JP2019027819A - Clamp sensor and measuring device - Google Patents

Abstract

To improve a detection sensitivity at the time of detecting an active state.SOLUTION: A clamp sensor includes: a clamp unit for detecting a first detection quantity for a measurement object in a clamped state by having a pair of sensors arc-shaped in a plan view capable of clamping a measurement object in a state where the top end surfaces are brought close to each other, at least one of the sensors being configured to be capable of rotation so that the top end surfaces of respective top end parts are brought close to or separated from each other; and a detection unit 12 for detecting a second detection quantity used for detecting an active state in which an AC voltage is supplied to the measurement object disposed on the top end surface of at least on one of each sensor. The detection unit 12 is configured to include: a non-conductive plate-like base plate 51 disposed along the top end surface in a state where a top source 51a and a rear surface 51b are parallel with the top end surface; conductive patterns 52a and 52b formed on the base plate 51; and a via 53 formed on the base plate 51 in such a manner to extend in a thickness direction of the base plate 51 and connected to the conductive patterns 52a and 52b.SELECTED DRAWING: Figure 5

Description

  The present invention provides a clamp sensor including a clamp unit that detects a first detected amount of a measurement target, and a detection unit that detects a second detected amount used for detecting a live state of the measurement target, and The present invention relates to a measuring apparatus including the clamp sensor.

  As this type of measuring device, a current measuring device disclosed by the applicant in Patent Document 1 below is known. This current measuring device includes a clamp sensor and a main body. The clamp sensor includes a pair of sensors, and detects the magnetism generated in the measurement object in a non-contact manner in a state where the measurement object is clamped by each sensor. In addition, a flexible substrate is disposed on the tip surface of one of the sensors in the clamp sensor, and one wiring pattern formed on the flexible substrate functions as a detection electrode when detecting a live state. For this reason, by using this clamp sensor, it is possible to perform both the measurement of the current to be measured and the detection of the live state of the detection target. In this case, for example, when detecting the live state of the outlet as the measurement target, the front end of the sensor is brought close to the outlet, and the front end of the wiring pattern of the flexible board arranged at the front end of the sensor faces the outlet. Let At this time, the capacitance between the outlet and the ground via the wiring pattern (capacitance between the outlet and the wiring pattern, between the measurer holding the current measuring device and the wiring pattern) AC current flows between the outlet and the ground due to the electrostatic capacity and the electrostatic capacity between the measurer and the earth), and the voltage value of the AC voltage supplied to the outlet is measured based on this AC current. The live state of the outlet can be detected based on whether the measured voltage value is equal to or higher than a specified value.

JP-A-2006-70771 (pages 4-7, FIGS. 1 and 6)

  However, the above current measuring device has the following problems to be improved. Specifically, in this current measuring device, one wiring pattern on the flexible substrate arranged on the front end surface of the sensor is made to function as a detection electrode, and for example, an active state of an outlet as a measurement target is detected. Sometimes, the live state of the outlet is determined using an alternating current that flows due to the capacitance between the outlet and the ground via the wiring pattern. Therefore, the detection sensitivity of the live state depends on the capacitance between the outlet and the wiring pattern. That is, the detection sensitivity increases as the capacitance between the outlet and the wiring pattern increases, and the detection sensitivity decreases as the capacitance between the outlet and the wiring pattern decreases. On the other hand, the capacitance between the outlet and the wiring pattern is larger as the facing area of the wiring pattern facing the outlet is larger and smaller as it is smaller. In such a usage pattern, since the front end surface of the wiring pattern faces the measurement target, the facing area of the wiring pattern is the area of the front end surface of the wiring pattern, that is, the product of the thickness and width of the wiring pattern. Become. In this case, since the thickness of the wiring pattern is generally extremely thin, the facing area is also extremely small. Therefore, it is difficult for the current measuring device to improve the detection sensitivity because it is difficult to secure a sufficiently large facing area of one wiring pattern facing the outlet in such a usage form. Improvement is desired.

  The present invention has been made in view of such a problem to be improved, and it is a main object of the present invention to provide a clamp sensor and a measurement apparatus that can improve detection sensitivity when detecting a live state.

