JP2013128778A - Endoscope apparatus and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an endoscope apparatus capable of suppressing deterioration due to heating of soldering connecting a substrate and a part.SOLUTION: The endoscope apparatus regarding a configuration of one implement includes: an insertion section which is capable of being sterilized by boiling; an operation section which is connected to this insertion section; and a device body which is connected to the operation section. The endoscope apparatus includes: a first circuit substrate integrated in the device body section; a first electronic part which is electrically connected to the first circuit substrate through a first soldering; a second circuit substrate integrated in at least one of the insertion section or the operation section; a second electronic part which is electrically connected to the second circuit substrate through a second soldering with higher stress resistant property than the first soldering; and an adhesive member adhered to the second electronic part and the second circuit substrate and having a higher glass transition point than the second circuit substrate.

Description

  Embodiments described herein relate generally to an endoscope apparatus and an electronic apparatus.

  An electronic component such as an LGA (land grid array) is mounted on a printed wiring board by solder. Such an electronic component may be in a high temperature state depending on the use environment. For example, a CMOS sensor mounted on an endoscope is in a high temperature state when the endoscope is boiled and sterilized by an autoclave.

JP-A-8-83799

  If the linear expansion coefficients of the printed wiring board and the electronic component are different from each other, a load is applied to the solder connecting the printed wiring board and the electronic component when the temperature becomes high, and the solder may be deteriorated.

  The objective of this invention is providing the endoscope apparatus and electronic device which can suppress degradation by the heating of the solder which connects a board | substrate and components.

  An endoscope apparatus according to one embodiment includes an insertion section that can be a boiling disinfection target, an operation section coupled to the insertion section, and an apparatus main body section connected to the operation section. The endoscope apparatus includes a first circuit board built in the apparatus main body, a first electronic component electrically connected to the first circuit board via a first solder, Electrically connected to the second circuit board via a second circuit board built in at least one of the insertion part and the operation part, and a second solder having higher stress resistance than the first solder And a bonding member bonded to the second electronic component and the second circuit board and having a glass transition point higher than that of the second circuit board.

The front view which shows schematically the endoscope apparatus which concerns on 1st Embodiment. The perspective view which shows the 2nd electronic component mounted in the 2nd board | substrate of 1st Embodiment. The perspective view which shows the cross section of the 2nd electronic component mounted in the 2nd board | substrate of 1st Embodiment along the F3-F3 line | wire of FIG. The perspective view which shows the bottom face of the 2nd electronic component of 1st Embodiment. The top view which shows the 2nd board | substrate of 1st Embodiment. Sectional drawing which shows the 2nd electronic component mounted in the 2nd board | substrate of 1st Embodiment along the F6-F6 line | wire of FIG. The top view which shows roughly the endoscope accommodated in the case of 1st Embodiment. The perspective view which shows the 2nd board | substrate and 2nd electronic component in the manufacturing process of 1st Embodiment. The top view which expands and shows the 3rd outer side electrode of 1st Embodiment. The top view which shows the modification of the 3rd outer side electrode of 1st Embodiment. The perspective view which shows the modification of the joining member of 1st Embodiment. The perspective view which shows the other modification of the joining member of 1st Embodiment. The perspective view which shows the portable computer which concerns on 2nd Embodiment. The side view which shows roughly the vehicle which concerns on 3rd Embodiment.

  A first embodiment will be described below with reference to FIGS. 1 to 11. FIG. 1 is a front view schematically showing the endoscope apparatus 1. The endoscope apparatus 1 is an example of an electronic device.

  As shown in FIG. 1, the endoscope apparatus 1 includes an apparatus main body 3 and an endoscope 4. The apparatus main body 3 is an example of a first part. The endoscope 4 is an example of a second part. The endoscope 4 includes an insertion unit 11, an operation unit 12, and a connection unit 13.

  The insertion unit 11 is connected to the operation unit 12. The insertion part 11 has a pipe part 16, a movable part 17, and a tip part 18. The tube portion 16 is a flexible tube extending from the operation portion 12. The movable portion 17 has flexibility and is provided continuously from the tube portion 16.

  The distal end portion 18 is attached to the distal end of the movable portion 17. The tip 18 has rigidity and is formed in a cylindrical shape. The distal end portion 18 is provided with a plurality of holes used for photographing, illumination, insertion of forceps, and suction.

  The operation unit 12 includes an imaging unit 21 and an operation knob 23. The operation unit 12 is provided with an insertion port for inserting forceps. The imaging unit 21 is built in the operation unit 12 and is connected to the distal end portion 18 of the insertion unit 11 via, for example, a glass fiber passing through the tube unit 16 and the movable unit 17. The imaging unit 21 captures an image that can be seen through the hole in the tip 18 to which the glass fiber is connected. The operation knob 23 bends the movable portion 17 of the insertion portion 11 via a wire passing through the tube portion 16.

  The connection unit 13 is connected to the operation unit 12 via a connecting pipe 25. The connection unit 13 includes various connectors that are connected to the apparatus main body unit 3. Various cables and tubes are connected to the distal end portion 18 from the connection portion 13 through the connecting tube 25, the operation portion 12, the tube portion 16, and the movable portion 17.

  The apparatus main body 3 includes a housing 31, a first substrate 32, a first electronic component 33, a monitor 34, and a connection cable 35. The first substrate 32 is an example of a first circuit substrate and a first substrate. The first electronic component 33 is an example of a first electronic component and a first component.

