JP6091296B2 - Imaging device, manufacturing method of imaging device, and imaging module - Google Patents

Description

  The present invention relates to an image pickup apparatus including a wiring board on which an image pickup chip on which an image pickup element is formed is mounted, a method for manufacturing the image pickup apparatus, and an image pickup module including the image pickup apparatus, and in particular, a chip size package type image pickup chip. An imaging device including the imaging device, a method for manufacturing the imaging device, and an imaging module including the imaging device.

  An imaging apparatus including an imaging chip is used, for example, provided at the distal end portion of an electronic endoscope. In order to relieve the pain of the patient, it is an important task to reduce the diameter of the tip of the electronic endoscope.

  As shown in FIG. 1, Japanese Patent Application Laid-Open No. 2011-217887 discloses an imaging apparatus 101 in which a wiring board 130 is disposed in a projection surface 110S of an imaging chip 110. In the imaging device 101, the external connection terminal 113 of the imaging chip 110 and the gold bump 131 of the wiring board 130 are joined. The bent portion 133 of the wiring board 130 is bent.

  In the image pickup apparatus 101, the image pickup chip 110 and the wiring board 130 are joined only by a joint portion between the external connection terminal 113 and the gold bump 131. For this reason, there exists a possibility that it cannot be said that reliability and joining strength are fully ensured.

  On the other hand, as shown in FIG. 2, Japanese Patent Application Laid-Open No. 2012-64883 discloses that a joint between the external connection terminal 213 of the imaging chip 210 and the connection pad 231 of the wiring board 230 is sealed with a sealing layer 220. A stopped imaging device 201 is disclosed. The sealing layer 220 is made of an anisotropic conductive film, and electrically connects the external connection terminal 213 and the connection pad 231 and has a sealing function and a reinforcing function for the joint portion.

  However, in the imaging device 201, it is necessary to pattern the sealing layer 220 into a predetermined shape in accordance with the joint portion.

  In the imaging device 301 illustrated in FIG. 3, after the imaging chip 310 and the wiring board 330 are joined, the sealing layer 320 is disposed by performing a curing process after injecting a liquid resin in the gap between the joined portions. The imaging device 301 is easy to manufacture.

  However, since the liquid resin has fluidity, all the gaps between the imaging chip 310 and the wiring board 330 are filled with the sealing layer 320 in order to reliably seal the joint. In other words, the planar size of the imaging chip 310 and the planar size of the sealing layer 320 are the same size. Since the wiring board 330 is also fixed to the outer peripheral portion of the imaging chip 310, the wiring board 330 could not be arranged in the projection surface 310 </ b> S of the imaging chip 310 even if it was bent.

Japanese Unexamined Patent Publication No. 2011-217887 JP 2012-64883 A

  It is an object of the present invention to provide an imaging device that can be easily manufactured and disposed in a narrow space, a method for manufacturing the imaging device, and an imaging module including the imaging device.

  An image pickup apparatus according to an embodiment of the present invention includes an image pickup chip having an image pickup element on a first main surface, and a first junction terminal connected to the image pickup element via a through wiring on a second main surface. A chip bonding portion having a second bonding terminal bonded to the first bonding terminal of the imaging chip, a bent portion extending from the chip bonding portion, and extending from the bent portion, A wiring board comprising an extended portion having an end portion of a cable connection terminal connected to the second joint terminal, and a seal that seals a terminal joint portion between the first joint terminal and the second joint terminal A sealing layer made of a stop resin, and the bent portion fixed to the imaging chip via the sealing layer is separated from the sealing layer, so that the wiring board of the imaging chip Arranged in the projection plane.

  An image pickup apparatus manufacturing method according to another embodiment has an image pickup device on a first main surface, and an image pickup device having a first junction terminal connected to the image pickup device via a through-wire on a second main surface. A step of manufacturing a chip, a chip joint having a second joint terminal joined to the first joint terminal of the imaging chip, a bent portion extending from the chip joint, and the bent portion A step of producing a wiring board comprising an extended portion having an end portion having a cable connection terminal connected to the second joint terminal, and the first joint terminal of the wiring board; After the liquid resin is injected into the gap between the second main surface of the imaging chip and the wiring board in a flat plate state, the curing process is performed. And a terminal joint portion between the first joint terminal and the second joint terminal A step of providing a sealing layer for sealing; and the wiring board is bent at the bent portion, whereby the bent portion fixed to the imaging chip is separated from the sealing layer, and the wiring A plate is disposed in a projection plane of the imaging chip.

