JPH08334705A - Solid-state image pickup module and endoscope device - Google Patents

Abstract

PURPOSE: To provide a solid-state image pickup module in which the making of a size compact is attained together with the improving of image quality and the obtaining of functional high reliability and an endoscope device. CONSTITUTION: This module is provided with a glass substrate 9 on one main surface of which wiring circuits including required input and output terminals 9a are provided, a solid-state image pickup element 10 mounted and arranged on the one main surface of the glass substrate 9 while making a light receiving surface 15 face to the one main surface of the glass substrate 9, an insulating section frame body 14 (or a barrage) secting the connection parts 11 electrically connecting connecting terminals 10a of the solid-state image pickup element 10 and connecting terminals 9a of the one side of the surfaces of the glass substrate 9 and a light receiving surface (an image pickup area) 15 being in the inside of the connection part 11 and provided on the one main surface of the glass substrate 9 and sealing resin layers 13 molding connection part 11 being out side of the section frame body 14. Moreover, this endoscope device is provided with the solid-state image pickup module having the above constitution as an image pickup head.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a CCD (Carge Copuled).
The present invention relates to a solid-state image pickup module having a solid-state image pickup device called a device as a main body and suitable for an endoscope, and an endoscope apparatus including the solid-state image pickup module.

[0002]

2. Description of the Related Art For example, a monitoring device or an endoscopic device for examining the inside of the stomach generally has an image pickup head portion formed by sealing at least a solid-state image pickup module in a liquid-tight manner, and an input / output signal of the image pickup head portion. It employs a configuration including a signal introducing / extracting section for introducing / extracting and an input / output signal control section for controlling an input / output signal in the signal introducing / extracting section. In addition, in this type of endoscope apparatus and the like, generally, a solid-state imaging module configured to have a cross-sectional view of a main part structure is used in FIG. In FIG. 4, 1 is a chip carrier, 2
Is a solid-state image sensor (CCD chip) mounted and mounted on the chip carrier 1 and fixed by adhesion with, for example, an epoxy resin (not shown), 3 is a terminal 2a of the solid-state image sensor 2 and a terminal on the surface of the chip carrier 1 Bonding wires 4 for electrically connecting with 1a are resin layers for protecting / sealing the connecting portion including the bonding wire 3. Reference numeral 5 denotes an optical filter arranged on the light-receiving surface (active area surface) of the solid-state imaging device 2 with an adhesive layer (for example, a silicone resin layer) 6 having a filter function interposed therebetween. further,
Reference numeral 7 is a flexible wiring board electrically connected to the back terminals of the chip carrier 1 by soldering load, and 8 is a circuit such as an active element and a passive element inserted in the signal wiring portion of the flexible wiring board 7 surface. It is a part. Note that the solid-state imaging device 2 usually has a configuration in which a microlens (not shown) is provided for each active region forming a light-receiving surface in order to improve light-receiving ability.

[0003]

However, the following disadvantages are recognized in the solid-state image pickup module having the above-described configuration and the endoscope apparatus configured by using the solid-state image pickup module. That is, the solid-state imaging device 2 is mounted and mounted on the chip carrier 1 and electrically connected by the bonding wire 3. By the way, in the solid-state image pickup module, there is a demand for making the pixel fine structure for the purpose of improving the obtained image quality, or making the image pickup head unit compact. To meet these demands, the miniaturization of wiring and the increase in the number of wirings are inevitably accompanied, and the number of circuit components 8 such as semiconductor elements to be mounted and arranged also increases. Therefore, the solid-state imaging module inevitably becomes large in size, and as a result, the compactness of the solid-state imaging module is hindered. Moreover, assembling (manufacturing) operations such as wire bonding and adhesion of the optical filter 5 become complicated, and there are problems in terms of productivity, yield, and product reliability. That is,
On the other hand, there is a problem that the solid-state imaging module and the endoscope device (imaging head unit) are inevitably increased in size, while on the one hand, the development of a practically effective solution is required. The current situation is waiting.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a solid-state image pickup module and an endoscope apparatus which are compact in size while improving image quality and functional reliability. And

[0005]

According to a first aspect of the present invention, a glass substrate having a wiring circuit including required input / output connection terminals provided on one main surface, and a light receiving surface on the one main surface of the glass substrate. A solid-state image sensor mounted and arranged so as to face each other, a connection section for electrically connecting a terminal of the solid-state image sensor and one connection terminal on the glass substrate surface, and inside the connection section and the light receiving section. An insulating partition frame (or weir) that is installed on one main surface of the glass substrate to partition the surface and a sealing resin layer that molds a connection portion outside the partition frame. It is a solid-state imaging module.