  In order to achieve the above object, the clamp sensor according to claim 1 is configured such that at least one of the distal end portions is rotatable so that the distal end surfaces of the distal end portions come into contact with each other, and the measurement target is in a state where the distal end surfaces approach each other. A clamp unit that has a pair of arc-shaped sensors that can be clamped to detect a first detected amount of the measurement target in a clamped state, and is disposed on at least one of the sensors to be the measurement target. A clamp sensor including a detection unit for detecting a second detected amount used for detection of a live state to which an AC voltage is supplied, wherein the detection unit is along a direction parallel to the tip surface A first conductor disposed at the distal end, and a second conductor disposed at the distal end along a direction intersecting the distal end surface and connected to the first conductor. It is configured.

  The clamp sensor according to claim 2 is the clamp sensor according to claim 1, wherein the detection unit is non-conductive disposed along the tip surface in a state in which a front surface and a back surface are parallel to the tip surface. A plate-like substrate, a conductor pattern as the first conductor formed on the substrate, the first conductor formed on the substrate so as to extend in the thickness direction of the substrate and connected to the conductor pattern A via is provided as two conductors.

  The clamp sensor according to claim 3 is the clamp sensor according to claim 2, wherein the conductor pattern is formed on the front surface and the back surface of the substrate, respectively, and the via is formed on the front surface and the back surface. Are connected to both of the conductor patterns.

  The clamp sensor according to claim 4 is the clamp sensor according to claim 1, wherein the detection unit includes a non-conductive plate-like substrate and a conductor pattern formed on the substrate. A first substrate region disposed along the tip surface in a state where the front surface and the back surface are parallel to the tip surface, and a second substrate region bent in a direction intersecting the tip surface The conductor pattern includes a first conductor pattern region as the first conductor formed in the first substrate region, and the second conductor pattern formed in the second substrate region and connected to the first conductor pattern region. And a second conductor pattern region as a conductor.

  The clamp sensor according to claim 5 is the clamp sensor according to any one of claims 1 to 4, wherein a magnetism as the first detected amount is provided at a portion of the at least one sensor opposite to the tip surface. The first conductor is connected to the magnetic detection element as one of an electric wiring for signal input and an electric wiring for signal output.

  A measuring device according to claim 6 is the clamp sensor according to any one of claims 1 to 5, a measuring unit that measures a measurement amount for the measurement object based on the first detection amount, A power detection unit that detects the second detection amount and detects the live state of the measurement target based on the second detection amount.

  In the clamp sensor according to claim 1 and the measuring apparatus according to claim 6, with respect to the first conductor disposed at the tip of the sensor along a direction parallel to the tip of the sensor, and the tip of the sensor A detection unit is configured to include a second conductor disposed at the tip of the sensor along the intersecting direction and connected to the first conductor. For this reason, according to the clamp sensor and the current measurement device, the conductor portion (conductor pattern and via) of the detection unit facing the measurement object is compared with the configuration in which the live state is detected using only one conductor pattern. As a result, the capacitance between the object to be measured and the conductor portion of the detection unit can be increased, so that the detection sensitivity of the live state can be sufficiently improved.

  The clamp sensor according to claim 2 and the measuring device according to claim 6 are formed on the substrate so as to extend in the thickness direction of the substrate and the conductor pattern as the first conductor formed on the substrate. In addition, since the detection unit is configured with the via as the second conductor connected to the conductor pattern, the detection unit can be configured easily, so that the detection sensitivity of the live state can be improved at low cost. Can be realized.

  Further, according to the clamp sensor according to claim 3 and the measuring device according to claim 6, the conductor patterns are respectively formed on the front surface and the back surface of the substrate, and the vias are formed so as to be connected to both the conductor patterns. Thus, the via can be elongated to the same extent as the thickness of the substrate. Therefore, according to the clamp sensor and the current measuring device, for example, the facing area of the conductor portion of the detecting portion facing the measurement target is made larger compared to a configuration in which a via shorter than the thickness of the substrate is formed. As a result, the detection sensitivity of the live state can be further improved.

  According to the clamp sensor of claim 4 and the measuring device of claim 6, the first substrate region disposed along the tip surface and the first substrate bent in the direction intersecting the tip surface. A substrate having two substrate regions, a first conductor pattern region as a first conductor formed in the first substrate region, and a second conductor formed in the second substrate region and connected to the first conductor pattern region. Since the detection unit is configured to include the conductor pattern having the second conductor pattern region, a simple configuration in which the front end portion side of the substrate is bent together with the conductor pattern, thereby improving the detection sensitivity of the live state at a low cost. Can be realized.

