JP2016018016A - Optical receiver module manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a compact optical receiver module in which a plurality of light-receiving elements and a preamplifier circuit are mounted on a bottom wall, and an optical splitter and a reflector mounted on a carrier that is disposed apart from the bottom wall by a support member are center-aligned and accommodated.SOLUTION: The manufacturing method includes the steps of: mounting a PD array 29 and a lens array 28 on the bottom wall where an IC component 32 is mounted, the reference plane 23a of a package serving as a point of reference; mounting a reflector 27 and an optical splitter 26 on a carrier 25, with its rear side 25a serving as a point of reference, and producing an intermediate assembly M; preparing an external light source having an optical axis perpendicular to the mounting reference plane; changing the direction of the intermediate assembly M so that the mounting face of the carrier 25 faces the bottom wall, and adjusting the angle of the intermediate assembly so that the rear end face 27b of the reflector 27 is perpendicular to the optical axis of the external light source; and positioning the intermediate assembly M and mounting it on a support member 24.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a method for manufacturing an optical receiver module, and more particularly to a method for manufacturing an optical receiver module that receives wavelength-multiplexed signal light.

  In recent years, the communication speed has been increased, and an optical receiver module used for an optical transceiver or the like is required to support a transmission speed of 40 Gbps or 100 Gbps. Such high-speed transmission often uses wavelength-multiplexed signal light instead of single-wavelength signal light.

  When receiving a wavelength-multiplexed signal light, a configuration in which a plurality of optical receiving modules each mounting only one light receiving element are provided in the optical transceiver results in an increase in the size of the optical transceiver. Is mounted on a single optical receiving module, and signal light multiplexed by the optical receiving module is received (see, for example, Patent Documents 1 and 2).

JP 2010-186090 A JP 2013-125045 A

In the optical receiving module of Patent Document 2, a preamplifier circuit that amplifies an electrical signal output from each light receiving element is configured as follows in order to accommodate the preamplifier circuit in the module without increasing the size of the module.
That is, in the optical receiver module of Patent Document 2, an optical demultiplexer that receives a wavelength-multiplexed signal light and demultiplexes the signal light into a plurality of signal lights having different wavelengths, and a demultiplexer demultiplexed by the optical demultiplexer. A reflector that reflects the signal light toward the package bottom wall is accommodated in a form mounted on a carrier that is disposed away from the package bottom wall by a support member. In addition, a plurality of light receiving elements that respectively receive the demultiplexed light signals via a plurality of lenses that respectively collect the demultiplexed signal light reflected by the reflector, and a preamplifier circuit that amplifies an output signal from the light receiving elements. It is mounted and accommodated on the bottom wall of the package close to each other.
However, in the optical receiver module of Patent Document 2, it is difficult to align and accommodate the optical demultiplexer and the reflector in the package, but Patent Document 2 does not disclose this point. Further, Patent Document 1 relates to an optical receiving module having a different structure and does not disclose the above points.

  The present invention has been made in view of the above circumstances, and a plurality of light receiving elements and a preamplifier circuit are mounted on a package bottom wall, and mounted on a carrier disposed away from the package bottom wall by a support member. It is an object of the present invention to provide a method for manufacturing a small optical receiving module in which the optical demultiplexer and the reflector are aligned and accommodated.

  The method of manufacturing an optical receiver module according to the present invention receives light obtained by multiplexing a plurality of signal lights having different wavelengths, demultiplexes the light with an optical demultiplexer, and reflects the demultiplexed signal lights. Of the optical receiving module that reflects the signal toward the bottom wall of the package and collects the plurality of signal lights by the lens array, receives the light by the PD array, amplifies the output signal of the PD array by the preamplifier circuit, and outputs the amplified signal. A manufacturing method, wherein a mounting substrate having a PD array is mounted on a bottom wall on which a preamplifier circuit is mounted with reference to a mounting reference plane set in the package, and the mounting reference plane is used as a reference above the PD array. An array mounting step for mounting the lens array, a reflector mounted on the carrier in parallel to one side of the carrier, an optical demultiplexer on the carrier, and a predetermined angle with respect to one side of the carrier; An assembly production step for producing an intermediate assembly, an external light source preparation step for preparing an external light source having an optical axis perpendicular to the mounting reference plane, and a mounting surface for the optical demultiplexer and reflector of the carrier. An angle adjustment step of adjusting the angle of the intermediate assembly so that one surface other than the reflection surface of the reflector is perpendicular to the optical axis of the external light source after changing the orientation of the intermediate assembly so as to face the bottom wall And an assembly mounting step of positioning the intermediate assembly so that the light reflected by the reflector is collected by the lens array and received by the PD array, and mounted on the support member on the bottom wall.