  The housing 31 accommodates a first substrate 32, a first electronic component 33, a monitor 34, and various components such as a light source that supplies illumination light. The first substrate 32 is a printed wiring board. The first electronic component 33 is a processor that controls the imaging unit 21, and processes video data captured by the imaging unit 21. The first electronic component 33 is electrically connected to the first substrate 32 via the first solder 36. In FIG. 1, the first solder 36 is schematically indicated by a thick line. The first solder 36 is a so-called lead-free solder, and contains, for example, tin, silver, and copper. The composition of the first solder 36 is not limited to this.

  The monitor 34 is exposed from the housing 31 and displays an image of the imaging unit 21 processed by the first electronic component 33. The connection cable 35 extends from the housing 31 and is connected to the connector of the connection portion 13 of the endoscope 4. The apparatus main body 3 is connected to the operation unit 12 via the connection unit 13 to which the connection cable 35 is connected. The apparatus main body 3 transmits signals and supplies illumination light to and from the endoscope 4 via the connection cable 35.

  As shown in FIG. 1, the imaging unit 21 includes three second substrates 41, three second electronic components 42, and a prism 43. The second substrate 41 is an example of a second circuit substrate and a second substrate. The second electronic component 42 is an example of a second electronic component and a second component.

  FIG. 2 is a perspective view showing one second electronic component 42 mounted on one second substrate 41. FIG. 3 is a perspective view showing a cross section of the second electronic component 42 mounted on the second substrate 41 along the line F3-F3 in FIG.

  The three second substrates 41 and the three second electronic components 42 have the same configuration. Therefore, in the following, one second substrate 41 and one second electronic component 42 will be described as a representative.

  As shown in FIG. 2, the second electronic component 42 that is a CMOS sensor is mounted on the second substrate 41. A joining member 44 is joined to the second electronic component 42 and the second substrate 41.

  The second electronic component 42 is an LGA (land grid array) package formed in a substantially rectangular shape. As partially shown in FIG. 3, the second electronic component 42 has a bottom surface 46, four side edges 47, and a surface 49.

  The bottom surface 46 faces the second substrate 41. The four side edges 47 rise from the bottom surface 46, respectively. Between the adjacent side edges 47, a corner edge 47a which is a part of the side edge 47 is formed. The corner edge 47a is a surface inclined from the side edge 47 by, for example, 45 degrees. The corner edge 47a is a chamfered portion, but is not limited thereto, and may be a ridge line formed by adjacent side edges 47. The front surface 49 is located on the opposite side of the bottom surface 46 and is in contact with the prism 43.

As shown in FIG. 3, the second electronic component 42 includes a base material 51, a chip 52, and a translucent material 53.
The base material 51 is formed in a box shape with a part opened by, for example, ceramic. The base material 51 has a lower linear expansion coefficient than the second substrate 41. The base material 51 forms a bottom surface 46 and four side edges 47 of the second electronic component 42.

  The chip 52 is accommodated in the base material 51 and converts received optical information into data, for example. The translucent material 53 is, for example, a transparent glass plate and closes the opening of the base material 51. The translucent material 53 forms the surface 49 of the second electronic component 42.

  FIG. 4 is a perspective view showing the bottom surface 46 of the second electronic component 42. As shown in FIG. 4, the second electronic component 42 is provided with a plurality of first outer electrodes 54, a plurality of second outer electrodes 55A, 55B, 55C, and a plurality of first inner electrodes 57. It has been. The first outer electrode 54 is an example of the first electrode and other electrode portions. The second outer electrode 55A is an example of a second electrode. The second outer electrode 55B is an example of a fifth electrode. The first outer electrode 54, the second outer electrodes 55A, 55B, 55C, and the first inner electrode 57 are electrically connected to the chip 52, respectively.

  The first outer electrodes 54 are respectively provided at the corners of the bottom surface 46 and are formed in a substantially rectangular shape. The corner portion of the bottom surface 46 is a portion in contact with the two side edges 47 and the one corner edge 47a. The first outer electrode 54 is in contact with the edge of the bottom surface 46, but may be separated from the edge of the bottom surface 46.

  The first outer electrode 54 has a side electrode 54a. The side electrode 54a is formed in a rectangular shape and extends to the corner edge 47a. That is, the first outer electrode 54 is provided from the corner of the bottom surface 46 to the corner edge 47a.

  The second outer electrodes 55A, 55B, and 55C are provided in contact with the edge of the bottom surface 46, respectively. The edge of the bottom surface 46 is a portion in contact with the side edge 47. The second outer electrodes 55A, 55B, and 55C have side electrodes 55a, respectively. The side electrode 55 a is formed in a rectangular shape and extends to the side edge 47. That is, the second outer electrodes 55 </ b> A, 55 </ b> B, 55 </ b> C are provided from the bottom surface 46 to the side edge 47.

  The second outer electrode 55 </ b> A is provided adjacent to the first outer electrode 54. The second outer electrode 55B is provided adjacent to the second outer electrode 55A. The second outer electrode 55C is provided side by side between the second outer electrode 55B and the other second outer electrode 55B.