  Further, in the clamp sensor according to claim 5 and the measuring apparatus according to claim 6, a magnetic detection element is disposed on the front end surface of the sensor, and the conductor pattern is used for electric wiring for signal input and for signal output. One of the electrical wirings is connected to the magnetic detection element. For this reason, according to the clamp sensor and the current measuring device provided with the detection unit, the conductor pattern used for detecting the live state of the measurement target is either the electric wiring for signal input or the electric wiring for signal output. As a result, the configuration of the detection unit can be simplified.

1 is a front view of a current measuring device 1. FIG. 1 is a configuration diagram showing a configuration of a current measuring device 1. FIG. FIG. 5 is a perspective view of the detection unit 12 as viewed from the surface 51a side of the substrate 51. FIG. 5 is a perspective view of the detection unit 12 as viewed from the back surface 51b side of the substrate 51. FIG. 4 is a cross-sectional view taken along the X plane in FIG. 3. FIG. 3 is a first explanatory diagram illustrating a method of using the current measuring device 1. It is the 2nd explanatory view explaining how to use current measuring device 1. It is the 3rd explanatory view explaining how to use current measuring device 1. FIG. 5 is a perspective view of the detection unit 112 as viewed from the surface 51a side of the substrate 51. FIG. 6 is a perspective view of the detection unit 112 as viewed from the back surface 51b side of the substrate 51. FIG. 6 is a perspective view of the detection unit 212 as viewed from the surface 51a side of the substrate 51. 5 is a perspective view of the detection unit 212 as viewed from the back surface 51b side of the substrate 51. FIG.

  Hereinafter, embodiments of a clamp sensor and a measuring apparatus will be described with reference to the accompanying drawings.

  First, the configuration of the current measuring device 1 shown in FIG. 1 will be described. The current measuring device 1 is an example of a measuring device, and measures a measurement amount (for example, current) of a measurement target (for example, the conductive wire 100 shown in FIGS. 2 and 7) in a non-contact manner and also measures a measurement target (for example, 6 is configured to be able to detect in a non-contact manner the live state (live line state) in which the AC voltage Va is supplied to the conducting wire 100 shown in FIG. 6 or the outlet 200 shown in FIG. ing. Specifically, the current measuring device 1 includes a clamp sensor 2 and a main body 3 as shown in FIGS.

  The clamp sensor 2 is an example of a clamp sensor, and includes a clamp unit 11 and a detection unit 12 as shown in FIG.

  As shown in FIG. 1, the clamp unit 11 includes sensors 21 a and 21 b (hereinafter, also referred to as “sensor 21” when not distinguished). As shown in the figure, each sensor 21 includes a magnetic core, a shield (both not shown), and a cover 31 that covers the magnetic core and the shield, and is formed in an arc shape in plan view. The sensor 21b (an example of at least one of the sensors 21) is provided with a magnetic detection element 32 (see also FIG. 3).

  Further, in the clamp sensor 2, the sensor 21a is held by the case 60 of the main body 3 so as to be rotatable about the fulcrum P shown in FIG. 1, and the sensor 21b is fixed to the case 60 without being rotated. Thus, the front end surfaces 41 of the front end portions 22 of the sensors 21 are configured to contact and separate (open and close). Further, the current measuring device 1 is configured such that the sensor 21a rotates in response to an operation on the lever 60a disposed on the case 60.

  In addition, the clamp sensor 2 clamps the measurement target (for example, the conducting wire 100) when the tip surfaces 41 of the sensors 21 are close to each other (closed), and in this state (clamped state), the measurement target The first detected amount generated in the step is detected in a non-contact manner. Specifically, in the clamp sensor 2, magnetism as a first detected amount generated in the magnetic core when a current (DC current Id or AC current Ia: see FIG. 2) flows through the conducting wire 100 as a measurement target. Is detected by the magnetic detection element 32 and a detection signal S is output.

  In this case, the magnetic detection element 32 is constituted by a Hall element as an example, and is disposed at a portion facing the tip surface 41 of the sensor 21b in a state of being mounted on the detection unit 12 as shown in FIGS. ing.

