JP5265307B2 - 接触式温度センサ - Google Patents
接触式温度センサ Download PDFInfo
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- JP5265307B2 JP5265307B2 JP2008283058A JP2008283058A JP5265307B2 JP 5265307 B2 JP5265307 B2 JP 5265307B2 JP 2008283058 A JP2008283058 A JP 2008283058A JP 2008283058 A JP2008283058 A JP 2008283058A JP 5265307 B2 JP5265307 B2 JP 5265307B2
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- 238000003825 pressing Methods 0.000 claims description 85
- 238000005259 measurement Methods 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 11
- 238000009529 body temperature measurement Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000013013 elastic material Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Images
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- Measuring Temperature Or Quantity Of Heat (AREA)
Description
前記接触板が被測温体に接触する状態で、前記感温部を挟む少なくとも2カ所以上の前記押圧部で前記接触板を前記被測温体に押圧するように構成する。
6 センサ基部
10、10A、10B、10C センサ部
11 固定支持板(固定支持部)
12 接触板
13 固定部材
14 感温部(熱電対の熱接点)
16 押圧部材(押圧部)
17 板バネ
17a 切り抜き
18 保持部
20 被測温体
20f 移動表面
Claims (3)
- 被測温体に当接する接触板と、該接触板から熱を伝達される感温部と、前記接触板を前記被測温体に押圧する押圧手段とを有すると共に、前記感温部を前記接触板の背後に配設し、該接触板の両端を固定支持部に保持する接触式温度計において、
前記押圧手段を、前記感温部に面する部分に切り抜きを設けた板バネと、該板バネの両端側に設けられた前記接触板を押圧する押圧部とで形成すると共に、前記切り抜きに隣接する前記板バネの中心側を前記固定支持部に保持し、
前記接触板が被測温体に接触しない状態で、前記板バネを前記接触板の前記押圧部の間の部分と平行に配置し、
前記接触板が被測温体に接触する状態で、前記感温部を挟む少なくとも2カ所以上の前記押圧部で前記接触板を前記被測温体に押圧することを特徴とする接触式温度センサ。 - 前記押圧部を前記板バネに取り付けた押圧部材で形成したことを特徴とする請求項1に記載の接触式温度センサ。
- 前記接触板を、一端側を折り曲げて形成し、この折り曲げ部分を前記固定支持部又は前記固定支持部に固定される固定部材に引っ掛けて前記接触板の一端側を保持することを特徴とする請求項1又は2に記載の接触式温度センサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008283058A JP5265307B2 (ja) | 2008-11-04 | 2008-11-04 | 接触式温度センサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008283058A JP5265307B2 (ja) | 2008-11-04 | 2008-11-04 | 接触式温度センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010112727A JP2010112727A (ja) | 2010-05-20 |
JP5265307B2 true JP5265307B2 (ja) | 2013-08-14 |
Family
ID=42301404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008283058A Active JP5265307B2 (ja) | 2008-11-04 | 2008-11-04 | 接触式温度センサ |
Country Status (1)
Country | Link |
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JP (1) | JP5265307B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018088772A1 (ko) * | 2016-11-08 | 2018-05-17 | 암페놀센싱코리아 유한회사 | 판 스프링을 이용한 접촉식 온도 센서 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5274624B2 (ja) * | 2011-07-05 | 2013-08-28 | 株式会社芝浦電子 | 温度センサ及びセンサ取付用の端子 |
KR102708611B1 (ko) * | 2018-12-18 | 2024-09-24 | 주식회사 엘지에너지솔루션 | 배터리 모듈 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60181768U (ja) * | 1984-05-10 | 1985-12-03 | ミノルタ株式会社 | 表面温度検出装置 |
JP3374640B2 (ja) * | 1996-02-08 | 2003-02-10 | 富士ゼロックス株式会社 | 温度検知装置 |
JP3803066B2 (ja) * | 2002-02-05 | 2006-08-02 | 安立計器株式会社 | 接触式温度センサ |
-
2008
- 2008-11-04 JP JP2008283058A patent/JP5265307B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018088772A1 (ko) * | 2016-11-08 | 2018-05-17 | 암페놀센싱코리아 유한회사 | 판 스프링을 이용한 접촉식 온도 센서 |
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Publication number | Publication date |
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JP2010112727A (ja) | 2010-05-20 |
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