  The first inner electrodes 57 are each formed in a circular shape. The first inner electrode 57 is provided so as to be surrounded by the first outer electrode 54 and the second outer electrodes 55A, 55B, 55C. The first inner electrodes 57 are arranged in two rows along the second outer electrodes 55A, 55B, and 55C.

  FIG. 5 is a plan view showing the second substrate 41. The second substrate 41 is a printed wiring board, and is formed of, for example, a flame resistant glass cloth base epoxy resin copper clad laminate (FR-4). The second substrate 41 has a mounting surface 61 that faces the second electronic component 42. The mounting surface 61 includes a first region D1 covered with the second electronic component 42 and a second region D2 facing the first outer electrode 54. In the plurality of drawings, the first region D1 and the second region D2 are each indicated by a two-dot chain line.

  As shown in FIG. 5, a plurality of third outer electrodes 63, a plurality of fourth outer electrodes 64A, 64B, 64C, a plurality of second inner electrodes 65, and a plurality of components 66 are provided on the mounting surface 61. And are provided. The third outer electrode 63 is an example of a third electrode and an electrode part. The fourth outer electrode 64A is an example of a fourth electrode. The fourth outer electrode 64B is an example of a sixth electrode.

  The third outer electrode 63 is provided corresponding to the first outer electrode 54 of the second electronic component 42. The third outer electrode 63 has a first electrode portion 63a and a second electrode portion 63b.

  The first electrode portion 63 a faces the first outer electrode 54 of the second electronic component 42 and is formed in a substantially rectangular shape. The first electrode portion 63a has a larger area than the corresponding first outer electrode 54. The first electrode portion 63 a has a pair of edge portions 63 c that respectively extend along the side edges 47 of the second electronic component 42. The edge 63c exists outside the first region D1. Furthermore, a part of the first electrode portion 63a exists outside the second region D2 in the first region D1. A part of the first electrode portion 63a is a portion facing the fourth outer electrode 64A. The distance between the third outer electrode 63 and the fourth outer electrode 64A is narrower than the distance between the first outer electrode 54 and the second outer electrode 55A of the second electronic component 42.

  The second electrode portion 63b is formed continuously with the first electrode portion 63a. The second electrode portion 63b extends from the position corresponding to the corner edge 47a of the second electronic component 42 in the direction in which the side electrode 54a of the first outer electrode 54 faces. For example, the second electrode portion 63b extends in a direction orthogonal to the corner edge 47a. The width of the second electrode portion 63 b is wider than the width of the side electrode 54 a of the first outer electrode 54.

  The fourth outer electrode 64A faces the second outer electrode 55A of the second electronic component 42. The fourth outer electrode 64 </ b> A is provided adjacent to the third outer electrode 63. The fourth outer electrode 64B is opposed to the second outer electrode 55B. The fourth outer electrode 64B is provided adjacent to the fourth outer electrode 64A. The fourth outer electrode 64C faces the second outer electrode 55C. The fourth outer electrode 64C is provided side by side between the fourth outer electrode 64B and the other fourth outer electrode 64B.

  The fourth outer electrodes 64A, 64B, and 64C are formed in substantially the same rectangular shape. The fourth outer electrodes 64A, 64B, 64C are formed to have a larger area than the corresponding second outer electrodes 55A, 55B, 55C. The fourth outer electrodes 64 </ b> A, 64 </ b> B, and 64 </ b> C each have an edge portion 64 a along the side edge 47 of the second electronic component 42. The edge portion 64a exists outside the first region D1. As shown in FIG. 5, the distance L1 between the third outer electrode 63 and the second outer electrode 64A is not less than the distance L2 between the second outer electrode 64A and the second outer electrode 64B. .

  The second inner electrodes 65 respectively correspond to the first inner electrodes 57 of the second electronic component 42 and are formed in a circular shape. The second inner electrode 65 is provided so as to be surrounded by the third outer electrode 63 and the fourth outer electrodes 64A, 64B, 64C. The second inner electrodes 65 are arranged in two rows along the fourth outer electrodes 64A, 64B, 65C.

  6 is a cross-sectional view showing the second electronic component 42 mounted on the second substrate 41 along the line F6-F6 in FIG. FIG. 6 greatly shows the second solder 71 and the like for convenience of explanation.

  As shown in FIG. 6, the third outer electrode 63 of the second substrate 41 is soldered to the first outer electrode 54 of the second electronic component 42. That is, the third outer electrode 63 is electrically connected to the first outer electrode 54 by the second solder 71. The second solder 71 is attached to the first outer electrode 54 including the side electrode 54 a and the third outer electrode 63.

  The second solder 71 forms a solder fillet from the side electrode 54 a of the first outer electrode 54 to the second electrode portion 63 b of the third outer electrode 63. Further, the second solder 71 forms a solder fillet from the outer edge of the first outer electrode 54 to the edge 63c of the third outer electrode 63 existing outside the first region D1. Further, the second solder 71 forms a solder fillet from the inner edge of the first outer electrode 54 to the inner edge of the third outer electrode 63 existing outside the second region D2. The inner edge of the first outer electrode 54 faces the second outer electrode 55A. The inner edge of the third outer electrode 63 faces the fourth outer electrode 64A.