  As shown in FIGS. 3 to 5, the detection unit 12 includes a substrate 51, conductor patterns 52 a to 52 d, and a plurality of vias 53. The board | substrate 51 is formed in the plate shape (sheet shape) with the nonelectroconductive material which has flexibility.

  The conductor patterns 52a and 52b correspond to first conductors and are thin-film conductors used to detect a current flowing between a measurement target as the second detected amount and the ground, and are formed on the substrate 51. . In this case, as shown in FIGS. 3 and 5, the conductor pattern 52a is formed on the front surface 51a of the substrate 51, and as shown in FIGS. 4 and 5, the conductor pattern 52b is formed on the conductor pattern 52a on the back surface 51b of the substrate 51. It is formed in the position which opposes. The conductor patterns 52c and 52d are thin-film conductors used as electrical wiring for outputting signals from the magnetic detection element 32, and are formed on the front surface 51a and the back surface 51b of the substrate 51 as shown in FIGS. Each is formed.

  The via 53 corresponds to the second conductor, and is formed so as to extend in the thickness direction of the substrate 51 (vertical direction in the figure) as shown in FIG. 5, and the tip portions 54a of the conductor patterns 52a and 52b. , 54b (the portion located on the tip 51c (see FIGS. 3 and 4) side of the substrate 51) are electrically connected at both ends. That is, in this example, the via 53 is configured by a through hole (through-hole via) penetrating from the front surface 51a to the back surface 51b of the substrate 51 (from the leading end portion 54a of the conductive pattern 52a to the leading end portion 54b of the conductive pattern 52b). Yes.

  Further, as shown in FIG. 1, the detection unit 12 has a distal end side (upper side in the figure) positioned on the distal end surface 41 of the sensor 21b, and the front surface 51a and the rear surface 51b of the substrate 51 on the distal end side are the distal end surfaces. In the state parallel to 41, it is arrange | positioned inside the cover 31 so that it may extend along the front end surface 41 and the internal peripheral surface 42 of the sensor 21b. That is, in this clamp sensor 2, since the via 53 extends in the thickness direction of the substrate 51 parallel to the tip surface 41, the via 53 intersects with the tip surface 41 (in this example, orthogonal). Is disposed at the tip 22 of the sensor 21b.

  As shown in FIGS. 1 and 2, the main body unit 3 includes a display unit 61, an operation unit 62, a processing unit 63, a light emitting unit 64, an audio output unit 65, and a case 60 in which these components are accommodated or arranged. It is configured with.

  The display unit 61 is composed of a liquid crystal panel, for example, and is disposed on the front panel of the case 60 as shown in FIG. The display unit 61 displays the current value Im (measured value) of the current (DC current Id or AC current Ia) according to the control of the processing unit 63. The operation unit 62 includes various switches 62a and a dial 62b arranged on the front panel of the case 60, and outputs operation signals according to these operations.

  The processing unit 63 controls each unit constituting the main body unit 3 in accordance with an operation signal output from the operation unit 62. In addition, the processing unit 63 functions as a measurement unit, and the direct current Id or the alternating current Ia flowing through the measurement target based on the detection signal S (first detected amount detected by the sensor 21) output from the sensor 21. The current value Im is measured and displayed on the display unit 61.

  The processing unit 63 functions as a voltage detection unit, and emits the light emitting unit 64 when the AC voltage is supplied to the measurement target and the voltage value of the AC voltage is equal to or greater than a predetermined value. At the same time, the sound output unit 65 is made to output a warning sound to notify that the measurement target is in the live state. In this case, the processing unit 63 detects the current flowing between the measurement target and the ground via the conductor patterns 52a and 52b of the detection unit 12 as the second detected amount, and the alternating current based on the detected current value. Calculate the voltage value of the voltage.

  Next, a method for using the current measuring device 1 will be described with reference to the drawings.

  For example, when inspecting the live state of the outlet 200 shown in FIG. 6 as a measurement target (a state in which an alternating voltage Va greater than a predetermined specified value is supplied), the operation unit 62 of the main body unit 3 is used. The dial 62b is operated to turn on the power, and then the dial 62b is operated to select the “voltage detection mode”. Subsequently, the current measuring device 1 is held, and the tip of the clamp sensor 2 (tip 22 of the sensor 21b) is brought close to the outlet 200 as shown in FIG.