  ADVANTAGE OF THE INVENTION According to this invention, the imaging device which can be arrange | positioned in a narrow space, the manufacturing method of the said imaging device, and the imaging module provided with the said imaging device can be provided.

It is a side view of the conventional imaging device. It is an exploded view of the conventional imaging device. It is a side view of the conventional imaging device. It is sectional drawing of the imaging device of 1st Embodiment. It is a top view of the imaging device of a 1st embodiment. It is a flowchart for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a fragmentary sectional view of an imaging device of modification 1 of a 1st embodiment. It is a fragmentary sectional view of an imaging device of modification 2 of a 1st embodiment. It is sectional drawing of the imaging device of the modification 3 of 1st Embodiment. It is sectional drawing of the imaging module of 2nd Embodiment.

<First Embodiment>
As shown in FIGS. 4 and 5, the imaging device 1 of this embodiment includes an imaging chip 10, a sealing layer 20, a wiring board 30, and a signal cable 50.

  In the imaging device 1, the release layer 40 is disposed on the bent portion 33 of the wiring board 30. That is, as will be described later, the gap between the wiring board 30 and the imaging chip 10 is filled to the outer peripheral portion with the sealing layer 20, but when the wiring board 30 is bent, the interface between the release layer 40 and the sealing layer 20 is In order to peel off, the wiring board 30 is disposed in the projection surface 10 </ b> S of the imaging chip 10.

  The projection surface 10S is a vertical projection surface of the first main surface 10SA and the second main surface 10SB of the imaging chip 10.

Hereinafter, components of the imaging device 1 will be described.
The imaging chip 10 has an imaging element 11 such as a COMS image sensor on the first main surface 10SA, and a plurality of first junction terminals 13 on the second main surface 10SB.

  The imaging chip 10 is manufactured by a wafer level chip size package method using a silicon substrate. The image sensor 11 is connected to the first junction terminal 13 of the second main surface 10SB via a through wiring 12 made of TSV (Through-Silicon Via) or the like.

  The wiring board 30 includes a chip joint portion 32, two bent portions 33 extending from both opposing ends of the chip joint portion 32, and extended portions 34 extending from the respective bent portions 33. .

  The chip joint portion 32 is provided with a plurality of first joint terminals of the imaging chip 10 and a plurality of second joint terminals 31 to which each is joined. A cable connection terminal 35 connected to the signal cable 50 is disposed at the end of the extended portion 34. The second joint terminal 31 and the cable connection terminal 35 are connected by a wiring layer 36 through a bent portion 33. The convex second joining terminal 31 is a gold bump, a copper bump, a solder bump, or the like. Note that the second joint terminal 31 of the wiring board 30 may be a flat electrode pad, and the first joint terminal 13 of the imaging chip 10 may be a convex bump.

  Here, for the sake of convenience, the wiring board 30 is expressed as being divided into a chip joint portion 32, a bent portion 33, and an extending portion 34. However, the wiring board 30 is a single flexible wiring board, The boundaries are not clearly defined. The wiring board only needs to have at least the bent portion 33 to be flexible, and may be a rigid flexible wiring board in which the chip bonding portion 32 and the extending portion 34 are formed of a hard substrate. In the rigid flexible wiring board, the boundary between the sections is relatively clear.

  As shown in FIG. 5, the width W30 of the wiring board 30 is smaller than the width W10 of the imaging chip 10, but the length of the wiring board 30 is longer than the length (height) of the imaging chip 10. However, since the wiring board 30 is bent inward at the bent portion 33, the wiring board 30 is disposed inside the projection surface 10 </ b> S of the imaging chip 10.

  The sealing layer 20 seals the joint portion between the imaging chip 10 and the wiring board 30 and increases the joint strength. The sealing layer 20 is made of a sealing resin obtained by curing the liquid resin 20A (see FIG. 7B). As will be described later, when the first joint terminal 13 of the imaging chip 10 and the second joint terminal 31 of the wiring board 30 are joined, the thickness of the first joint terminal 13 and the thickness of the second joint terminal 31 are combined. As a result, a gap is formed between the imaging chip 10 and the wiring board 30. The liquid resin 20A is injected into the gap and cured to become a sealing resin.

  In order to securely seal the narrow gap, it is necessary to use the liquid resin 20A having high fluidity. Then, the liquid resin 20 </ b> A spreads not only at the joint portion between the first joint terminal 13 and the second joint terminal 31, but also across the entire area where the second main surface 10 </ b> SB of the imaging chip 10 and the wiring board 30 face each other. End up. For this reason, the sealing layer 20 formed by curing of the liquid resin 20 </ b> A is fixed to the imaging chip 10 not only at the chip joint portion 32 of the wiring board 30 but also at the bent portion 33.