  As shown in part in FIG. 3, the fourth outer electrodes 64A, 64B, and 64C are soldered to the second outer electrodes 55A, 55B, and 55C. That is, the fourth outer electrodes 64A, 64B, and 64C are electrically connected to the second outer electrodes 55A, 55B, and 55C by the second solder 71. The second solder 71 is attached to the second outer electrodes 55A, 55B, and 55C including the side electrode 55a and the fourth outer electrodes 64A, 64B, and 64C.

  The second solder 71 is soldered from the side electrode 55a of the second outer electrode 55A, 55B, 55C to the edge 64a of the fourth outer electrode 64A, 64B, 64C existing outside the first region D1. Form a fillet.

The first inner electrode 57 is soldered to the second inner electrode 65. That is, the first inner electrode 57 is electrically connected to the second inner electrode 65 by the second solder 71. The second solder 71 forms a solder fillet from the edge of the first inner electrode 57 to the edge of the second inner electrode 65.
As described above, the second electronic component 42 is electrically connected to the second substrate 41 by the second solder 71.
The second solder 71 is a so-called highly reliable solder. The second solder 71 contains, for example, tin, silver, copper, bismuth, antimony, and nickel. The composition of the second solder 71 is not limited to this. Such second solder 71 has higher stress resistance than the first solder 36. For example, the second solder 71 is harder than the first solder 36, is difficult to extend, is not easily deformed, and has a long creep life. Further, the second solder 71 has a higher melting point and higher viscosity than the first solder 36.

  Bismuth and antimony are examples of Group V elements. Solder to which bismuth is added has an increased fluidity and a lower melting point. The solder to which antimony is added becomes harder and has a higher melting point. The solder to which nickel is added strengthens the bond between metals and suppresses solidification cracking.

  As shown in FIG. 2, the bonding member 44 is attached to the side edge 47 of the second electronic component 42 and the mounting surface 61 of the second substrate 41. In FIG. 2, the joining member 44 is shown partially cut away. The joining member 44 is attached to the second electronic component 42 over the entire circumference of the side edge 47.

  The joining member 44 is, for example, a thermosetting epoxy resin in which a filler such as silica is blended. The filler is blended in the joining member 44, for example, 75 weight percent. The joining member 44 is cured at 120 ° C., for example. The joining member 44 has a low coefficient of linear expansion and little change in physical properties at high temperatures.

  The bonding member 44 has a glass transition point higher than that of the second substrate 41. For example, the glass transition point of the bonding member 44 is 160 ° C., and the glass transition point of the second substrate 41 is 140 ° C.

The joining member 44 is highly viscous and difficult to spread. For this reason, the joining member 44 is attached to the side edge 47 to a position close to the surface 49 of the second electronic component 42.
FIG. 7 is a plan view schematically showing the endoscope 4 accommodated in the case 75. The endoscope 4 is boiled and sterilized by an autoclave device and sterilized. Below, the procedure of the boiling disinfection of the endoscope 4 having the above configuration will be schematically described.

  First, the connection cable 35 is removed from the connection part 13 of the endoscope 4, and a cap is put on the connector of the connection part 13, for example. Next, the endoscope 4 is accommodated in the case 75. The case 75 has a tray on which the endoscope 4 is placed and a cover that covers the tray. The case 75 is provided with a plurality of vent holes 76 for guiding high-pressure steam.

  Next, the case 75 is placed in the sterilization chamber of the autoclave apparatus, and this sterilization chamber is sealed. The autoclave apparatus first lowers the pressure in the sterilization chamber below atmospheric pressure. Next, the autoclave device supplies high-pressure steam to the sterilization chamber. The high-pressure steam enters the inside of the case 75 from the vent hole 76, whereby the inside of the case 75 is pressurized and heated. The sterilization chamber is brought into a state of 138 ° C. and 2 atm, for example, for 5 minutes by high pressure steam. Thereby, the endoscope 4 accommodated in the case 75 is boiled and disinfected.

  Also known is a boiling disinfection method that repeats the supply and exhaust of high-pressure steam. For example, after the sterilization chamber is brought into a high-temperature and high-pressure state as described above, steam is extracted from the sterilization chamber. As a result, the temperature of the sterilization chamber is lowered to room temperature, and the pressure of the sterilization chamber is also reduced to atmospheric pressure. By repeating such high-pressure steam supply and exhaust, for example, three times, the endoscope 4 is more surely sterilized than in a normal method. In other words, the endoscope 4 is sterilized by repeatedly increasing and decreasing the temperature between the first temperature of 138 ° C. and the second temperature of room temperature. The first temperature and the second temperature are not limited to this.

  The plurality of components 66 are various electronic components such as capacitors. The plurality of components 66 are each mounted on the second substrate 41. The plurality of components 66 are arranged apart from the position where the second electronic component 42 and the joining member 44 are provided.

  FIG. 8 is a perspective view showing the second substrate 41 and the second electronic component 42 in the manufacturing process. FIG. 9 is an enlarged plan view showing the third outer electrode 63. With reference to FIG. 8 and FIG. 9, an example of a mounting method of the second electronic component 42 which is a part of the manufacturing method of the endoscope apparatus 1 having the above-described configuration will be schematically described.

  First, as shown in FIG. 8, the third outer electrode 63, the fourth outer electrodes 64A, 64B, and 64C before the second electronic component 42 is mounted, and the second inner electrode 65, A paste-like second solder 71 is applied. The second solder 71 is applied to the electrodes 63, 64A, 64B, 64C, 65 by printing using, for example, a metal mask. The application amount of the second solder 71 per area of each electrode 63, 64 A, 64 B, 64 C, 65 is the first solder that connects the first substrate 32 and the first electronic component 33 of the apparatus body 3. Less than the coating amount per electrode area of 36.