  The array mounting step includes, for example, a step of mounting one side of the mounting substrate having the PD array on the mounting reference surface and then mounting on the bottom wall; and a step of pressing one side of the lens array on the mounting reference surface; And aligning the center of the PD with the center of the PD array, and then mounting the lens array above the PD array.

  In the assembly mounting step, for example, a light source that emits the multiplexed light is prepared, the light from the light source is incident on an optical demultiplexer, demultiplexed into a plurality of signal lights, reflected by a reflector, and a lens. Condensing light at the array and receiving light at each PD of the PD array, and aligning the intermediate assembly so that the output signal from each PD is maximized or equal to or greater than a predetermined value.

  The external light source preparation step includes, for example, preparing a reflective surface that is parallel to the mounting reference surface and faces the mounting reference surface, irradiating the reflected light with light emitted from the external light source, and detecting the reflected light And making the optical axis of the external light source perpendicular to the mounting reference plane.

  A small-sized optical receiving module in which a plurality of light receiving elements and a preamplifier circuit are mounted on a package bottom wall, and an optical demultiplexer and a reflector are mounted on a carrier arranged away from the package bottom wall by a support member The optical demultiplexer and the reflector can be aligned and accommodated therein.

It is a figure which shows an example of the optical receiver module manufactured with the manufacturing method of the optical receiver module which concerns on this invention. It is a figure which shows an example of the optical receiver module manufactured with the manufacturing method of the optical receiver module which concerns on this invention. It is a figure explaining the mounting form to the 1st mounting board | substrate of a lens array and PD array. It is a figure which shows a mode that the 2nd mounting substrate in the state by which the 1st mounting substrate and IC component are not mounted is mounted in the package. It is a figure for demonstrating an optical demultiplexer and a reflector. It is a figure explaining each process in the manufacturing method of the optical receiver module concerning the present invention. It is a figure explaining each process in the manufacturing method of the optical receiver module concerning the present invention. It is a figure explaining each process in the manufacturing method of the optical receiver module concerning the present invention. It is a figure explaining each process in the manufacturing method of the optical receiver module concerning the present invention.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments according to a method for manufacturing an optical receiver module of the invention will be described with reference to the drawings. In addition, this invention is not limited to these illustrations, is shown by the claim, and intends that all the changes are included within the meaning and range equivalent to the claim. Moreover, in the following description, the structure which attached | subjected the same code | symbol also in different drawing is the same, and the description may be abbreviate | omitted.

  1 and 2 are diagrams illustrating an example of an optical receiver module manufactured by the method of manufacturing an optical receiver module according to the present invention. FIG. 1 is a perspective view showing a state in which a package lid is removed and a part of a package frame is broken for ease of explanation, and FIG. 2A is a cross-sectional view of the optical receiver module of FIG. 2 (B) is a schematic diagram for explaining the configuration of the optical receiving portion.

The optical receiver module 10 shown in the figure includes a receptacle part 11 to which an optical fiber is connected, a package part 12 in which a light receiving element, an optical component and the like are accommodated, and a terminal part 13 for electrical connection with an external circuit. Yes. The receptacle part 11 includes a sleeve 14 into which a ferrule of an optical connector is inserted, a holder 16 for joining the receptacle part 11 to the package part 12, and a joint sleeve 15 for connecting the sleeve 14 and the holder 16 so as to be aligned. Have
Below, the receptacle part 11 side of the optical receiver module 10 will be described as the front side, and the opposite side as the rear side.

  The package portion 12 has a substantially rectangular parallelepiped shape. For example, the package frame 20 has a rectangular tube shape, a package bottom wall 21 that forms a bottom wall, and a package lid 22 that closes the top opening (see FIG. 2A). Have A cylindrical bush 23 is provided on the front wall of the package frame 20. The front surface of the bush 23 is a flat surface so as to serve as a reference surface in alignment work with a collet described later. The package bottom wall 21 can be made of a material such as copper molybdenum or copper tungsten, and heat dissipation can be enhanced by using a material having good thermal conductivity. The package lid 22 is fixed to the package frame 20 so as to seal the elements and components after housing and wiring.

