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KR102015666B1 - 양두 평면 연삭에 있어서의 워크 반입출 방법 및 양두 평면 연삭기 - Google Patents

양두 평면 연삭에 있어서의 워크 반입출 방법 및 양두 평면 연삭기 Download PDF

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Publication number
KR102015666B1
KR102015666B1 KR1020130033289A KR20130033289A KR102015666B1 KR 102015666 B1 KR102015666 B1 KR 102015666B1 KR 1020130033289 A KR1020130033289 A KR 1020130033289A KR 20130033289 A KR20130033289 A KR 20130033289A KR 102015666 B1 KR102015666 B1 KR 102015666B1
Authority
KR
South Korea
Prior art keywords
workpiece
positive pressure
pressure pad
grinding
carrier
Prior art date
Application number
KR1020130033289A
Other languages
English (en)
Korean (ko)
Other versions
KR20130113367A (ko
Inventor
아츠시 시바나카
사토시 가와바타
Original Assignee
고요 기카이 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고요 기카이 고교 가부시키가이샤 filed Critical 고요 기카이 고교 가부시키가이샤
Publication of KR20130113367A publication Critical patent/KR20130113367A/ko
Application granted granted Critical
Publication of KR102015666B1 publication Critical patent/KR102015666B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
KR1020130033289A 2012-04-05 2013-03-28 양두 평면 연삭에 있어서의 워크 반입출 방법 및 양두 평면 연삭기 KR102015666B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-086335 2012-04-05
JP2012086335A JP5872947B2 (ja) 2012-04-05 2012-04-05 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Publications (2)

Publication Number Publication Date
KR20130113367A KR20130113367A (ko) 2013-10-15
KR102015666B1 true KR102015666B1 (ko) 2019-08-28

Family

ID=49290307

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130033289A KR102015666B1 (ko) 2012-04-05 2013-03-28 양두 평면 연삭에 있어서의 워크 반입출 방법 및 양두 평면 연삭기

Country Status (5)

Country Link
JP (1) JP5872947B2 (pt)
KR (1) KR102015666B1 (pt)
DE (1) DE102013205446A1 (pt)
SG (1) SG193771A1 (pt)
TW (1) TWI574781B (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6250435B2 (ja) * 2014-02-26 2017-12-20 光洋機械工業株式会社 両頭平面研削法
JP6183301B2 (ja) * 2014-06-16 2017-08-23 信越半導体株式会社 自動ハンドリング装置
JP6383700B2 (ja) * 2015-04-07 2018-08-29 光洋機械工業株式会社 薄板状ワークの製造方法及び両頭平面研削装置
JP6707831B2 (ja) * 2015-10-09 2020-06-10 株式会社Sumco 研削装置および研削方法
CN105448795B (zh) * 2015-11-30 2018-03-16 北京中电科电子装备有限公司 一种晶圆抓取系统
CN114227524A (zh) * 2021-12-30 2022-03-25 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN114986381B (zh) * 2022-06-16 2023-08-22 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN117206999B (zh) * 2023-11-08 2024-02-20 瓦房店威远滚动体制造有限公司 一种能够提高打磨精度的双端面磨床

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000280155A (ja) * 1999-03-30 2000-10-10 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10249687A (ja) * 1997-03-07 1998-09-22 Super Silicon Kenkyusho:Kk 薄板状工作物の両面研削・研磨装置
JP4798480B2 (ja) * 2005-05-25 2011-10-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの製造方法および両面研削方法並びに半導体ウェーハの両面研削装置
JP4621261B2 (ja) * 2008-02-01 2011-01-26 株式会社住友金属ファインテック 両面研摩装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000280155A (ja) * 1999-03-30 2000-10-10 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置

Also Published As

Publication number Publication date
TWI574781B (zh) 2017-03-21
KR20130113367A (ko) 2013-10-15
DE102013205446A1 (de) 2013-10-24
TW201402271A (zh) 2014-01-16
JP5872947B2 (ja) 2016-03-01
SG193771A1 (en) 2013-10-30
JP2013215813A (ja) 2013-10-24

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