  As shown in FIG. 9, the second solder 71 is applied to the third outer electrode 63 so that a part 63d of the third outer electrode 63 is exposed. The exposed part 63 d of the third outer electrode 63 is a substantially L-shaped part along the inner edge of the third outer electrode 63. The exposed part 63d is located between the second solder 71 and the fourth outer electrode 64A.

  The exposed part 63 d is formed by making the opening provided in the metal mask smaller than the third outer electrode 63. That is, the second solder 71 is printed in a state where the part 63d where the metal mask is exposed is covered.

  Next, as shown in FIG. 8, the second electronic component 42 is placed on the second substrate 41. At this time, each second solder 71 adheres to the third outer electrode 63, the fourth outer electrodes 64A, 64B, and 64C, and the second inner electrode 65, respectively.

  The mounted second electronic component 42 is pressed toward the second substrate 41 by a jig such as a leaf spring. In this state, the second electronic component 42 and the second substrate 41 are placed in a reflow furnace and heated. As a result, the second solder is melted, and the electrodes 54, 55 A, 55 B, 55 C, 57 of the second electronic component 42 are soldered to the electrodes 63, 64 A, 64 B, 64 C, 65 of the second substrate 41. Is done.

  In the above reflow process, the second electronic component 42 is pressed toward the second printed wiring board, whereby the second solder 71 is crushed. The crushed second solder 71 spreads sideways.

  The second solder 71 applied to the third outer electrode 63 flows due to the pressing force and covers the exposed part 63d of the third outer electrode. The second solder 71 further spreads by the pressing force. Since the adhesion area between the second solder 71 and the third outer electrode 63 is large, the second solder 71 is prevented from spreading too much and the solder balls are prevented from separating from the second solder 71.

  The third outer electrode 63 having a large amount of the second solder 71 to be applied is separated from the fourth outer electrode 64A by a distance larger than the distance between the fourth outer electrodes 64A and 64B. For this reason, the third outer electrode 63 and the fourth outer electrode 64 </ b> A are prevented from being short-circuited by the spread second solder 71.

  Next, the joining member 44 is applied to the second electronic component 42 and the second substrate 41 on which the second solder 71 has been cured. The uncured bonding member 44 is applied from the side edge 47 of the second electronic component 42 to the mounting surface 61 of the second substrate 41 by a dispenser. The joining member 44 is applied over the entire circumference of the side edge 47 of the second electronic component 42. The gap between the second electronic component 42 and the second substrate 41 is sealed by the bonding member 44.

Next, the second electronic component 42 and the second substrate 41 are placed in a curing furnace. This curing furnace heats the joining member 44 at 120 ° C. for 30 minutes, for example. Thereby, the joining member 44 is cured.
Through the above steps, the second electronic component 42 is mounted on the second substrate 41.
According to the endoscope apparatus 1 having the above configuration, the electrodes 63, 64 A, 64 B, 64 C, 65 of the second substrate 41 are connected to the electrodes 54, 55 A of the second electronic component 42 by the second solder 71. , 55B, 55C, 57 are electrically connected. Since the linear expansion coefficients of the base material 51 of the second electronic component 42 and the second substrate 41 are different, a load may be generated on the second solder 71. However, the second solder 71 has higher stress resistance than the first solder 36 used in the apparatus main body 3. For this reason, even if the endoscope 4 is heated by the autoclave device, the deterioration of the second solder 71 can be suppressed.

The bonding member 44 is bonded to the second electronic component 42 and the second substrate 41, and fixes the second electronic component 42 to the second substrate 41. The bonding member 44 has a glass transition point higher than that of the second substrate 41. For this reason, even if the endoscope 4 is heated by the autoclave device, the characteristic change of the joining member 44 remains minute, and the second electronic component 42 is firmly fixed to the second substrate 41. Therefore, it is possible to reduce the load caused by the difference in linear expansion between the base material 51 of the second electronic component 42 and the second substrate 41 and suppress the deterioration of the second solder 71. For example, the occurrence of a crack in the second solder 71 can be delayed.
As described above, the use of the second solder 71 having high stress resistance and the joining member 44 can suppress the deterioration of the second solder 71 due to boiling disinfection.
The electrodes 63, 64A, 64B, 64C, 65 of the second substrate 41 are formed to have a larger area than the electrodes 54, 55A, 55B, 55C, 57 of the second electronic component 42. For this reason, the solder fillet of the second solder 71 is formed beautifully. Furthermore, since the cross-sectional area of the second solder 71 is increased, the stress resistance of the second solder 71 is improved, and deterioration of the second solder 71 can be suppressed. Furthermore, the amount of application of the second solder 71 can be easily adjusted, and the application of the second solder 71 is facilitated.

  The coating amount per electrode area of the second solder 71 is smaller than the coating amount per electrode area of the first solder 36. For this reason, the second solder 71 has less volume change due to heating than the first solder 36. For this reason, it can suppress that a load arises in the 2nd solder 71 by the volume change accompanying temperature rise and fall, and can suppress degradation of the 2nd solder 71.