The terminal portion 13 is formed, for example, by laminating a plurality of ceramic substrates, assembled in a form that fits into the rear wall of the package frame 20, and further electrically connects an element in the package portion 12 and an external system. A high frequency line and a power supply line to be connected are formed.
The package portion 12 and the terminal portion 13 constitute a “package” of the present invention.

  The holder 16 of the receptacle part 11 is fixed to the package part 12 via the bush 23 provided in the front side of the package frame 20, as shown to FIG. 2 (A). A sleeve 14 is coupled to the holder 16 via a joint sleeve 15, and alignment in the axial direction and the radial direction is performed by the joint sleeve 15. A stub 17 that forms an optical coupling is disposed in the sleeve 14, and a lens 18 that condenses the signal light emitted from the optical fiber in the stub 17 to be parallel light is disposed on the holder 16. The signal light from the lens 18 is emitted into the package part 12 through an optical window 19 provided in a sealed form in the bush 23.

  In the package unit 12, an optical demultiplexer (hereinafter referred to as O-DeMux) 26 that demultiplexes the wavelength-multiplexed signal light emitted from the lens 18 into a plurality of signal lights having different wavelengths, and this demultiplexing. And a reflector 27 formed of a prism or the like for reflecting the signal light (hereinafter referred to as demultiplexed signal light) to the package bottom wall 21 side. The O-DeMux 26 and the reflector 27 are mounted on a carrier 25 that is arranged in parallel with the package bottom wall 21 by the support member 24 so as to face the package bottom wall 21.

  Further, a lens array 28 in which a plurality of lenses for collecting the demultiplexed signal light reflected by the reflector 27 is formed in the package unit 12, and the demultiplexed signal light is respectively transmitted through the lens array 28. A PD array 29 in which a plurality of photodiodes (PD) are formed is housed as a plurality of light receiving elements that receive light. The lens array 28 and the PD array 29 are mounted on the package bottom wall 21 via the first mounting substrate 30 and the second mounting substrate 31.

  As shown in FIG. 2B, the optical receiving module 10 composed of the above-described components includes an O-DeMux 26 and a reflector 27 that are separated from the plane of the package bottom wall 21 in parallel in the height direction. It is mounted on 25 mounting surfaces. The lens array 28 and the PD array 29 are mounted by being arranged in the vertical direction using a space separated from the plane of the package bottom wall 21 in the height direction. That is, the reflector 27, the lens array 28, and the PD array 29 are arranged so as to overlap in the vertical direction in the package part 12, and the arrangement space in the planar direction is reduced. Thus, an IC component 32 which is a preamplifier circuit for amplifying the signal of the PD array 29 is mounted in the vacant space.

FIG. 3 is a diagram for explaining a mounting form of the lens array 28 and the PD array 29 on the first mounting substrate 30.
As shown in FIG. 3, the lens array 28 has a plurality of lenses 28a formed integrally with a transparent glass substrate 28b. The PD array 29 is formed by integrally forming a plurality of PDs 29a.
The lens array 28 and the PD array 29 are designed so that the pitch of the lenses 28a and the pitch of the PD 29a, in other words, the adjacent PD interval and the adjacent lens interval coincide with each other in order to increase the light receiving sensitivity. Are fixed so as to substantially match.

  The first mounting substrate 30 is coated with a eutectic solder 30a at a fixed portion in the central portion thereof. The eutectic solder is preferably gold tin (AuSn) solder. The PD array 29 is fixed to a portion where the eutectic solder 30a is applied. Further, AuSn patterns (not shown) having substantially the same shape as the bottom surfaces of the support posts 33 are formed on both ends of the first mounting substrate 30 in order to fix the prismatic support posts 33. On this AuSn pattern, a support post 33 having a metal plating on the bottom surface is fixed, and the PD array 29 is fixed on the support post 33.