  Here, when the AC voltage Va is supplied to the outlet 200, the static electricity between the conductor patterns 52 a and 52 b and the vias 53 (hereinafter referred to as “conductor portions”) of the detection unit 12 in the clamp sensor 2 and the outlet 200. An alternating current is generated between the outlet 200 and the ground due to the capacitance, the capacitance between the measurer holding the current measuring device 1 and the conductor, and the capacitance between the measurer and the ground. Flowing. At this time, the processing unit 63 of the main body unit 3 measures the voltage value of the AC voltage Va supplied to the outlet 200 based on the AC current, and whether the measured voltage value is equal to or higher than a specified value. Is determined.

  In this case, when it is determined that the voltage value is equal to or higher than the specified value, that is, when it is determined that the outlet 200 is in a live state, the processing unit 63 causes the light emitting unit 64 to emit light and emits a warning sound to the audio output unit 65. Output. Thereby, it is notified that the outlet 200 is in a live state. Note that a technique for measuring the voltage value of the AC voltage Va supplied to the outlet 200 based on an AC current flowing between the outlet 200 and the ground is publicly known (for example, JP-A-2002-148287). Detailed description is omitted.

  In this current measuring device 1, since the detection unit 12 is disposed on the front end surface 41 of the sensor 21b, the front end of the clamp sensor 2 (the front end 22 of the sensor 21b) with respect to the outlet 200 that is difficult to clamp. By making these close, the conductor part of the detection part 12 arrange | positioned at the front end surface 41 and the outlet 200 can fully be made to adjoin. Therefore, according to the current measuring apparatus 1, even when the measurement target is difficult to clamp, the alternating current flowing when the alternating voltage Va is supplied is reliably detected via the conductor portion of the detection unit 12. As a result, it is possible to reliably detect the live state of the measurement target.

  Further, in the current measuring apparatus 1, the detection unit 12 includes the via 53 that extends in the thickness direction of the substrate 51 and is connected to the conductor patterns 52 a and 52 b formed on the substrate 51. For this reason, in this electric current measuring device 1, when the front-end | tip part of the clamp sensor 2 is made to oppose a measuring object (outlet 200), the opposing area of the conductor part of the detection part 12 which opposes a measuring object is conductor pattern 52a, 52b. This is the area obtained by adding the cross-sectional areas of the vias 53 to the cross-sectional areas of the tip portions 54a and 54b in FIG. Therefore, in the current measuring apparatus 1, the active state is detected using only the conductor patterns 52a and 52b (that is, the facing area of the conductor portion facing the measurement object is only the cross-sectional area of the tip portions 54a and 54b. Compared with the configuration), the capacitance between the measurement object and the conductor part of the detection unit 12 can be increased by the amount of the opposing area of the conductor part of the detection unit 12 facing the measurement object. It is possible to sufficiently improve the detection sensitivity of the electric state.

  Next, for example, when measuring the current value Im of the current flowing through the conducting wire 100 shown in FIG. 7, the dial 62b in the operation unit 62 of the main body 3 is operated to select the “current measurement mode”. . Then, the conducting wire 100 is clamped by the clamp sensor 2 (each sensor 21). Specifically, first, the lever 60a disposed in the case 60 of the main body 3 is pushed. At this time, as shown in the figure, the sensor 21a rotates about the fulcrum P as the rotation center, and the tip surface 41 of the sensor 21a moves away from the tip surface 41 of the sensor 21b.

  Next, the lead wire 100 is passed through the gap between the tip surfaces 41 of the sensors 21, and then the tip surfaces 41 of the sensors 21 are brought close to each other by releasing the pushing of the lever 60 a. At this time, as shown in FIG. 8, the conductive wire 100 is surrounded (clamped) by each sensor 21 (annular body constituted by each sensor 21).

  Here, when the direct current Id or the alternating current Ia flows through the conducting wire 100, the magnetic detection element 32 detects the magnetism generated in each sensor 21 (each magnetic core of each sensor 21) by the current, and the detection signal S is generated. Output. At this time, the processing unit 63 measures the direct current Id flowing through the conducting wire 100 or the current value Im of the alternating current Ia based on the detection signal S output from the magnetic detection element 32 (sensor 21). Next, the processing unit 63 causes the display unit 61 to display the direct current Id or the current value Im of the alternating current Ia measured based on the detection signal S output from the sensor 21.