  Note that the amount of application of the second solder 71 per electrode area may be larger than the amount of application of the first solder 36 per electrode area. In this case, since the second solder 71 expands and contracts, the load accompanying the temperature rise and fall is alleviated. Thereby, deterioration of the second solder 71 can be suppressed.

  The second electronic component 42, which is an LGA package, has a small gap with the second substrate 41, and it is difficult to underfill with a flux. On the other hand, the joining member 44 is attached to the side edge 47 of the second electronic component 42. Thus, even when the gap between the second electronic component 42 and the second substrate 41 is narrow, the second electronic component 42 can be firmly fixed to the second substrate 41.

  The joining member 44 is applied over the entire circumference of the side edge 47 of the second electronic component 42 to seal the gap between the second electronic component 42 and the second substrate 41. Thereby, it is possible to prevent the flux from coming out from the gap between the second electronic component 42 and the second substrate 41.

  The plurality of components 66 are arranged apart from the position where the second electronic component 42 and the joining member 44 are provided. Thereby, the operation | work which apply | coats the joining member 44 with a dispenser becomes easy, and the manufacturability of the endoscope 4 improves.

  The edge 63c of the third outer electrode 63 is formed outside the first region D1 and has a larger area than the first outer electrode 54. For this reason, the area | region which can adhere the 2nd solder 71 and absorbs the flow of the 2nd solder 71 is provided widely. As a result, the second solder 71 is prevented from spreading too much at the time of mounting, and the separation of the solder balls from the second solder 71 is suppressed. Thereby, the short circuit by a solder ball is suppressed.

  The edge 63c of the third outer electrode 63 exists outside the first region D1. In other words, the third outer electrode 63 protrudes outside the first region D1. For this reason, even if the area of the third outer electrode 63 is made larger than that of the first outer electrode 54, a short circuit between the third outer electrode 63 and the nearby fourth outer electrode 64A can be suppressed. By suppressing the short circuit, the manufacturability of the endoscope apparatus 1 is improved.

  The amount of the second solder 71 applied to the third outer electrode 63 is larger than the amount of the second solder 71 applied to the fourth outer electrodes 64A, 64B, 64C. The distance L1 between the third outer electrode 63 and the fourth outer electrode 64A is not less than the distance L2 between the fourth outer electrodes 64A and 64B. Thereby, it is possible to prevent the second solder 71 applied to the third outer electrode 63 during mounting from spreading due to pressing and short-circuiting with the second solder 71 applied to the fourth outer electrode 64.

  The width of the second electrode portion 63 b of the third outer electrode 63 is wider than the width of the side electrode 54 a of the first outer electrode 54. As a result, the second solder 71 applied to the second electrode portion 63b at the time of mounting is prevented from spreading too much, and a short circuit due to the solder ball is suppressed.

  A part of the first electrode portion 63a of the third outer electrode 63 exists outside the second region D2. For this reason, the second solder 71 forms a solder fillet from the inner edge of the first outer electrode 54 to the inner edge of the third outer electrode 63. Thereby, since the cross-sectional area of the second solder 71 becomes large, the deterioration of the second solder 71 can be suppressed.

  The second solder 71 before the second electronic component 42 is mounted is applied to the third outer electrode 63 so that a part 63d of the third outer electrode 63 is exposed. At the time of mounting, the second solder 71 applied to the third outer electrode 63 flows by the pressing force and covers the exposed part 63d of the third outer electrode. As a result, the second solder 71 applied to the third outer electrode 63 is prevented from spreading too much, and a short circuit due to the solder ball is suppressed.

In addition, said 1st Embodiment is an example of the endoscope apparatus 1, and various elements can be changed. Hereinafter, some modified examples will be described.
In the above embodiment, the imaging unit 21 is accommodated in the operation unit 12. However, for example, the imaging unit may be provided at the distal end portion 18 of the insertion unit 11.
In the above embodiment, the second electronic component 42 is an LGA package, but may be another type of electronic component such as a QFN (quad flat non-leaded) package.

  In the above embodiment, the second solder 71 contains tin, silver, copper, bismuth, antimony, and nickel. However, the second solder 71 may be, for example, a solder containing at least one of germanium, indium, and other group V elements. Solder containing at least one of germanium and indium is difficult to break, for example, and can have high stress resistance.

  In the above embodiment, the second substrate 41 is formed of FR-4. However, the second substrate 41 may be formed of ceramic that is the same kind of material as the base material 51 of the second electronic component 42. Thereby, the difference in linear expansion between the second substrate 41 and the second electronic component 42 is reduced, and the deterioration of the second solder 71 can be suppressed.

  The second substrate 41 may be formed thinner than the first substrate 32. Since the second substrate 41 is formed thin, the second substrate 41 is easily deformed, and the load applied to the second solder 71 is reduced. Thereby, deterioration of the second solder 71 can be suppressed.

  FIG. 10 is a perspective view showing a modification of the third outer electrode 63. As shown in FIG. 10, the edge 63c of the third outer electrode 63 may be separated from the first region D1 than in the above embodiment. Further, the first electrode portion 63a and the second electrode portion 63b of the third outer electrode 63 may be integrated.

