JP2010112727A - 接触式温度センサ - Google Patents
接触式温度センサ Download PDFInfo
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- JP2010112727A JP2010112727A JP2008283058A JP2008283058A JP2010112727A JP 2010112727 A JP2010112727 A JP 2010112727A JP 2008283058 A JP2008283058 A JP 2008283058A JP 2008283058 A JP2008283058 A JP 2008283058A JP 2010112727 A JP2010112727 A JP 2010112727A
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- 238000003825 pressing Methods 0.000 claims abstract description 89
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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- 229920006362 Teflon® Polymers 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
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- 229910000639 Spring steel Inorganic materials 0.000 description 1
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- 238000003754 machining Methods 0.000 description 1
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
【解決手段】被測温体20に当接する接触板12と、該接触板12から熱を伝達される感温部14と、前記接触板12を前記被測温体20に押圧する押圧手段16、17とを有する接触式温度計1において、前記感温部14を前記接触板12の背後に配設し、該接触板12の両端を固定支持部11に保持すると共に、前記押圧手段16、17を、両端側の押圧部16が前記接触板12を押圧し、中心側18が固定支持部11に保持される板バネ17で形成し、前記感温部14を挟む少なくとも2カ所以上の押圧部16で前記接触板12を押圧するように構成する。
【選択図】図1
Description
6 センサ基部
10、10A、10B、10C センサ部
11 固定支持板(固定支持部)
12 接触板
13 固定部材
14 感温部(熱電対の熱接点)
16 押圧部材(押圧部)
17 板バネ
17a 切り抜き
18 保持部
20 被測温体
20f 移動表面
Claims (4)
- 被測温体に当接する接触板と、該接触板から熱を伝達される感温部と、前記接触板を前記被測温体に押圧する押圧手段とを有する接触式温度計において、
前記感温部を前記接触板の背後に配設し、該接触板の両端を固定支持部に保持すると共に、
前記押圧手段を、両端側の押圧部が前記接触板を押圧し、かつ、中心側が固定支持部に保持される板バネで形成し、前記感温部を挟む少なくとも2カ所以上の前記押圧部で前記接触板を前記被測温体に押圧することを特徴とする接触式温度センサ。 - 前記板バネの前記感温部に面する部分に切り抜き又は切り欠きを設けたことを特徴とする請求項1に記載の接触式温度センサ。
- 前記押圧部を前記板バネに取り付けた押圧部材で形成したことを特徴とする請求項1又は2に記載の接触式温度センサ。
- 前記接触板を、一端側を折り曲げて形成し、この折り曲げ部分を前記固定支持部又は前記固定支持部に固定される固定部材に引っ掛けて前記接触板の一端側を保持することを特徴とする請求項1、2又は3に記載の接触式温度センサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008283058A JP5265307B2 (ja) | 2008-11-04 | 2008-11-04 | 接触式温度センサ |
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JP2008283058A JP5265307B2 (ja) | 2008-11-04 | 2008-11-04 | 接触式温度センサ |
Publications (2)
Publication Number | Publication Date |
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JP2010112727A true JP2010112727A (ja) | 2010-05-20 |
JP5265307B2 JP5265307B2 (ja) | 2013-08-14 |
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JP2008283058A Active JP5265307B2 (ja) | 2008-11-04 | 2008-11-04 | 接触式温度センサ |
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JP (1) | JP5265307B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013015430A (ja) * | 2011-07-05 | 2013-01-24 | Shibaura Electronics Co Ltd | 温度センサ及びセンサ取付用の端子 |
KR20200075388A (ko) * | 2018-12-18 | 2020-06-26 | 주식회사 엘지화학 | 배터리 모듈 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101958064B1 (ko) * | 2016-11-08 | 2019-03-13 | 암페놀센싱코리아 유한회사 | 판 스프링을 이용한 접촉식 온도 센서 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60181768U (ja) * | 1984-05-10 | 1985-12-03 | ミノルタ株式会社 | 表面温度検出装置 |
JPH09218102A (ja) * | 1996-02-08 | 1997-08-19 | Fuji Xerox Co Ltd | 温度検知装置 |
JP2003227760A (ja) * | 2002-02-05 | 2003-08-15 | Anritsu Keiki Kk | 接触式温度センサ |
-
2008
- 2008-11-04 JP JP2008283058A patent/JP5265307B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60181768U (ja) * | 1984-05-10 | 1985-12-03 | ミノルタ株式会社 | 表面温度検出装置 |
JPH09218102A (ja) * | 1996-02-08 | 1997-08-19 | Fuji Xerox Co Ltd | 温度検知装置 |
JP2003227760A (ja) * | 2002-02-05 | 2003-08-15 | Anritsu Keiki Kk | 接触式温度センサ |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013015430A (ja) * | 2011-07-05 | 2013-01-24 | Shibaura Electronics Co Ltd | 温度センサ及びセンサ取付用の端子 |
KR20200075388A (ko) * | 2018-12-18 | 2020-06-26 | 주식회사 엘지화학 | 배터리 모듈 |
KR102708611B1 (ko) * | 2018-12-18 | 2024-09-24 | 주식회사 엘지에너지솔루션 | 배터리 모듈 |
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