According to a second aspect of the present invention, a glass substrate provided with a wiring circuit including required input / output connection terminals on one main surface,
The light receiving surface is mounted on one main surface of the glass substrate so as to face it,
The arranged solid-state image pickup device, a connection portion for electrically connecting between the terminal of the solid-state image pickup device and one connection terminal of the glass substrate surface, the inside of the connection portion, and dividing the light-receiving surface An insulating partition frame (or weir) installed on one main surface of the glass substrate, an active type circuit element inserted in a wiring circuit on the glass substrate surface outside the partition frame, and an external partition frame And a sealing resin layer that molds at least the connection part of the solid-state imaging module.

The third aspect of the invention is the solid-state image pickup module according to the first or second aspect, wherein the insulating partition frame (or weir) is made of polyimide resin.

According to a fourth aspect of the present invention, there is provided an image pickup head section in which at least a solid-state image pickup module is liquid-tightly sealed, a signal introduction section for introducing an input / output signal of the image pickup head section, and the signal introduction section. In the endoscope apparatus including an input / output signal control section for controlling input / output signals in the optical section, the solid-state imaging module is provided with a wiring circuit including required input / output connection terminals on one main surface. Electrically connected between the glass substrate, the solid-state imaging device mounted and arranged on the one main surface of the glass substrate with the light-receiving surface facing each other, the terminal of the solid-state imaging device, and one connection terminal of the glass substrate surface. An insulating partition frame (or weir) installed on one main surface of the glass substrate that partitions the connection part to be connected, the inside of the connection part, and the light receiving surface, and the outside of the partition frame. With a sealing resin layer that molds the connection part It is an endoscope apparatus according to claim which forms a configuration.

That is, according to the present invention, a solid-state image pickup device (CCD chip) and a part of an active type circuit component are formed in a so-called flip chip form on a glass substrate surface which also functions as a filter of an image pickup active surface. Taking the implemented configuration,
In addition, the solid-state imaging module has a compactness and reliability, which is molded and sealed while sufficiently securing the imaging area.

Further, in the configuration of the solid-state image pickup module, a so-called microlens may be arranged on the light-receiving surface of the solid-state image pickup element to improve the light-receiving performance.
Furthermore, while sufficiently and properly securing the imaging area, that is, the glass substrate surface facing the light receiving surface of the solid-state imaging device,
It also protects and improves environmental resistance.

[0011]

According to the invention of claims 1 to 3, the glass substrate surface is used as a connection wiring portion, and the image pickup function (active or light receiving surface) surface of the solid-state image pickup device is partitioned and opposed to the resin sealing portion. If necessary, some active circuit components are mounted and arranged on the glass substrate surface. By adopting such a configuration, a required image pickup area is surely ensured, and the glass substrate not only protects the image pickup function surface of the solid-state image pickup device but also participates in the image pickup function by the filter action. Therefore, it is not necessary to separately provide an optical filter, and in combination with the elimination of the need for the bonding wire, a significant downsizing can be achieved.

According to the fourth aspect of the present invention, the solid-state image pickup module is mounted / incorporated in the image pickup head section, whereby the image pickup function and reliability are improved while maintaining the compactness of the image pickup head section. It becomes possible to function as an endoscope device.

[0013]

Embodiments of the present invention will be described below with reference to FIGS. 1, 2 and 3.

FIG. 1 is a sectional view showing a main part of one structural example of a solid-state image pickup module. In FIG. 1, 9 is
For example, required terminals (including wiring conductors) in thin film processes
9a on one main surface, thickness 0.5mm, width 6mm, length 9
mm glass substrate, 10 is mounted on one main surface of the glass substrate 9,
Arranged solid-state image sensor, for example, C with 100,000 pixels
It is a CD chip. Reference numeral 11 denotes a bump (connecting portion) made of, for example, Au which electrically connects the terminal 10a of the solid-state image pickup device 10 and the terminal 9a of the glass substrate 9, and is connected by a micro socket method by using In solder together. ing. Here, in order to improve the light receiving ability of the solid-state image pickup device 10, a microlens is provided for each active area forming a light receiving surface (imaging active surface), and the microlens forming surface is formed on the glass substrate 9 surface. It is also possible to mount and arrange them facing each other.