  A cable 50 connected to the cable connection terminal 35 of the extending portion 34 of the wiring board 30 transmits a signal and the like between the imaging chip 10 and a control unit and a signal processing unit (not shown). An electronic component may be mounted on the extended portion 34 or the like of the wiring board 30.

  The release layer 40 is disposed on the bent portion 33 of the wiring board 30. Strictly speaking, a region where the release layer 40 is disposed is a bent portion 33 of the wiring board 30.

  The release layer 40 is made of, for example, a silicone resin or a fluororesin.

  The peeling layer 40 has a peeling strength with the sealing layer 20 that is smaller than a peeling strength with the wiring board 30. The peel strength between the release layer 40 and the sealing layer 20 is 10.0 N / cm or less, preferably 5.0 N / cm or less. The peel strength is a vertical peel strength measured according to “Testing method of adhesive tape and adhesive sheet” defined in JIS Z0237.

  If the peeling strength between the peeling layer 40 and the sealing layer 20 is equal to or less than the above range, the interface between the peeling layer 40 and the sealing layer 20 peels when the wiring board 30 is bent by an external force. It is disposed in the projection surface 10S of the imaging chip 10. Although the lower limit of peeling strength is not specifically limited, For example, it is 1.0 N / cm or more.

  That is, the imaging device 1 is easy to manufacture because it is not necessary to pattern the sealing layer. Furthermore, since the bent part 33 fixed to the imaging chip 10 via the sealing layer 20 is separated from the sealing layer 20, the wiring board 30 is arranged in the projection surface 10 </ b> S of the imaging chip 10. It can be arranged in a narrow space.

  When the wiring board 30 is bent, it is preferable to use a jig having two surfaces that intersect at a predetermined angle. As will be described later, the second main surface 30SB of the wiring board 30 may be bonded to a block having a predetermined shape in order to maintain the bent state of the wiring board 30 and to dissipate heat.

  Since the cross-sectional area of the imaging device 1 is the same as the projection surface 10S of the imaging chip 10, the imaging device 1 can be disposed in a narrow space with a small diameter. The endoscope in which the imaging device 1 is disposed at the distal end can easily reduce the diameter of the distal end.

  Next, the manufacturing method of the imaging device 1 will be described along the flowchart of FIG.

<Step S11> Imaging Chip Fabrication As shown in FIG. 7A, the imaging chip 10 is a wafer level chip size package type. First, a plurality of image sensors 11 such as a COMS image sensor are formed on a first main surface 10SA of a semiconductor wafer such as silicon by a known semiconductor manufacturing technique. After the through hole is formed by wet etching or dry etching from the second main surface 10SB side, the inner surface of the through hole is made conductive, whereby the through wiring 12 connected to the imaging element 11 is produced. And the 1st junction terminal 13 connected with the penetration wiring 12 is formed in 2nd main surface 10SB.

  The through-wiring 12 is formed on the outer peripheral portion of the imaging element 11 on the first main surface 10SA, but the first joint terminal 13 on the second main surface 10SB is preferably arranged on the inner peripheral side. . That is, when the position where the first joining terminal 13 is disposed is close to the outer periphery of the imaging chip 10, it may be difficult to dispose the wiring board 30 inside the projection surface 10 </ b> S of the imaging chip 10. For this reason, in the imaging chip 10, a wiring layer (not shown) is used in order to dispose the first joint terminals 13 on the inner peripheral side with respect to the formation portion of the through wiring 12. The through wiring 12 and the image sensor 11 are also connected by a wiring layer (not shown).

  A large number of imaging chips 10 are collectively manufactured by cutting a semiconductor wafer into pieces using a wire saw, a blade dicing apparatus, or a laser dicing apparatus.

  Note that an imaging device in which the first main surface 10SA is covered with a cover glass may be manufactured by forming a through-hole or the like on the first main surface 10SA of the semiconductor wafer after bonding the glass wafer.

<Step S12> Wiring Board Production For example, the wiring board 30 which is a flexible wiring board using a flexible resin such as polyimide as a base material is produced by a known wiring board production technique. On the first main surface 30SA of the wiring board 30, a plurality of joining terminals 31 are formed on the chip joining portion 32, and a plurality of cable connection terminals 35 are formed on the extending portion. The wiring board 30 may be a single-sided wiring board, but is preferably a double-sided wiring board or a multilayer wiring board. Further, as will be described later, electronic components such as chip capacitors may be mounted on the wiring board 30 in advance.

