5054020B2 (ja) |
TW (1) | TWI377715B (ja) |
WO (1) | WO2007058775A2 (ja) |
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JP5011013B2 (ja) * | 2007-07-24 | 2012-08-29 | 大陽日酸株式会社 | 二フッ化キセノンガス供給装置 |
US7883583B2 (en) * | 2008-01-08 | 2011-02-08 | Global Oled Technology Llc | Vaporization apparatus with precise powder metering |
US7972443B2 (en) * | 2008-11-14 | 2011-07-05 | Global Oled Technology Llc | Metering of particulate material and vaporization thereof |
US8048230B2 (en) * | 2008-11-14 | 2011-11-01 | Global Oled Technology Llc | Metering and vaporizing particulate material |
US8062427B2 (en) * | 2008-11-14 | 2011-11-22 | Global Oled Technology Llc | Particulate material metering and vaporization |
GB2472817A (en) | 2009-08-19 | 2011-02-23 | Queen Mary & Westfield College | Powder dispenser with permanently-open linear-taper nozzle operated by vibration |
WO2011025256A2 (ko) * | 2009-08-26 | 2011-03-03 | 주식회사 테라세미콘 | 증착가스 공급장치 |
JP4974036B2 (ja) | 2009-11-19 | 2012-07-11 | 株式会社ジャパンディスプレイセントラル | 有機el装置の製造方法 |
JP2012046814A (ja) * | 2010-08-30 | 2012-03-08 | Kaneka Corp | 蒸着装置 |
KR101402526B1 (ko) | 2011-12-26 | 2014-06-09 | 삼성디스플레이 주식회사 | 수명이 향상된 유기발광소자 및 그 제조방법 |
AU2013208044A1 (en) * | 2012-01-10 | 2014-03-20 | Hzo, Inc. | Precursor supplies, material processing systems with which precursor supplies are configured to be used and associated methods |
US9578718B2 (en) * | 2012-05-04 | 2017-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing light-emitting element and deposition apparatus |
GB201300828D0 (en) | 2013-01-17 | 2013-03-06 | Varydose Ltd | Apparatus and method for dispensing powders |
FR3020381B1 (fr) * | 2014-04-24 | 2017-09-29 | Riber | Cellule d'evaporation |
CN104498889B (zh) * | 2014-12-18 | 2017-02-22 | 光驰科技(上海)有限公司 | 自动化连续式防污膜镀膜装置 |
KR101641453B1 (ko) * | 2015-01-14 | 2016-07-21 | 에스엔유 프리시젼 주식회사 | 박막 증착 장치 |
KR20160123438A (ko) * | 2015-04-15 | 2016-10-26 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치용 증착원 |
TWI781929B (zh) * | 2016-04-25 | 2022-11-01 | 美商創新先進材料股份有限公司 | 瀉流單元和含有瀉流單元的沉積系統以及相關方法 |
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WO2020185284A1 (en) * | 2019-03-13 | 2020-09-17 | Metal Oxide Technologies, Llc | Solid precursor feed system for thin film depositions |
US20220274338A1 (en) * | 2019-09-16 | 2022-09-01 | Hewlett-Packard Development Company, L.P. | Build material loading |
DE102020118015A1 (de) * | 2020-07-08 | 2022-01-13 | Thyssenkrupp Steel Europe Ag | Beschichtungsvorrichtung zum Ablagern eines Beschichtungsmaterials auf einem Substrat |
CN113737137B (zh) * | 2021-11-05 | 2022-01-18 | 苏州盛曼特新材料有限公司 | 一种金属膜蒸镀加工设备 |
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2005
- 2005-11-10 US US11/273,268 patent/US7638168B2/en active Active
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2006
- 2006-11-01 JP JP2008540057A patent/JP5054020B2/ja active Active
- 2006-11-01 WO PCT/US2006/042605 patent/WO2007058775A2/en active Application Filing
- 2006-11-01 EP EP06836748.1A patent/EP1971702B1/en active Active
- 2006-11-09 TW TW095141450A patent/TWI377715B/zh active
Also Published As
Publication number | Publication date |
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US7638168B2 (en) | 2009-12-29 |
TW200725960A (en) | 2007-07-01 |
TWI377715B (en) | 2012-11-21 |
US20070104864A1 (en) | 2007-05-10 |
WO2007058775A3 (en) | 2007-07-12 |
EP1971702A2 (en) | 2008-09-24 |
WO2007058775A2 (en) | 2007-05-24 |
EP1971702B1 (en) | 2014-08-27 |
JP2009516072A (ja) | 2009-04-16 |
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