Further, 12a is an active type circuit component inserted in the wiring conductor portion of the terminal 9a including the wiring conductor on the surface of the glass substrate 9, and 13 is the solid-state image pickup device 9 and the active type circuit component 12a. In the mounting and arrangement area, a sealing resin layer (for example, a photo-curing resin such as an epoxy resin) that mold-seals the peripheral portions of the solid-state image sensor 9 and the active type circuit component 12a, 14 is a terminal 10a of the solid-state image sensor And the terminal 9a of the glass substrate 9
It is an insulating frame (or a weir for preventing resin flow) that partitions the imaging area 15 of the solid-state imaging device 9 inside the connection portion 11 with. Here, the insulating frame 14 is formed by applying and forming, for example, a photo-curable polyimide resin film on the surface of the glass substrate 9 on which the wiring conductors including the terminals 9a are formed, and then the polyimide resin film is formed by a photolithography process. The connection portion 11 and the imaging area 15 can be formed by selectively opening them. Furthermore, 16 is an anisotropic conductor layer for electrically connecting the terminal 9a of the glass substrate 9 and the flexible wiring board 17 connected to the main body (not shown) of the imaging device. Here, the flexible wiring board 17 is provided with corresponding signal wiring, and also, for example, an active circuit component 12b such as a semiconductor element,
Also, circuit components such as passive circuit components 12c such as resistance elements are mounted and arranged.

FIG. 2 is a cross-sectional view showing the main part of another configuration example of the solid-state image pickup module. In FIG. 2, reference numeral 9 is a glass substrate having required terminals (including wiring conductors) 9a provided on one main surface with a thickness of about 0.5 mm, a width of about 6 mm, and a length of about 9 mm, and 10 is a main portion of the glass substrate 9. It is a solid-state image sensor mounted and arranged on the surface, for example, a CCD chip having a number of pixels of 100,000.
Reference numeral 11 denotes a bump (connecting portion) made of, for example, Au which electrically connects the terminal 10a of the solid-state image pickup device 10 and the terminal 9a of the glass substrate 9, and is connected by a micro socket method by using In solder together. ing. Here, in order to improve the light receiving ability of the solid-state image pickup device 10, a microlens is provided for each active area forming a light receiving surface (imaging active surface), and the microlens forming surface is formed on the glass substrate 9 surface. It is also possible to mount and arrange them facing each other.

Further, 12a is an active type circuit component inserted in the wiring conductor portion in the terminal 9a including the wiring conductor on the surface of the glass substrate 9, and 13 is the solid-state image pickup device 9 and the active type circuit component 12a. A sealing resin layer (for example, a photocurable resin such as an epoxy resin) that seals the peripheral portions of the solid-state imaging device 9 and the active type circuit component 12a in the mounting and placement area, and 14 is a terminal 10a of the solid-state imaging device 10. It is an insulative frame (or a weir for preventing resin flow) that partitions the image pickup area 15 of the solid-state image pickup device 9 inside the connection portion 11 with the terminal 9a of the glass substrate 9. Here, the insulating frame 14 is connected to the surface of the glass substrate 9 on which the wiring conductors including the terminals 9a are formed by printing, drying, and forming, for example, a photocurable polyimide resin in a frame shape. The part 11 and the imaging area 15 can be selectively opened. Furthermore, 16 is a terminal of the glass substrate 9.
9a and an anisotropic conductor layer for electrically connecting the flexible wiring board 17 connected to the imaging device body (not shown) side. Here, the flexible wiring board 17 is provided with corresponding signal wiring, and circuit components such as an active circuit component 12b such as a semiconductor element and a passive circuit component 12c such as a resistor element are mounted, It is arranged.

Next, an example of the structure of an endoscope apparatus using the solid-state image pickup module having the above structure will be described. That is, as shown in FIG. 3 as a block diagram showing a schematic configuration of a main part, at least an imaging head unit 18 formed by liquid-tightly sealing a solid-state imaging module and an input / output signal of the imaging head unit 18 are introduced. Signal introduction / output section 19 and the signal introduction / output section
An endoscopic device including an input / output signal controller 20 for controlling the input / output signal at 19 was prepared. Here, the imaging head unit 18 has a structure in which an insulating tube and a back surface of the glass substrate 9 of the solid-state imaging module and a light source are optically exposed to the side wall inside the insulating tube. . Further, the signal lead-in / out section 19 is composed of an insulating cable in which a required wiring circuit connected to the flexible wiring board 17 on the other end side of the insulating tube is installed. further,
The input / output signal control unit (endoscope device main body) 20 is connected to the signal introduction / output unit 19 and has a built-in means for introducing / outputting the input / output signal of the imaging head unit 18, and further outputs an output signal if necessary. It adopts a configuration equipped with means for imaging. Here, the connection of the signal introduction / output unit 19 to the input / output signal control unit 20 may be a fixed type or a detachable type.