FIG. 4 is a diagram illustrating a state in which the second mounting substrate 31 in a state where the first mounting substrate 30 and the IC component 32 are not mounted is mounted in the package.
The second mounting substrate 31 is made of, for example, a copper tungsten substrate. As shown in FIG. 4, the second mounting substrate 31 is a rear end in the package, and is a feedthrough in which a high frequency / power line from the terminal 13a is laid ( feed-through) is mounted in the immediate vicinity of the substrate 13b.
A pattern 31a that matches the shape of the component 32 is formed behind the second mounting substrate 31 so that the IC component 32 (see FIG. 1) can be easily mounted. Although not shown, a mounting pattern for an electronic component such as a die capacitor is formed on the side of the second mounting substrate 31. The first mounting substrate 30 is mounted on the portion of the second mounting substrate 31 where the IC component 32 and the die capacitor do not exist, that is, the front portion.

  FIG. 5 is a diagram for explaining the O-DeMux 26 and the reflector 27. FIG. 5A is a perspective view of the O-DeMux 26 and the reflector 27 mounted on the carrier 25, and FIG. It is the same top view.

As shown in FIG. 5A, the O-DeMux 26 is obtained by integrating a single reflecting member 26a and a plurality of wavelength filters 26b having different wavelengths to be transmitted by a transparent optical member 26c. It is composed of a dielectric multilayer film (filter group) and is mounted near the center of the carrier 25.
The reflector 27 bends the optical axis of the plurality of signal lights demultiplexed by the O-DeMux 26 toward the PD array 29. For example, the reflector 27 is formed of a prism, and the reflection surface 27a has an angle of 45 degrees. , And mounted on the rear end portion of the carrier 25 so as to face the O-DeMux 26.
The carrier 25 mounts the O-DeMux 26 and the reflector 27. Note that the O-DeMux 26 is fixed at a predetermined angle with respect to the reference surface 23a (see FIG. 8A) of the front end surface of the bush 23 for measures against return light.

  As shown in FIG. 5B, when multiplexed signal light in which signal lights having different wavelengths (λ1, λ2, λ3, and λ4) are multiplexed is incident on the O-DeMux 26, it is first arranged. The signal light having the wavelength λ1 is transmitted through the wavelength filter 26b, but the signal light having other wavelengths (λ2, λ3, λ4) is reflected. The reflected signal light is applied to the second wavelength filter 26b by the reflecting member 26a, the signal light having the wavelength λ2 is transmitted, and the signal light having other wavelengths (λ3, λ4) is reflected. Thereafter, transmission and reflection are similarly repeated, and the multiplexed signal light is demultiplexed into a plurality of signal lights having different wavelengths. The demultiplexed signal light is reflected in the orthogonal direction by the reflecting surface 27a of the reflector 27, and is received by the PD array 29 through the lens array 28 as described above.

  The integrated body of the O-DeMux 26, the reflector 27, and the carrier 25 is referred to as an intermediate assembly.

For example, the intermediate assembly is manufactured by the following procedure.
First, the rectangular carrier 25 is fixed on a predetermined jig. Then, a certain amount of ultraviolet curable resin is applied to a predetermined position of the carrier 25, that is, the mounting position of the O-DeMux 26 and the reflector 27. Further, an external light source is prepared, and the rear end side 25a of the carrier 25 is set as a reference side, and the optical axis of the external light source is set to be 90 ° with respect to the reference side. For this setting, at least a part of the rear end side 25a is a reflecting surface.

Next, the O-DeMux 26 is gripped, and the angle of the O-DeMux 26 is adjusted so that the light exit surface 26d is perpendicular to the optical axis of the external light source. Since the light incident on the light exit surface 26d is reflected by the reflecting member 26a, the angle of the O-DeMux 26 can be adjusted based on the reflected light. After this adjustment, the O-DeMux 26 is further rotated by an angle determined by the specifications of the O-DeMux 26. While maintaining this angle, the O-DeMux 26 is moved and placed at a predetermined position on the carrier 25. Further, the angle of the reflector 27 is adjusted so that the rear end surface 27b is perpendicular to the optical axis of the external light source. For this setting, at least a part of the rear end surface 27b of the reflector 27 is a reflecting surface. After this adjustment, the reflector 25 is placed at a predetermined position on the carrier 25. The XY positions of the O-DeMux 26 and the reflector 27 on the carrier 25 are determined by marks provided on the carrier 25.
Finally, the intermediate assembly is obtained by irradiating ultraviolet rays and further applying heat to fix both parts to the carrier 25.