  FIG. 11 is a perspective view showing a modification of the joining member 44. As shown in FIG. 11, the joining member 44 may have a plurality of first application portions 44a and a plurality of second application portions 44b. The first application part 44 a is a part attached to the side edge 47 to the vicinity of the surface 49 of the second electronic component 42. The second application part 44b is a part attached to the side edge 47 to the middle in the height direction. In other words, the amount of resin applied to the first application portion 44a is greater than the amount of resin applied to the second application portion 44b.

  The first application portion 44a is attached to the corner edge 47a of the second electronic component 42 and the side edge 47 in the vicinity of the corner edge 47a. In other words, the first application part 44 a is attached to the corner of the second electronic component 42. The second application part 44b is provided between the first application part 44a.

  Stress tends to concentrate on the corners of the second electronic component 42. For this reason, the second electronic component 42 is firmly fixed to the second substrate 41 by providing the first application portion 44 a with a large amount of resin applied at the corner of the second electronic component 42. Therefore, deterioration of the second solder 71 can be suppressed. Furthermore, since the resin applied to the portion where stress is difficult to concentrate can be reduced, the manufacturing cost of the endoscope apparatus 1 can be reduced.

  FIG. 12 is a perspective view showing another modified example of the joining member 44. As shown in FIG. 12, the first application portion 44 a is provided along the long side of the second electronic component 42, and the second application portion 44 b is provided along the short side of the second electronic component 42. May be. That is, the application amount of the joining member 44 may be different between the long side and the short side of the second electronic component 42. In other words, the cross-sectional shape of the bonding member 44 may be different between the long side and the short side of the second electronic component 42.

  Stress tends to concentrate on the long side of the second electronic component 42. For this reason, the second electronic component 42 is firmly fixed to the second substrate 41 by providing the first application portion 44 a having a large amount of resin applied to the long side of the second electronic component 42. Therefore, deterioration of the second solder 71 can be suppressed. Furthermore, since the resin applied to the portion where stress is difficult to concentrate can be reduced, the manufacturing cost of the endoscope apparatus 1 can be reduced.

  Next, a second embodiment will be described with reference to FIG. Note that, in a plurality of embodiments disclosed below, the same reference numerals are assigned to components having the same functions as those of the endoscope apparatus 1 of the first embodiment. Further, the description of the components may be partially or entirely omitted.

  FIG. 13 is a perspective view showing a part of the portable computer 80 according to the second embodiment. As shown in FIG. 13, the portable computer 80 has a base 81 and a monitor 82.

  The monitor 82 houses a display module 84 that displays an image. The monitor 82 is rotatably attached to a hinge portion 85 provided at the rear end of the base 81. The monitor 82 rotates between a closed position lying on the base 81 and an open position standing up from the base 81.

  The base 81 has a keyboard module 86 and a touch pad module 87. The keyboard module 86 and the touch pad module 87 are provided on the upper surface of the base 81.

  The base 81 accommodates the first substrate 32 and the second substrate 41. The first substrate 32 is, for example, a daughter board. The second substrate 41 is, for example, a motherboard. A first electronic component 33 is mounted on the first substrate 32. A second electronic component 42 is mounted on the second substrate 41.

  The first electronic component 33 is, for example, a graphic chip. The first electronic component 33 is electrically connected to the first substrate 32 by the first solder 36 as in the first embodiment.

  The second electronic component 42 is, for example, a CPU. The second electronic component 42 has a higher calorific value than the first electronic component 33. A heat sink 91 is attached to the second electronic component 42. The second electronic component 42 is electrically connected to the second substrate 41 by the second solder 71 as in the first embodiment. The second electronic component 42 is fixed to the second substrate 41 by a bonding member 44. The second electronic component 42 is arranged away from the first electronic component 33.

  Since the heat generation amount of the second electronic component 42 is high, the periphery of the second electronic component 42 is exposed to higher thermal stress than the periphery of the first electronic component 33. However, the second solder 71 has higher stress resistance than the first solder 36 used in the apparatus main body 3. For this reason, the deterioration of the second solder 71 is suppressed.

  As described above, the portable computer 80 can be an embodiment. However, the present invention is not limited to this, and other electronic devices such as a desktop computer, a slate computer, and a smartphone can also be embodiments.

  Next, a third embodiment will be described with reference to FIG. FIG. 14 is a side view schematically showing the vehicle 95 of the third embodiment. The vehicle 100 is an automobile, for example, and is an example of an electronic device.

As shown in FIG. 14, the vehicle 100 includes a computer unit 101, a battery 102, and a plurality of brake units 103.
The computer unit 101 controls the vehicle 100. The computer unit 101 includes a printed wiring board and a CPU. The printed wiring board is an example of a first substrate. The CPU is an example of a first electronic component. The CPU is electrically connected to the printed wiring board by the first solder 36 in the same manner as the first electronic component 33 of the first embodiment. The computer unit 101 is disposed in a place where the temperature change is relatively small.

  The battery 102 is disposed at the rear portion of the vehicle 100, for example. The battery 102 has a printed wiring board and a chip. The printed wiring board is an example of a second substrate. The chip is an example of a second electronic component. The chip is electrically connected to the printed wiring board by the second solder 71 as in the first embodiment. The chip is fixed to the printed wiring board by a joining member 44.

  For example, since the battery 102 generates heat when power is supplied, the periphery of the battery 102 is exposed to higher thermal stress than the computer unit 101. However, the second solder 71 has higher stress resistance than the first solder 36. For this reason, the deterioration of the second solder 71 is suppressed.