  Next, when detecting the live state of the conductive wire 100 with the conductive wire 100 clamped, the dial 62b of the operation unit 62 is operated to select the “electric detection mode”.

  Here, when the AC voltage Va is supplied to the conducting wire 100, the capacitance between the conductor portion of the detection unit 12 and the conducting wire 100, the measurer holding the current measuring device 1 and the conductor portion are connected. An alternating current flows between the conducting wire 100 and the ground due to the capacitance between the measuring person and the ground, and the processing unit 63 is supplied to the conducting wire 100 based on the alternating current. While measuring the voltage value of AC voltage Va, it is discriminate | determined whether the measured voltage value is beyond a regulation value. In this case, when it is determined that the voltage value is equal to or higher than the specified value (the conductive wire 100 is in an active state), the processing unit 63 causes the light emitting unit 64 to emit light and causes the audio output unit 65 to output a warning sound. Thereby, it is alert | reported that the conducting wire 100 is an active state.

  In this case, in the current measuring device 1, since the detection unit 12 is disposed not only on the front end surface 41 of the sensor 21b but also on the inner peripheral surface 42, the conductor 100 clamped by each sensor 21 and the inner periphery The conductor portion of the detection unit 12 disposed on the surface 42 is sufficiently close. For this reason, in this electric current measuring apparatus 1, as a result of being able to detect reliably the alternating current which flows when the alternating voltage Va is supplied to the conducting wire 100 via the conductor part of the detection part 12, the conducting wire 100 of a clamped state is obtained. It is possible to reliably detect the live state.

  As described above, in the clamp sensor 2 and the current measuring device 1, the conductor patterns 52a and 52b (first conductors) disposed on the tip portion 22 of the sensor 21b along the direction parallel to the tip surface 41 of the sensor 21b. The detection unit 12 includes a via 53 (second conductor) that is disposed in the tip portion 22 along the direction intersecting the tip surface 41 and connected to the conductor patterns 52a and 52b. . For this reason, according to the clamp sensor 2 and the current measuring device 1, the opposed area of the conductor portion of the detection unit 12 facing the measurement object is compared with the configuration in which the live state is detected using only one conductor pattern. As a result, the capacitance between the measurement object and the conductor portion of the detection unit 12 can be increased, and as a result, the detection sensitivity of the live state can be sufficiently improved.

  Further, according to the clamp sensor 2 and the current measuring device 1, the conductor patterns 52 a and 52 b as the first conductors formed on the substrate 51 and the substrate 51 are formed so as to extend in the thickness direction of the substrate 51. In addition, since the detection unit 12 is configured by including the vias 53 as the second conductors connected to the conductor patterns 52a and 52b, the detection unit 12 can be easily configured. Improvement can be realized at low cost.

  Further, according to the clamp sensor 2 and the current measuring device 1, the conductor patterns 52a and 52b are formed on the front surface 51a and the back surface 51b of the substrate 51, and the via 53 is formed so as to be connected to both the conductor patterns 52a and 52b. As a result, the via 53 can be elongated to the same extent as the thickness of the substrate 51. For this reason, according to the clamp sensor 2 and the current measuring device 1, for example, compared to a configuration in which the via 53 shorter than the thickness of the substrate 51 is formed, the facing area of the conductor portion of the detection unit 12 facing the measurement target. As a result, the detection sensitivity of the live state can be further improved.

