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JP2013215813A5 - - Google Patents

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Publication number
JP2013215813A5
JP2013215813A5 JP2012086335A JP2012086335A JP2013215813A5 JP 2013215813 A5 JP2013215813 A5 JP 2013215813A5 JP 2012086335 A JP2012086335 A JP 2012086335A JP 2012086335 A JP2012086335 A JP 2012086335A JP 2013215813 A5 JP2013215813 A5 JP 2013215813A5
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JP
Japan
Prior art keywords
workpiece
static pressure
pressure pad
pad
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012086335A
Other languages
Japanese (ja)
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JP5872947B2 (en
JP2013215813A (en
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Publication date
Application filed filed Critical
Priority claimed from JP2012086335A external-priority patent/JP5872947B2/en
Priority to JP2012086335A priority Critical patent/JP5872947B2/en
Priority to DE102013205446A priority patent/DE102013205446A1/en
Priority to KR1020130033289A priority patent/KR102015666B1/en
Priority to SG2013024195A priority patent/SG193771A1/en
Priority to TW102111803A priority patent/TWI574781B/en
Publication of JP2013215813A publication Critical patent/JP2013215813A/en
Publication of JP2013215813A5 publication Critical patent/JP2013215813A5/ja
Publication of JP5872947B2 publication Critical patent/JP5872947B2/en
Application granted granted Critical
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Description

右静圧パッド２によるワークＷの吸着後に、左静圧パッド１を後退位置Ｘ２へと後退させる前に、図１５に示すように左静圧パッド１から静圧水を供給して左静圧パッド１とワークＷとの間の表面張力をなくす。即ち、ワークＷと左静圧パッド１との隙間は、実際には０．１ｍｍ程度であるため、右静圧パッド２がワークＷを吸着しても、ワークＷと左静圧パッド１との間の表面張力はなくならない。 After the workpiece W is adsorbed by the right static pressure pad 2 and before the left static pressure pad 1 is retracted to the retracted position X2, as shown in FIG. to eliminate the surface tension between the pad 1 and the workpiece W. That is, since the gap between the workpiece W and the left static pressure pad 1 is actually about 0.1 mm, even if the right static pressure pad 2 attracts the workpiece W, the gap between the workpiece W and the left static pressure pad 1 is The surface tension between them is not lost.

JP2012086335A 2012-04-05 2012-04-05 Work loading / unloading method and double-head surface grinding machine in double-head surface grinding Active JP5872947B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012086335A JP5872947B2 (en) 2012-04-05 2012-04-05 Work loading / unloading method and double-head surface grinding machine in double-head surface grinding
DE102013205446A DE102013205446A1 (en) 2012-04-05 2013-03-27 Workpiece insertion and removal process in double end surface grinding and a double end surface grinding machine
KR1020130033289A KR102015666B1 (en) 2012-04-05 2013-03-28 Workpiece carrying-in-and-out method in double-end surface grinding and double-end surface grinder
TW102111803A TWI574781B (en) 2012-04-05 2013-04-02 Workpiece carrying-in-and-out method in double-end surface grinding and double-end surface grinder
SG2013024195A SG193771A1 (en) 2012-04-05 2013-04-02 Workpiece carrying-in-and-out method in double-end surface grinding and double disk surface grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012086335A JP5872947B2 (en) 2012-04-05 2012-04-05 Work loading / unloading method and double-head surface grinding machine in double-head surface grinding

Publications (3)

Publication Number Publication Date
JP2013215813A JP2013215813A (en) 2013-10-24
JP2013215813A5 true JP2013215813A5 (en) 2014-08-14
JP5872947B2 JP5872947B2 (en) 2016-03-01

Family

ID=49290307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012086335A Active JP5872947B2 (en) 2012-04-05 2012-04-05 Work loading / unloading method and double-head surface grinding machine in double-head surface grinding

Country Status (5)

Country Link
JP (1) JP5872947B2 (en)
KR (1) KR102015666B1 (en)
DE (1) DE102013205446A1 (en)
SG (1) SG193771A1 (en)
TW (1) TWI574781B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6250435B2 (en) * 2014-02-26 2017-12-20 光洋機械工業株式会社 Double-head surface grinding method
JP6183301B2 (en) * 2014-06-16 2017-08-23 信越半導体株式会社 Automatic handling device
JP6383700B2 (en) * 2015-04-07 2018-08-29 光洋機械工業株式会社 Thin plate workpiece manufacturing method and double-head surface grinding apparatus
JP6707831B2 (en) 2015-10-09 2020-06-10 株式会社Sumco Grinding device and grinding method
CN105448795B (en) * 2015-11-30 2018-03-16 北京中电科电子装备有限公司 A kind of wafer handling system
CN114227524A (en) * 2021-12-30 2022-03-25 西安奕斯伟材料科技有限公司 Double-side polishing apparatus and double-side polishing method
CN115070604B (en) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 Double-sided polishing apparatus and double-sided polishing method
CN114986381B (en) * 2022-06-16 2023-08-22 西安奕斯伟材料科技股份有限公司 Double-sided polishing apparatus and double-sided polishing method
CN117206999B (en) * 2023-11-08 2024-02-20 瓦房店威远滚动体制造有限公司 Double-end-face grinding machine capable of improving grinding precision

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10249687A (en) * 1997-03-07 1998-09-22 Super Silicon Kenkyusho:Kk Double surface grinding-polishing machine of sheetlike workpiece
JP3951496B2 (en) * 1999-03-30 2007-08-01 光洋機械工業株式会社 Double-side grinding machine for thin disk-shaped workpieces
JP4798480B2 (en) * 2005-05-25 2011-10-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Semiconductor wafer manufacturing method, double-sided grinding method, and semiconductor wafer double-sided grinding apparatus
JP4621261B2 (en) * 2008-02-01 2011-01-26 株式会社住友金属ファインテック Double-side polishing machine

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