  The intermediate assembly manufacturing method described above is a method using an external light source, but may be a simpler method as described below. First, the O-DeMux 26 and the reflector 27 adsorbed by the collet are lightly pressed against the jig surface temporarily set on the front end side 25a of the carrier 25, and the jig surface, the O-DeMux 26, and the reflector 27 are abutted. Adjust so that the surfaces are parallel. Then, the reflector 27 is directly moved to a predetermined position on the carrier 25, and the O-DeMux 26 is rotated by an angle determined by the above specifications and then moved to a predetermined position on the carrier 25 by a collet to fix both parts on the carrier 25. It is.

  Next, a method for manufacturing the optical receiver module 10 of FIG. 1 will be described. 6 to 9 are diagrams for explaining each step in the method of manufacturing the optical receiver module 10, in which FIGS. 6, 8 and 9 are sectional views, and FIG. 7 is a rear perspective view.

(1) Mounting process of PD array 29 Eutectic solder 30a (see FIG. 3) is applied to the central portion of the first mounting substrate 30. As shown in FIG. The array 29 is die-bonded. Similarly, two support posts 33 whose rear surfaces are metal-plated are fixed to both end portions of the first mounting substrate 30 where the PD array 29 is not mounted.

(2) Mounting Step of Second Mounting Board 31 As shown in FIG. 6B, the second mounting board 31 is fixed to a predetermined location in the package. When fixing, eutectic alloy pellets are used. The second mounting substrate 31 is mounted in the vicinity of the feedthrough substrate 13b so that the center of the package and the center of the second mounting substrate 31 substantially coincide with each other in order to mount an IC component or a PD array.

(3) Component mounting step on the second mounting substrate 31 A pattern 31a (see FIG. 4) is formed on the second mounting substrate 31 along the shape of the IC component. After applying a certain amount of a conductive adhesive such as an epoxy adhesive as a filler, an IC component 32 is placed on the second mounting substrate 31 along the pattern shape as shown in FIG. Fix the adhesive by heat curing.
Although illustration is omitted, similarly, since a pattern along the outer shape of the die capacitor is formed on the second mounting substrate 31, after applying a certain amount of conductive adhesive inside the pattern, A die capacitor is placed along, and the conductive adhesive is thermally cured and fixed.

(4) Mounting process of PD array 29 to package The first mounting board 30 mounted with the PD array 29 manufactured in the process of (1) is a second mounting board 31 as shown in FIG. Place on top.
More specifically, first, a certain amount of conductive adhesive is applied to a predetermined location on the second mounting substrate 31, that is, a mounting location on the first mounting substrate 30. Next, the first mounting substrate 30 produced in the step (1) is sucked using the dedicated collet and the collet driving device. The first mounting board 30 adsorbed by the collet and the center of the package substantially coincide with each other on a mounting reference surface (hereinafter referred to as a reference surface) 23a which is the outer surface of the bush 23 on the front wall of the package. The rear end of one mounting substrate 30 is lightly abutted and adjusted so that the first mounting substrate 30, that is, the PD array 29 is parallel to the reference surface 23a. Then, the collet is once moved upward and moved backward by a predetermined amount from the reference surface 23a, and then the first mounting board 30 is pressed against the second mounting board 31 together with the collet. In this state, the conductive adhesive on the back surface of the first mounting substrate 30 is thermally cured. After the heat curing is completed, between the wiring pattern on the feedthrough substrate 13b and the IC component 32, between the wiring pattern and the die capacitor, between the PD array 29 and the IC component 32, and between the PD array 29 and the die capacitor. Electrical connection is made by wire bonding.

(5) Mounting Process of Lens Array 28 First, as shown in FIG. 7, a package including the package frame 20 and the like is fixed on a dedicated stage 40. Next, a certain amount of ultraviolet curable adhesive is applied to the top of the support post 33 mounted on the first mounting substrate. Then, the lens array 28 is gripped using a dedicated collet 50 for gripping the lens array 28, and the center of the lens array 28 and the center of the package are used in the same manner as in the step (4) using the collet driving device. 8A, the lens array 28 is abutted against the reference surface 23a of the package. Thereafter, the collet holding the lens array 28 is moved immediately above the PD array 29. Here, it is confirmed whether or not the center of the lens array 28 and the center of the PD array 29 coincide. If the two are offset, the lens array 28 is slid only in the direction perpendicular to the long axis of the package so that the centers of the two coincide. The above confirmation is made visually. Then, the collet is lowered, and the bottom surface of the lens array 28 is pressed against the support post 33, and the lens array 28 is temporarily fixed by irradiating ultraviolet rays. To fix the lens array 28 above the PD array 29. The feature of this process is that all alignment of the lens array 28 and the PD array 29 is performed visually.

