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JP2013215813A5 - - Google Patents

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Publication number
JP2013215813A5
JP2013215813A5 JP2012086335A JP2012086335A JP2013215813A5 JP 2013215813 A5 JP2013215813 A5 JP 2013215813A5 JP 2012086335 A JP2012086335 A JP 2012086335A JP 2012086335 A JP2012086335 A JP 2012086335A JP 2013215813 A5 JP2013215813 A5 JP 2013215813A5
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JP
Japan
Prior art keywords
workpiece
static pressure
pressure pad
pad
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012086335A
Other languages
English (en)
Japanese (ja)
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JP5872947B2 (ja
JP2013215813A (ja
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Application filed filed Critical
Priority claimed from JP2012086335A external-priority patent/JP5872947B2/ja
Priority to JP2012086335A priority Critical patent/JP5872947B2/ja
Priority to DE102013205446A priority patent/DE102013205446A1/de
Priority to KR1020130033289A priority patent/KR102015666B1/ko
Priority to SG2013024195A priority patent/SG193771A1/en
Priority to TW102111803A priority patent/TWI574781B/zh
Publication of JP2013215813A publication Critical patent/JP2013215813A/ja
Publication of JP2013215813A5 publication Critical patent/JP2013215813A5/ja
Publication of JP5872947B2 publication Critical patent/JP5872947B2/ja
Application granted granted Critical
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Anticipated expiration legal-status Critical

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JP2012086335A 2012-04-05 2012-04-05 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤 Active JP5872947B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012086335A JP5872947B2 (ja) 2012-04-05 2012-04-05 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤
DE102013205446A DE102013205446A1 (de) 2012-04-05 2013-03-27 Werkstückeinbring- und Ausbringverfahren beim Doppelendflächenschleifen und eine Doppelendflächenschleifmaschine
KR1020130033289A KR102015666B1 (ko) 2012-04-05 2013-03-28 양두 평면 연삭에 있어서의 워크 반입출 방법 및 양두 평면 연삭기
TW102111803A TWI574781B (zh) 2012-04-05 2013-04-02 在兩頭平面硏磨的工件搬入出方法及兩頭平面硏磨盤
SG2013024195A SG193771A1 (en) 2012-04-05 2013-04-02 Workpiece carrying-in-and-out method in double-end surface grinding and double disk surface grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012086335A JP5872947B2 (ja) 2012-04-05 2012-04-05 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Publications (3)

Publication Number Publication Date
JP2013215813A JP2013215813A (ja) 2013-10-24
JP2013215813A5 true JP2013215813A5 (pt) 2014-08-14
JP5872947B2 JP5872947B2 (ja) 2016-03-01

Family

ID=49290307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012086335A Active JP5872947B2 (ja) 2012-04-05 2012-04-05 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Country Status (5)

Country Link
JP (1) JP5872947B2 (pt)
KR (1) KR102015666B1 (pt)
DE (1) DE102013205446A1 (pt)
SG (1) SG193771A1 (pt)
TW (1) TWI574781B (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6250435B2 (ja) * 2014-02-26 2017-12-20 光洋機械工業株式会社 両頭平面研削法
JP6183301B2 (ja) * 2014-06-16 2017-08-23 信越半導体株式会社 自動ハンドリング装置
JP6383700B2 (ja) * 2015-04-07 2018-08-29 光洋機械工業株式会社 薄板状ワークの製造方法及び両頭平面研削装置
JP6707831B2 (ja) 2015-10-09 2020-06-10 株式会社Sumco 研削装置および研削方法
CN105448795B (zh) * 2015-11-30 2018-03-16 北京中电科电子装备有限公司 一种晶圆抓取系统
CN114227524A (zh) * 2021-12-30 2022-03-25 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN114986381B (zh) * 2022-06-16 2023-08-22 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN117206999B (zh) * 2023-11-08 2024-02-20 瓦房店威远滚动体制造有限公司 一种能够提高打磨精度的双端面磨床

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10249687A (ja) * 1997-03-07 1998-09-22 Super Silicon Kenkyusho:Kk 薄板状工作物の両面研削・研磨装置
JP3951496B2 (ja) * 1999-03-30 2007-08-01 光洋機械工業株式会社 薄板円板状ワークの両面研削装置
JP4798480B2 (ja) * 2005-05-25 2011-10-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの製造方法および両面研削方法並びに半導体ウェーハの両面研削装置
JP4621261B2 (ja) * 2008-02-01 2011-01-26 株式会社住友金属ファインテック 両面研摩装置

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