  The brake units 103 are respectively disposed inside the wheels. The brake unit 103 has a printed wiring board and an actuator. The printed wiring board is an example of a second substrate. The actuator is an example of the second electronic component, and drives the brake pad to contact the brake disc. The actuator is electrically connected to the printed wiring board by the second solder 71 as in the first embodiment. The actuator is fixed to the printed wiring board by a joining member 44.

  For example, since frictional heat is generated when the brake pad comes into contact with the brake disk, the periphery of the brake unit 103 is exposed to higher thermal stress than the computer unit 101. However, the second solder 71 has higher stress resistance than the first solder 36. For this reason, the deterioration of the second solder 71 is suppressed.

  In the above-described embodiment, the computer unit 101 is disposed in a place where the temperature change is relatively small. For this reason, the CPU of the computer unit 101 may be electrically connected to the printed wiring board by the second solder 71. In this case, for example, an electronic component provided in an instrument panel with little temperature change is electrically connected to the substrate by the first solder 36.

As described above, the vehicle 100 can be an embodiment. Not only this but other vehicles, such as an electric car, a two-wheeled vehicle, and a train, can also be an embodiment.
According to the electronic device of at least one embodiment described above, the second part exposed to higher thermal stress than the first part is interposed with the second solder having a melting point higher than that of the first solder. A second substrate electrically connected to the second component. Thereby, it is possible to suppress deterioration due to heating of the solder connecting the substrate and the component.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... Endoscope apparatus, 3 ... Apparatus main-body part, 4 ... Endoscope, 11 ... Insertion part, 12 ... Operation part, 21 ... Imaging unit, 31 ... Housing | casing, 32 ... 1st board | substrate, 33 ... 1st 36 ... first solder, 41 ... second substrate, 42 ... second electronic component, 44 ... joining member, 46 ... bottom surface, 47 ... side edge, 47a ... square edge, 54 ... first Outer electrode, 55A, 55B, 55C ... second outer electrode, 61 ... mounting surface, 63 ... third outer electrode, 63a ... first electrode portion, 63b ... second electrode portion, 63c ... edge, 63d ... exposed part, 64A, 64B, 64C ... fourth outer electrode, 64a ... edge, 71 ... second solder, 80 ... portable computer, 100 ... vehicle, 101 ... computer, 102 ... battery, 103 ... Brake unit.

Claims (9)

An insertion part that can be a boiling disinfection object, an operation part connected to the insertion part,
An apparatus main body connected to the operation unit;
An endoscopic device comprising:
A first circuit board built in the apparatus main body,
A first electronic component electrically connected to the first circuit board via a first solder;
A second circuit board built in at least one of the insertion section and the operation section and exposed to higher thermal stress than the apparatus main body section;
A rectangular bottom surface facing the second circuit board and having electrodes disposed at corners; a surface opposite to the bottom surface; and a side surface connecting the bottom surface and the surface; A second electronic component electrically connected to the electrode of the second circuit board via a second solder having a high melting point;
The second electronic component and the second circuit board are joined, and the second electronic component is disposed on a corner edge of the second electronic component and the side surface in the vicinity of the corner edge so that the side portion of the surface is exposed. A plurality of first application parts that cover the side surface near the top surface of the second electronic component, and a side part of the surface that is disposed between the plurality of first application parts and disposed on the side surface is exposed. A second coating portion that covers the side surface to the middle in the height direction of the side surface, and a bonding member having a glass transition point higher than that of the second circuit board,
An endoscopic apparatus comprising:   The insertion portion and the operation portion are sterilized by repeatedly increasing and decreasing the temperature between a first temperature and a second temperature lower than the first temperature, and the second solder is made of bismuth and antimony. The endoscope apparatus according to claim 1, comprising at least one.   The endoscope apparatus according to claim 1, wherein the second solder includes at least one of nickel, germanium, and indium, and is less likely to break than the first solder.   The endoscope apparatus according to claim 2 or 3, wherein the second electronic component has a rectangular shape, and a coating amount of the joining member is different between a long side and a short side.   The endoscope apparatus according to claim 2 or 3, wherein a glass transition point of the joining member is 160 degrees or more.   The endoscope apparatus according to claim 1, wherein the second solder is higher in viscosity than the first solder. A first part;
A second portion exposed to a higher thermal stress than the first portion and connected to the first portion;
A first substrate housed in the first portion and electrically connected to the first component via a first solder;
A second component comprising a rectangular bottom surface accommodated in the second part and having an electrode disposed at a corner, a surface opposite to the bottom surface, and a side surface connecting the bottom surface and the surface is the first component. A second substrate electrically connected via a second solder having a melting point higher than that of the solder;
The second component and the second substrate are joined to each other, and the second component is disposed on the corner edge of the second component and the side surface in the vicinity of the corner edge so that the side portion of the surface is exposed. A plurality of first application portions covering the side surface to the vicinity of the upper surface of the component, and the side surface disposed between the plurality of first application portions and disposed on the side surface so that the side portion of the surface is exposed. A joining member having a second application portion that covers the middle of the side surface in the height direction;
An electronic device comprising   The electronic device according to claim 7, wherein the bonding member has a glass transition point higher than that of the second circuit board.   The electronic device according to claim 7, wherein the second component has a rectangular shape, and a cross-sectional shape of the joining member is different between a long side and a short side.

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