  Note that the configurations of the clamp sensor and the measuring apparatus are not limited to the above configurations. For example, instead of the detection unit 12 described above, a configuration including the detection unit 112 illustrated in FIGS. 9 and 10 may be employed. In the following description, the same components as those of the current measuring device 1 described above are denoted by the same reference numerals, and redundant description is omitted. In this configuration, as shown in FIG. 9, a conductor pattern 52a is formed on the front surface 51a of the substrate 51, and as shown in FIG. 10, a conductor pattern is formed at a position opposite to the front end portion 54a of the conductor pattern 52a on the back surface 51b of the substrate 51. 52e is formed, and both ends of a via 53 (not shown) are electrically connected to the tip 54a of the conductor pattern 52a and the conductor pattern 52e. As shown in FIG. 10, a conductor pattern 52 f used as an electric wiring for outputting a signal from the magnetic detection element 32 is formed on the back surface 51 b of the substrate 51. Further, in this configuration, as shown in FIG. 9, the conductor pattern 52a has an electric wiring for outputting a signal from the magnetic detection element 32 (either an electric wiring for signal input or an electric wiring for signal output). As one example), the magnetic detection element 32 is connected. That is, in the clamp sensor 2 and the current measuring device 1 provided with the detecting unit 112, the conductor pattern 52a used for detecting the live state of the measurement target is one of electric wirings for outputting a signal from the magnetic detection element 32. It is also used as. For this reason, according to the clamp sensor 2 and the current measurement device 1 including the detection unit 112, the configuration of the detection unit 112 can be simplified by the amount that the number of conductor patterns can be reduced. In the configuration using the magnetic detection element 32 of a type that operates by inputting a signal, the magnetic detection element 32 is used as an electric wiring for inputting a signal to the magnetic detection element 32 using the conductor pattern 52a used for detecting the active state of the measurement target. 32 can also be connected.

  Further, the detection units 12 and 112 in which the conductor patterns 52a and 52b are respectively formed on the front surface 51a and the back surface 51b of the substrate 51 have been described as an example, but only one of the conductor patterns 52a and 52b is provided. It is also possible to employ the detection units 12 and 112 in which one end of the via 53 is connected to the conductor pattern. It is also possible to employ the detection units 12 and 112 having one or a plurality of inner layer patterns (inner layer conductor patterns) and vias 53 connected to the inner layer patterns.

  Further, the example in which the via 53 is formed at a position facing the tip portions 54a and 54b of the conductor patterns 52a and 52b has been described above. However, the via 53 is formed at a position facing the tip surface 41 of the sensor 21b. The conductor patterns 52a and 52b can be defined at arbitrary positions. For example, the via 53 can be formed in a portion along the length direction (vertical direction in FIGS. 3 and 4) of the detection part 12 in the conductor patterns 52 a and 52 b disposed at the position facing the tip surface 41.

  Moreover, it can replace with the above-mentioned detection part 12, and the structure provided with the detection part 212 shown to FIG. In the following description, the same components as those of the current measuring device 1 described above are denoted by the same reference numerals, and redundant description is omitted. In this configuration, as shown in both drawings, a region 71 (corresponding to a first substrate region) in which the tip 51c side of the substrate 51 is disposed along the tip surface in a state parallel to the tip surface 41 of the sensor 21b. And a region 72 (corresponding to a second substrate region) bent in a direction intersecting the front end surface 41. Moreover, in this structure, as shown to both figures, the conductor pattern 52a used for the detection of the active state of a measuring object is formed in the surface 51a of the board | substrate 51. FIG. The conductor pattern 52a includes a region 81 (corresponding to a first conductor pattern region as a first conductor) formed in the region 71 and a region 82 (second conductor) formed in the region 72 and connected to the region 81. Corresponding to the second conductor pattern region). That is, in this configuration, the region 81 (first conductor) in the conductor pattern 52a is disposed at the tip 22 of the sensor 21b along the direction parallel to the tip surface 41 of the sensor 21b, and the region 82 (first) in the conductor pattern 52a. 2 conductors) are disposed at the distal end portion 22 of the sensor 21b and connected to the region 81 along the direction intersecting the distal end surface 41 of the sensor 21b.

  Also in the clamp sensor 2 and the current measuring device 1 provided with the detection unit 212, the conductor portion of the detection unit 212 facing the measurement target is compared with the configuration in which the live state is detected using only one conductor pattern. Since the opposing area is large, the capacitance between the measurement target and the conductor portion of the detection unit 212 can be increased, and as a result, the detection sensitivity of the live state can be sufficiently improved. Further, according to the clamp sensor 2 and the current measuring device 1 provided with the detection unit 212, the detection sensitivity of the live state is improved because of the simple configuration in which the tip 51c side of the substrate 51 is simply bent together with the conductor pattern 52a. Can be realized at low cost.

  Further, a configuration is adopted in which the conductor pattern 52a in the detection unit 212 described above is connected to the magnetic detection element 32 as one of an electric wiring for signal output from the magnetic detection element 32 and an electric wiring for signal output. You can also.