(6) Mounting process of supporting member 24 in package First, an ultraviolet curable adhesive is applied to a portion where the supporting member 24 is mounted inside the package. Next, similarly to the step (5), using the predetermined collet and the driving device for the collet, the support member 24 is configured so that the center of the support member 24 and the center of the package substantially coincide with each other. As shown in FIG. 8B, the support member 24 is abutted against the reference surface 23a of the package and adjusted so as to be parallel to the reference surface 23a. Thereafter, the support member 24 is moved to a predetermined location on the package, and the collet is applied to the package bottom wall 21 while applying a constant load, and then temporarily fixed by irradiating ultraviolet rays. At this stage, nothing is mounted on the support member 24. The support member 24 is a U-shaped part opened at the top, and the support member 24 is simply mounted in the package in this process.

(7) Mounting Step of Intermediate Assembly onto Support Member 24 First, an ultraviolet curable adhesive is applied to the tops of the two sides of the support member 24 temporarily fixed in the step (6). Next, as in the step (6), the intermediate assembly M is aligned using a predetermined collet and a driving device for the collet.
Specifically, first, the package that has been processed up to the step (6) is fixed to the mounting stage 60 as shown in FIG. The mounting stage 60 is provided with a flat surface 60a, and a mounting jig 61 having an L-shaped section having a partition surface 61a perpendicular to the flat surface 60a is provided on the flat surface 60a. The reference surface 23a at the front end of the package is pressed against the partition surface 61a and fixed. Further, the reflection mirror 62 is set in parallel with the partition surface 61a on the flat surface 60a of the mounting stage 60 in front of the partition surface 61a.

Next, an external light source 70 that emits parallel light is prepared. Then, adjustment is made so that the optical axis of the external light source 70 is perpendicular to the reflection mirror 62.
Then, the orientation of the intermediate assembly M is changed so that the mounting surfaces of the O-DeMux 26 and the reflector 27 of the carrier 25 are opposed to the package bottom wall 21, and the rear end surface 27b of the reflector 27 is an external light source. The intermediate assembly M is adjusted to be perpendicular to the optical axis of 70. When an autocollimator is employed as the external light source 70, the light emitted from the autocollimator is reflected by the rear end surface 27b of the reflector 27 and then incident on the autocollimator, and the angle of the rear end surface 27b with respect to the optical axis is set. Easy to read.
Instead of the reflection mirror 62, a high reflection component / film may be provided on the partition surface 61a and the adjustment may be performed in the same manner as described above.

  In this way, the angle of the reflector 27 is aligned with the optical axis of the autocollimator. Here, a case is shown in which two angles, the angle in the flat surface 60a of the stage 60, that is, the angle in the XY plane of the drawing, and the tilt angle (elevation angle) φ with respect to the XY plane are aligned. It is good also as only alignment. This is because the tilt angle φ has a large tolerance.

  Then, the intermediate assembly M is placed on the support member 24 while maintaining the aligned angle. Furthermore, a light source including a wavelength to be processed by the present optical receiving module is prepared on the reference surface 23 a side, light from the light source is actually incident on the O-DeMux 26, spectrally reflected by the reflector 27 and incident on the PD array 29. Let The position of the intermediate assembly M in the XY plane of the drawing is finely adjusted so that the output signal of each PD in the PD array 29 is maximized or the output signal exceeds a predetermined value. Alignment in this step is equivalent to aligning the position of the reflector 27 so that each signal light bent by 90 ° by the reflector 27 is accurately incident on each PD. After completion of the fine adjustment, the intermediate assembly M is temporarily fixed by irradiating with ultraviolet rays. Then, heat is applied to the entire package to thermally cure the temporarily fixed adhesive.