When the solid-state image pickup module having the structure shown in FIG. 1 or 2 is mounted as the solid-state image pickup module of the image pickup head portion 18 included in this endoscope apparatus, the image pickup head portion 18 is made compact. In addition to achieving 50%, high performance and reliability were secured. That is, as described above, when the endoscope apparatus having the configuration in which the solid-state imaging module according to the present invention is mounted was tested, it was found that, as in the initial purpose, it is possible to always obtain good-quality imaging in an appropriate imaging area. It was also confirmed that this excellent performance (function) is maintained for a long time.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention. For example, it is possible to adopt a configuration in which a microlens is formed on the light-receiving surface of the solid-state image sensor, or to omit filling the resin layer between the light-receiving surface of the solid-state image sensor and the glass substrate surface.

[0021]

As described above, the solid-state image pickup module according to the present invention can obtain a high-quality picked-up image in a desired pick-up area without significantly changing the specifications such as the basic structure. It is possible and maintains compactness. In other words, the number of components is reduced by supporting and electrically connecting the solid-state image sensor with a glass substrate that also functions as an optical filter and mounting and arranging a part of the active circuit components on the glass substrate. The performance and compactness of the solid-state image pickup module can be achieved while simplifying the structure and the structure.

Further, since the endoscope apparatus according to the present invention has a structure in which the solid-state image pickup module is mounted on the image pickup head section thereof, the image pickup head section of the endoscope apparatus can be easily made compact. Not only can it contribute to the reduction of the patient's pain during insertion into the body, but it also becomes possible to accurately obtain a highly reliable examination image.

[Brief description of drawings]

FIG. 1 is a sectional view showing a main part of a configuration example of a solid-state imaging module according to the present invention.

FIG. 2 is a cross-sectional view showing the main parts of another configuration example of the solid-state imaging module according to the present invention.

FIG. 3 is a block diagram showing a configuration example of a main part of an endoscope apparatus according to the present invention.

FIG. 4 is a sectional view showing a main part of a configuration example of a conventional solid-state imaging module.

[Explanation of symbols]

 1 ... Chip carrier 2, 10 ... Solid-state imaging device (CCD chip) 3 ... Bonding wire 4, 13 ... Mold sealing resin layer 5 ... Optical filter 6 ... Adhesive layer having filter function 7, 17 …… Flexible wiring board 8, 12a, 12b, 12c …… Circuit parts 9 …… Glass substrate 9a …… Glass substrate side terminal (including wiring conductor) 10a …… Solid-state image sensor terminal 11 …… Connection bump ( 14) Insulating frame 15 ... Imaging area 16 ... Conductor layer 18 ... Imaging head 19 ... Signal introduction / exit 20 ... I / O signal controller

Claims (4)

[Claims] 1. A solid-state image pickup device, comprising: a glass substrate having a wiring circuit including required input / output connection terminals provided on one main surface thereof; and a light receiving surface of the glass substrate facing and mounted on the main surface of the glass substrate. An element, a connecting portion for electrically connecting a terminal of the solid-state imaging device and one of the connecting terminals on the surface of the glass substrate, and a main portion of the glass substrate by partitioning the light receiving surface inside the connecting portion. A solid-state image pickup module comprising: an insulating partition frame body provided on a surface; and a sealing resin layer for molding a connection portion outside the partition frame body. 2. A solid-state imaging device comprising a glass substrate on which a wiring circuit including required input / output connection terminals is provided on one main surface, and a light receiving surface facing and mounted on one main surface of the glass substrate. An element, a connecting portion for electrically connecting a terminal of the solid-state imaging device and one of the connecting terminals on the surface of the glass substrate, and a main portion of the glass substrate by partitioning the light receiving surface inside the connecting portion. An insulating partition frame body disposed on the surface, an active type circuit element inserted in the wiring circuit on the glass substrate surface outside the partition frame body, and a seal for molding at least a connecting portion outside the partition frame body A solid-state imaging module comprising a resin layer. 3. The solid-state image pickup module according to claim 1, wherein the insulating partition frame is made of a polyimide resin. 4. An image pickup head unit formed by sealing at least a solid-state image pickup module in a liquid-tight manner, a signal introducing unit for introducing an input / output signal of the image pickup head unit, and input / output at the signal introducing unit. In an endoscope apparatus comprising an input / output signal control unit for controlling signals, the solid-state imaging module has a glass substrate on which a wiring circuit including required input / output connection terminals is provided on one main surface, A solid-state imaging device mounted and arranged on one main surface of the glass substrate with a light-receiving surface facing each other; and a connecting portion for electrically connecting a terminal of the solid-state imaging device and one connection terminal of the glass substrate surface. An insulating partition frame body that is installed on the one main surface of the glass substrate that partitions the light receiving surface inside the connection portion, and a sealing resin layer that molds the connection portion outside the partition frame body It has a special feature that The endoscope apparatus according to.