JP2500555B2 - Semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a means for electrically connecting a lead to a lead connection planned site in a wiring pattern of a semiconductor pellet.

[0002]

2. Description of the Related Art A wire bonding apparatus shown in FIG. 3 is used for connecting an electrode pad (1) and a lead (2) in a semiconductor device manufacturing process. In FIG. 3, (3) shows a substrate, (4) shows a semiconductor pellet mounted on the substrate (3), and a plurality of electrode pads ( 1) is formed. On the other hand, around the semiconductor pellet (4), a plurality of leads (2) corresponding to the number of the electrode pads (1) are spaced apart. Then, the semiconductor device (7) is manufactured by connecting the electrode pad (1) of the semiconductor pellet (4) and the tip of the lead (2) with the wire (6) supplied by the capillary (5). .

On the other hand, in order to achieve high-density mounting of ICs,
The TAB lead type semiconductor device (8) is used for a prize. T
In the manufacturing process of the AB lead type semiconductor device (8), a bump electrode (10) is formed on the upper surface (9) of the semiconductor pellet (4) and a metal formed on the insulating film (11) as shown in FIG. The tip of the inner lead (12) of the foil is brought into contact with the bump electrode (10) and the bonding tool (13) is pressed from above the inner lead (12) to bump the tip of the inner lead (12). Thermocompression bonded to the electrode (10),
A TAB lead type semiconductor device (8) is manufactured in which the tip portion of the inner lead (12) and the bump electrode (10) of the semiconductor pellet (4) are electrically connected.

[0004]

In the semiconductor device (7) shown in FIG. 3, when the number of electrode pads (1) increases, the number of leads (2) also increases, so that the capillary (5) is used. The bonding time of the wire (6) becomes long and the index decreases.

On the other hand, in the TAB lead type semiconductor device (8) shown in FIG. 4, although the index is higher than in the above case, since the bump electrode (10) is formed by the heap plating of Au or the like, the bump There is a problem that the cost of forming the electrode (10) is high and the product cost is high, and there is a problem that the tip of the lead slips off when the lead is pressed and short-circuits with the next.

[0006]

As a means for solving the above-mentioned problems, the present invention is directed to a semiconductor device having a lead-connecting portion which extends from a wiring pattern formed on the upper surface of the semiconductor pellet and is arranged in alignment with the peripheral portion of the upper surface of the semiconductor pellet. In a semiconductor device in which leads arranged around a pellet are electrically and mechanically connected, an insulating cover for covering a wiring pattern is formed on the upper surface of the semiconductor pellet, and a portion corresponding to the lead connection planned portion is formed. Is cut off, an insulating film is formed on the peripheral portion of the semiconductor pellet located outside the planned lead connection site, the tip of the lead is fitted into the opening of the insulating cover, and thermocompression bonded to the planned lead connection site. The present invention provides a semiconductor device characterized by the above.

Further, in the present invention, it is desirable that an insulating member for controlling the position of the tip portion of the lead holds the portion excluding the tip portion of each lead.

[0008]

In the semiconductor device according to the present invention, an insulating cover for covering the wiring pattern is formed on the upper surface of the semiconductor pellet, the portion corresponding to the lead connection planned portion is cut off, and it is located outside the lead connection planned portion. Wire bonding and bump electrode formation by depositing an insulating film on the peripheral edge of the semiconductor pellet, fitting the tip of the lead into the opening of the insulating cover, and thermocompression-bonding to the intended lead connection site. Instead, the semiconductor pellet and the lead can be electrically connected.

Further, by holding the portion excluding the tip portion of each lead with an insulating member that regulates the tip portion of the lead, when the tip portion of the lead is thermocompression-bonded to the planned lead connection portion, the tip portion of the lead is held. It becomes easy to align the lead and the planned lead connection site.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.

As shown in FIG. 1, a wiring pattern (15) made of a thin film of Al or the like is deposited on the upper surface of the semiconductor pellet (4) and extends from the wiring pattern (15) to form the semiconductor pellet (4). Predetermined lead connection sites (17) are formed in the peripheral portion of the upper surface. On the wiring pattern (15), the insulating cover (16) is cut out in a comb-tooth shape at a portion corresponding to the planned lead connection site (17). As a result, the lead connection planned site (17) of the wiring pattern (15) is exposed in the comb-teeth-shaped opening of the insulating cover (16). In addition, the insulating film (14) is formed on the peripheral portion of the semiconductor pellet (4) located outside the lead connection planned portion (17).
Is formed.