  Needless to say, the order of the imaging chip manufacturing step (S11) and the wiring board manufacturing step (S12) may be reversed.

<Step S13> Release Layer Arrangement The release layer 40 is provided on the bent portion 33 of the first main surface 30SA of the wiring board 30. For example, a release layer 40 made of a silicone resin is pattern-coated on the wiring board 30 and cured.

  As shown in FIG. 7A, when the release layer 40 is disposed, the wiring board 30 is in a flat plate state. That is, the region that faces the outer periphery of the imaging chip 10 when bonded is the bent portion 33.

  The region where the release layer 40 is disposed is appropriately determined based on the flexibility of the wiring board 30 and the bending angle θv. Since the sealing layer 20 (liquid resin 20A) may protrude from the gap between the imaging chip 10 and the wiring board 30, the release layer 40 is a part of the extended portion 34 as shown in FIG. It is preferable that it is arrange | positioned.

<Step S14> Joining As shown in FIGS. 7A and 7B, the joining terminal 31 of the first main surface 30SA of the flat wiring board 30 and the joining terminal 13 of the imaging chip 10 are electrically connected. Are joined together. Bonding is performed by pressure bonding, ultrasonic bonding, or solder bonding.

<Step S15> Sealing Layer Arrangement Between the second main surface 10SB of the imaging chip 10 bonded as described above and the first main surface 30SA of the chip bonding portion 32 of the wiring board 30, there is a space. (Gap) is provided. It is underfill that fills this gap, and is the sealing layer 20 made of the liquid resin 20A. The liquid resin 20A is, for example, a one-component epoxy resin, and is cured by heating to become a sealing resin.

  In order to ensure the bonding reliability, as shown in FIG. 7C, the liquid resin 20A is injected and cured so as to completely cover the second main surface 10SB of the imaging chip 10.

<Step S16> Bending As shown in FIG. 7D, the wiring board 30 is arranged so that the second main surfaces 30SB of the two extending portions 34 extending from both ends of the chip bonding portion 32 face each other. The bent portion 33 is bent. Then, the interface between the peeling layer 40 and the sealing layer 20 peels due to the external force when bending. For this reason, the wiring board 30 is disposed in the projection surface 10 </ b> S of the imaging chip 10.

  When the bending angle θv is approximately 90 degrees or less, the wiring board 30 is disposed in the projection surface 10S of the imaging chip 10, but considering the joining of the signal cable 50, the bending angle θv is 80 to 45 degrees. preferable.

<Cable connection process>
The cable connection terminal 35 of the extending part 34 of the wiring board 30 and the signal cable 50 are connected. The cable connection is performed by, for example, solder bonding.

  Since the cable 50 has flexibility, the cable 50 does not need to be disposed in the space in the projection surface 10S of the imaging chip 10 over the entire length in order to reduce the diameter of the imaging device 1. It is only necessary that the cable 50 has at least a junction with the wiring board 30 disposed in the projection surface 10S.

  As described above, the manufacturing method of the imaging device 1 of the present embodiment includes the imaging chip manufacturing process (S11), the wiring board manufacturing process (S12), the release layer providing process (S13), and the bonding process ( S14), a sealing layer disposing step (S15), and a bending step (S16). In the bending process, the interface between the release layer 40 and the sealing layer 20 is peeled off, and the bent portion 33 fixed to the imaging chip 10 is separated from the sealing layer 20. It is disposed in the projection surface 10S.

  According to the manufacturing method of the present embodiment, the imaging device 1 that can be disposed in a narrow space can be manufactured.

<Modification of First Embodiment>
Next, imaging devices 1A, 1B, and 1C according to modified examples of the first embodiment will be described. Since the imaging devices 1A, 1B, and 1C are similar to the imaging device 1, the same components are denoted by the same reference numerals and description thereof is omitted.

  In the imaging device 1A of Modification 1, as shown in FIG. 8, the surface modification layer 40A is formed on the bent portion 33 of the wiring board 30, and the interface between the surface modification layer 40A and the sealing layer 20 peels off. ing. For this reason, the wiring board 30 is disposed in the projection surface 10 </ b> S of the imaging chip 10. Here, the peel strength between the surface modified layer 40A and the sealing layer 20 is smaller than the peel strength between the surface modified layer 40A and the wiring board 30, for example, 10 N / cm or less.