  In addition, the example in which the detection units 12, 112, and 212 are disposed so as to extend along the tip surface 41 and the inner peripheral surface 42 of the sensor 21b (one of the sensors 21) has been described above. A configuration in which the detection units 12, 112, and 212 are arranged so as to extend along the distal end surface 41 and the outer peripheral surface 43 (see FIG. 1) may be employed. A configuration in which the detection units 12, 112, and 212 are arranged so as to extend along the tip surface 41, the inner peripheral surface 42, and the outer peripheral surface 43 can also be employed. Further, although the example in which the detection units 12, 112, and 212 are arranged inside the cover 31 has been described above, a configuration in which the detection units 12, 112, and 212 are arranged outside the cover 31 can also be adopted.

  In addition, the example in which the detection units 12, 112, and 212 are disposed in the sensor 21b that is one of the two sensors 21 has been described above. However, the configuration in which the detection units 12, 112, and 212 are disposed in the sensor 21a, It is also possible to employ a configuration in which the detection units 12, 112, and 212 are disposed on both sides of 21b.

  Further, although the configuration example in which the sensor 21a is rotatable and the sensor 21b is fixed without being rotated is described above, a configuration in which both the sensors 21a and 21b are rotatable may be employed.

  Moreover, although it described above about the example applied to the clamp-type current measuring device 1 that measures the current as the measured amount in a non-contact manner, it is applied to the clamp-type voltage measuring device that measures the voltage as the measured amount in a non-contact manner. You can also

DESCRIPTION OF SYMBOLS 1 Current measuring apparatus 2 Clamp sensor 11 Clamp part 12,112,212 Detection part 21a, 21b Sensor 22 Front-end | tip part 32 Magnetic detection element 41 Front end surface 51 Substrate 51a Front surface 51b Back surface 52a, 52b Conductive pattern 53 Via 63 Processing part 71, 72 , 81, 82 area 100 conductor

Claims (6)

At least one of the tip parts of each tip part is configured to be rotatable so that the tip surfaces come into contact with each other, and has a pair of arc-shaped sensors that can clamp the measurement object in a state in which the tip surfaces are close to each other. A clamp unit that detects a first detected amount of the measurement target in the clamped state, and a first part that is disposed in at least one of the sensors and that is used to detect a live state in which an AC voltage is supplied to the measurement target. 2 a clamp sensor including a detection unit for detecting a detected amount,
The detector is disposed at the tip along a direction intersecting the tip surface and a first conductor disposed at the tip along a direction parallel to the tip surface. A clamp sensor comprising a second conductor connected to the first conductor.   The detection unit includes a non-conductive plate-like substrate disposed along the tip surface in a state where a front surface and a back surface are parallel to the tip surface, and a conductor as the first conductor formed on the substrate The clamp sensor according to claim 1, further comprising: a pattern; and a via as the second conductor formed on the substrate so as to extend in a thickness direction of the substrate and connected to the conductor pattern. . The conductor patterns are respectively formed on the front surface and the back surface of the substrate,
The clamp sensor according to claim 2, wherein the via is connected to both the conductor patterns formed on the front surface and the back surface. The detection unit includes a non-conductive plate-shaped substrate and a conductor pattern formed on the substrate,
The substrate includes a first substrate region disposed along the tip surface in a state in which a front surface and a back surface are parallel to the tip surface, and a second substrate region bent in a direction intersecting the tip surface. Have
The conductor pattern includes a first conductor pattern region as the first conductor formed in the first substrate region, and the second conductor formed in the second substrate region and connected to the first conductor pattern region. The clamp sensor according to claim 1, further comprising: a second conductor pattern region. A magnetic detection element for detecting magnetism as the first detected amount is disposed at a portion of the at least one sensor facing the tip surface,
5. The clamp sensor according to claim 1, wherein the first conductor is connected to the magnetic detection element as one of an electric wiring for signal input and an electric wiring for signal output. 6.   The clamp sensor according to any one of claims 1 to 5, a measurement unit that measures a measurement amount for the measurement object based on the first detection amount, and detects the second detection amount and A measuring apparatus comprising: a power detection unit that detects the live state of the measurement target based on a second detected amount.

Images