On the other hand, a lead (2) is arranged around the semiconductor pellet (4) so as to correspond to the lead connection planned site (17), and the tip portion of the lead (2) is attached to the insulating cover (16). The semiconductor pellet (4) and the lead (2) are electrically connected to each other by fitting into the comb-teeth-shaped opening of (1) and thermocompression-bonding to the lead connection planned site (17). This time,
Since the insulating film (14) is interposed between the tip portion of the lead (2) and the peripheral portion of the semiconductor pellet (4), the semiconductor pellet (4) and the lead (2) are electrically short-circuited. There is no.

Here, the tip portion of the lead (2) is automatically positioned by being fitted into the corresponding lead connection planned site (17). If the tip portions of the leads (2) are extended in order to reach the tip portions of (1), a position shift easily occurs between the leads (2) aligned in parallel with each other, and the lead connection planned site (17) It becomes difficult to insert the tip portion of the lead (2) into the lead. Then, lead (2)
If the base end side portion of (2) is held by the insulating member (18) made of a polymer material or the like except the tip end portion, the above-mentioned displacement can be prevented.

Specifically, the electrical connection between the lead (2) and the semiconductor pellet (4) is adjusted by adjusting the relative disposition positions of the two, and the corresponding lead connection is planned just below the tip of the lead (2). After positioning so that the parts (17) are arranged, the semiconductor pellet (4) is pushed up from below the leads (2), and the tip parts of the respective leads (2) are connected to the corresponding lead connection parts (17). Sit inside and make contact.
After that, the bonding tool [indicated by reference numeral (13) in FIG. 4] is lowered from above the lead (2) and heated under the action of the pressing force, so that the tip portion of the lead (2) is connected to the wiring pattern ( Thermocompression-bond to the lead connection planned part (17) of 15).

The shape of the tip of the lead (2) is shown in FIG.
It is possible to form a rectangle, a trapezoid, an oval, a circle, etc., as illustrated in Fig. 2, and in accordance with this, the shape and opening size of the lead connection planned site (17) formed on the semiconductor pellet (4) side. Adjust.

In addition to the thermocompression bonding method using the bonding tool (13), a combination of thermocompression bonding and ultrasonic vibration is also used as a connecting means between the tip portion of the lead (2) and the planned lead connection portion (17). It is possible to

[0017]

According to the present invention, even when the number of leads is large, it is possible to electrically connect the tip portions of the leads to the corresponding semiconductor pellets by one thermocompression bonding operation.
Not only the alignment becomes easier, but also the index becomes faster, and the bending of the tip of the lead is eliminated. Further, since it is not necessary to form expensive bump electrodes, which is a problem in manufacturing the TAB lead type semiconductor device, it is possible to reduce the manufacturing cost of the semiconductor device.

[Brief description of drawings]

FIG. 1 is a partially exploded perspective view showing an embodiment of a semiconductor device according to the present invention.

FIG. 2 is a cross-sectional view illustrating the shape of the tip portion of the lead.

FIG. 3 is a plan view showing a conventional example of a semiconductor device.

FIG. 4 is a front view showing a conventional example of a TAB lead type semiconductor device.

[Explanation of symbols]

 2 Lead 4 Semiconductor pellet 14 Insulating film 15 Wiring pattern 16 Insulation cover 17 Lead connection site

Claims (2)

(57) [Claims] 1. A lead connection planned site extending from a wiring pattern formed on an upper surface of a semiconductor pellet and aligned in a peripheral portion of the upper surface, and a lead arranged around the semiconductor pellet are electrically and In a mechanically connected semiconductor device, an insulating cover that covers a wiring pattern is formed on the upper surface of the semiconductor pellet, and a portion corresponding to the lead connection planned site is cut off, and a semiconductor located outside the lead connection planned site A semiconductor device, comprising: forming an insulating film on a peripheral portion of a pellet; fitting a tip of a lead into an opening of the insulating cover; 2. The semiconductor device according to claim 1, wherein an insulating member for regulating the position of the tip of the lead holds the part of the lead excluding the tip.