  40 A of surface modification layers are formed by introduce | transducing a fluorine group into the surface layer which consists of a polyimide resin of the base | substrate of the wiring board 30, for example. The surface modification layer 40A may be formed from the bent portion 33 to the entire extended portion 34. In other words, the surface modification layer 40 </ b> A may be formed in the entire region other than the chip bonding portion 32 of the wiring board 30. Similarly, the same effect can be obtained by spray-coating a release agent or lubricant made of silicone resin or fluororesin.

  In the imaging device 1B of Modification 2, as shown in FIG. 9, the peeling member 40B is joined to the sealing layer 20 facing the bent portion 33. The peeling member 40B is, for example, a polyimide tape (polyimide adhesive tape) having an adhesive layer 42 on one surface of the substrate portion 41 made of a flexible resin. The interface between the adhesive layer 42 and the bent portion 33 of the wiring board 30 is peeled off. For this reason, the wiring board 30 is disposed in the projection surface 10 </ b> S of the imaging chip 10. As the peeling member, an adhesive tape such as a cellophane tape, an acetate pressure-sensitive adhesive tape, a vinyl tape, or a craft pressure-sensitive adhesive tape can be used.

  The peeling member 40 </ b> B was bonded to the bent portion 33 of the wiring board 30 via the adhesive layer 42. However, the peeling member 40 </ b> B peeled off from the bent portion 33 when the wiring board 30 was bent. That is, the peel strength between the adhesive layer 42 of the peeling member 40B and the wiring board 30 is smaller than the peel strength between the substrate portion 41 and the sealing layer 20, and is, for example, 10 N / cm or less. In addition, since there is no difference in effect even if the peeled portion is between the adhesive layer 42 and the substrate portion 41 or between the sealing layer 20 and the substrate portion 41, the material of the substrate portion 41, the material of the adhesive layer 42, Those combinations are appropriately selected.

  In the imaging device 1 </ b> C according to the third modified example, as illustrated in FIG. 10, the wiring board 30 </ b> C has a bent portion 33 and an extending portion 34 extending from only one end portion of the chip joint portion 32. For this reason, the sealing layer 20C does not cover the entire surface of the second main surface 10SB of the imaging chip 10.

Similar to the imaging device 1, the imaging device 1 </ b> C has the wiring board 30 </ b> C in the projection surface 10 </ b> S of the imaging chip 10 by peeling the interface between the release layer 40 disposed in the bent portion 33 and the sealing layer 20. Has been placed.

  The imaging devices 1A to 1C of the modified example all have the effects of the imaging device 1, and the manufacturing methods of the imaging devices 1A to 1C of the modified example all have the effects of the manufacturing method of the imaging device 1.

Second Embodiment
As shown in FIG. 11, the imaging module 2 of the second embodiment is housed in a shield case 60, which is a housing made of metal, and the imaging device 1D. Similar to the imaging apparatus 1 and the like already described, in the imaging apparatus 1D, the wiring board 30 is disposed in the projection surface 10S of the imaging chip 10. That is, although details are not illustrated in FIG. 11, the imaging device 1 </ b> D has the same configuration as any of the imaging devices 1, 1 </ b> A to 1 </ b> C, and is a bent portion fixed to the imaging chip 10 via the sealing layer 20. By separating 33 from the sealing layer 20, the wiring board 30 is disposed in the projection surface 10 </ b> S of the imaging chip 10. For this reason, the inner dimension of the shield case 60 is substantially the same as the outer dimension of the imaging chip 10 and is small (small diameter).

  A cover glass 61 is bonded to the first main surface 10SA of the imaging chip 10. An electronic component 63 is mounted on the extending portion 34 of the wiring board 30.

  The optical system 62 composed of a plurality of lenses (including other optical members) schematically shown with the imaging device 1D is aligned around the optical axis O by an optical system holder 65 that is a holder of the optical system 62. Has been. Further, the inside of the shield case 60 bonded to the optical system holder 65 is sealed with a highly heat conductive sealing resin 64.

  Furthermore, the imaging apparatus 1D includes a block 70 that is a reinforcing member for holding the bent portion 33 of the wiring board 30 by bending it inside at a predetermined angle. The block 70 has a joint surface joined to the second main surface 30SB of the wiring board 30, and inclined surfaces inclined inward at a predetermined angle θV on both sides of the joint surface. The wiring board 30 is bent along the block 70, and the bending angle θv of the bent portion 33 is determined by the angle θv of the inclined surface of the block 70. The block 70 is preferably made of a highly heat conductive material such as aluminum and has a heat dissipation function.