(8) Other Mounting Steps After the mounting up to (7) is completed, a package lid is placed on the upper surface of the package frame 20 and seam welding is performed under vacuum in accordance with a well-known technique. Then, the receptacle portion is attached to the front surface of the bush 23 by welding, and an integrated ROSA (Receiving Optical Sub-Assembly) is attached by attaching an FPC (flexible printed circuit board) to the portion of the package where the high frequency line and the power supply line are formed. Is completed.

  It should be noted that an adhesive other than the above example may be used for fixing each component.

DESCRIPTION OF SYMBOLS 10 ... Optical receiver module, 11 ... Receptacle part, 12 ... Package part, 13 ... Terminal part 13a ... Terminal, 13b ... Feed-through board, 14 ... Sleeve, 15 ... Joint sleeve, 16 ... Holder, 17 ... Stub, 18 ... Lens , 19 ... Optical window, 20 ... Package frame, 21 ... Package bottom wall, 22 ... Package lid, 23 ... Bush, 23a ... Mounting reference surface (reference surface), 24 ... Support member, 25 ... Carrier, 25a ... Rear end Side, 26 ... O-DeMux, 26a ... reflecting member, 26b ... wavelength filter, 26c ... transparent optical member, 27 ... reflector, 27a ... reflecting surface, 27b ... rear end surface, 28 ... lens array, 28a ... lens, 28b ... Glass substrate, 28c ... rear edge, 29 ... PD array, 29a ... PD, 30 ... first mounting substrate, 30a ... eutectic solder, 31 ... second mounting substrate , 31a ... pattern, 32 ... IC component, 33 ... support post, 40 ... stage, 50 ... collet, 60 ... mounting stage, 61 ... mounting jig, 62 ... reflection mirror, 70 ... external light source.

Claims (4)

Receiving light multiplexed with a plurality of signal lights having different wavelengths, demultiplexing the light by an optical demultiplexer, reflecting the demultiplexed signal lights toward the bottom wall of the package by a reflector, A method of manufacturing an optical receiving module that collects a plurality of signal lights with a lens array, receives the light with a PD array, amplifies an output signal of the PD array with a preamplifier circuit, and outputs the amplified signal.
A mounting substrate having the PD array is mounted on the bottom wall on which the preamplifier circuit is mounted with reference to the mounting reference surface set in the package, and the mounting reference surface is used as a reference above the PD array. An array mounting step for mounting the lens array;
The reflector is mounted on the carrier in parallel to one side of the carrier, and the optical demultiplexer is mounted on the carrier at a predetermined angle with respect to the one side of the carrier to produce an intermediate assembly. An assembly fabrication step to:
An external light source preparation step of preparing an external light source having an optical axis perpendicular to the mounting reference plane;
After changing the orientation of the intermediate assembly so that the mounting surfaces of the optical demultiplexer and the reflector of the carrier face the bottom wall, one surface other than the reflective surface of the reflector is the surface of the external light source. Adjusting the angle of the intermediate assembly to be perpendicular to the optical axis;
Assembly mounting step of aligning the intermediate assembly so that the light reflected by the reflector is collected by the lens array and received by the PD array, and mounted on a support member on the bottom wall. A method for manufacturing a receiving module. The array mounting step includes mounting on the bottom wall after abutting one side of the mounting substrate having the PD array against the mounting reference surface;
After one side of the lens array is abutted against the mounting reference surface, the lens array is aligned with the center of the PD array so that the center of the lens array coincides with the center of the PD array, and then the lens array is mounted above the PD array. The manufacturing method of the optical receiver module of Claim 1 including the step to carry out. In the assembly mounting step, a light source that emits the multiplexed light is prepared, the light from the light source is incident on the optical demultiplexer, is demultiplexed into the plurality of signal lights, and is reflected by the reflector. Condensing with the lens array and receiving light with each PD of the PD array;
The method of manufacturing an optical receiver module according to claim 1, further comprising: aligning the intermediate assembly so that an output signal from each PD is maximized or equal to or greater than a predetermined value.   The external light source preparation step prepares a reflective surface that is parallel to the mounting reference surface and faces the mounting reference surface, irradiates the reflective surface with light emitted from the external light source, and detects the reflected light The manufacturing method of the optical receiver module of any one of Claims 1-3 including the step which makes the optical axis of the said external light source perpendicular | vertical with respect to the said mounting reference plane by doing.

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