  Since the imaging device 1D is small and easy to manufacture, the imaging module 2 can be easily downsized and manufactured. Further, the wiring board 30 bent by the block 70 is stably held. Furthermore, since the heat generated by the imaging chip 10 is transferred through the block 70, the imaging module 2 is stable in operation because the imaging chip 10 does not easily reach a high temperature. Since the imaging module 2 has a small diameter, it can be preferably used as an imaging means for the distal end portion of the electronic endoscope.

  The present invention is not limited to the above-described embodiments and modifications, and various changes and modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1, 1-1C ... Imaging device, 10 ... Imaging chip, 11 ... Imaging element, 12 ... Through wiring, 13 ... Joining terminal, 20 ... Sealing layer, 20A ... Liquid resin, 30 ... Wiring board, 31 ... Joining terminal, 32 ... Chip bonding part, 33 ... Bending part, 34 ... Extension part, 35 ... Cable connection terminal, 36 ... Wiring layer, 40 ... Peeling layer, 40A ... Surface modification layer, 40B ... Peeling member, 41 ... Substrate part, 42 ... Adhesive layer, 50 ... Signal cable, 60 ... Shield case, 61 ... Cover glass, 62 ... Optical system, 63 ... Electronic component, 64 ... Sealing resin, 65 ... Optical system Holder, 70 ... Block

Claims (9)

An imaging chip having an image sensor on a first main surface and having a first junction terminal connected to the image sensor on a second main surface via a through-wiring;
A chip joint having a second joint terminal joined to the first joint terminal of the imaging chip, a bent portion extending from the chip joint, and the first extending from the bent portion. A wiring board composed of an extended portion having an end portion of a cable connection terminal connected to the two junction terminals;
A sealing layer made of a sealing resin for sealing a terminal joint portion between the first joint terminal and the second joint terminal;
The wiring board is arranged in a projection plane of the imaging chip by separating the bent portion fixed to the imaging chip via the sealing layer from the sealing layer. Imaging device.   The imaging apparatus according to claim 1, wherein a peeling layer is disposed at the bent portion, and an interface between the peeling layer and the sealing layer is peeled off.   The imaging device according to claim 1, wherein a surface modification layer is formed at the bent portion, and an interface between the surface modification layer and the sealing layer is peeled off.   The peeling member having an adhesive layer on one side of the substrate portion is bonded to the sealing layer, and an interface between the adhesive layer and the bent portion of the peeling member is peeled off. Imaging device. A step of producing an imaging chip having an image sensor on a first main surface and having a first junction terminal connected to the image sensor on a second main surface via a through wiring;
A chip joint having a second joint terminal joined to the first joint terminal of the imaging chip; a bent portion extending from the chip joint; and the first extending from the bent portion. A step of producing a wiring board composed of an extended portion having a cable connection terminal connected to the two junction terminals at an end;
A joining step in which the first joining terminal of the wiring board and the second joining terminal of the imaging chip are joined;
After the liquid resin is injected into the gap between the second main surface of the imaging chip and the flat wiring board, the terminal is bonded to the first and second bonding terminals after being cured. A step of disposing a sealing layer for sealing the part;
When the wiring board is bent at the bent portion, the bent portion fixed to the imaging chip is separated from the sealing layer, and the wiring board is disposed in the projection plane of the imaging chip. A method of manufacturing an imaging device. Before the joining step, comprising the step of disposing a release layer on the bent portion of the wiring board,
The method for manufacturing an imaging device according to claim 5, wherein an interface between the peeling layer and the sealing layer is peeled off when the wiring board is bent at the bent portion. Before the joining step, comprising the step of forming a surface modification layer on the bent portion of the wiring board,
The method for manufacturing an imaging device according to claim 5, wherein an interface between the surface modification layer and the sealing layer is peeled off when the wiring board is bent at the bent portion. Before the joining step, comprising a step of adhering a peeling member having an adhesive layer on one side of the substrate portion to the bent portion via the adhesive layer,
6. The method of manufacturing an imaging device according to claim 5, wherein when the wiring board is bent at the bent portion, an interface between the adhesive layer and the bent portion is peeled off. The imaging apparatus according to any one of claims 1 to 4,
An optical system disposed in front of the imaging device;
An optical system holder that is a holder of the optical system;
A shield case containing the imaging device, which is joined to the optical system holder;
An imaging module comprising: a sealing resin filling the inside of the shield case.

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