JP2013048297A - 電極を備えた透明基材 - Google Patents
電極を備えた透明基材 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 51
- 239000011521 glass Substances 0.000 claims abstract description 34
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 31
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000011733 molybdenum Substances 0.000 claims abstract description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 44
- 230000004888 barrier function Effects 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 21
- 229910052757 nitrogen Inorganic materials 0.000 claims description 21
- 150000004767 nitrides Chemical class 0.000 claims description 18
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 230000004044 response Effects 0.000 claims description 9
- 230000002745 absorbent Effects 0.000 claims description 8
- 239000002250 absorbent Substances 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- 150000001340 alkali metals Chemical class 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052951 chalcopyrite Inorganic materials 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229910052735 hafnium Inorganic materials 0.000 claims description 2
- 229910001120 nichrome Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 239000002585 base Substances 0.000 claims 4
- 229910001092 metal group alloy Inorganic materials 0.000 claims 2
- 239000010410 layer Substances 0.000 description 153
- 238000012360 testing method Methods 0.000 description 15
- 239000011669 selenium Substances 0.000 description 12
- 229910052711 selenium Inorganic materials 0.000 description 11
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 229910052717 sulfur Inorganic materials 0.000 description 7
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000011593 sulfur Substances 0.000 description 6
- 229910000906 Bronze Inorganic materials 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- 239000013626 chemical specie Substances 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001000 micrograph Methods 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- AZUYLZMQTIKGSC-UHFFFAOYSA-N 1-[6-[4-(5-chloro-6-methyl-1H-indazol-4-yl)-5-methyl-3-(1-methylindazol-5-yl)pyrazol-1-yl]-2-azaspiro[3.3]heptan-2-yl]prop-2-en-1-one Chemical compound ClC=1C(=C2C=NNC2=CC=1C)C=1C(=NN(C=1C)C1CC2(CN(C2)C(C=C)=O)C1)C=1C=C2C=NN(C2=CC=1)C AZUYLZMQTIKGSC-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910016001 MoSe Inorganic materials 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- NIFIFKQPDTWWGU-UHFFFAOYSA-N pyrite Chemical compound [Fe+2].[S-][S-] NIFIFKQPDTWWGU-UHFFFAOYSA-N 0.000 description 1
- 229910052683 pyrite Inorganic materials 0.000 description 1
- 239000011028 pyrite Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
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Abstract
【解決手段】特にはガラス製であり、特には太陽電池用の電極を備え、厚さが多くとも500nm、特には多くとも400nm、多くとも300nm、又は、多くとも200nmのモリブデンMoに基づいた導電層を含んで成る透明基材が提供される。
【選択図】図1
Description
M/Mo/M’N
M/M’N/Mo
M/Mo
M’N/Mo
Mo/M’N
を含んでなる、本発明に従った電極の構成を有することが可能である。
(1)金属層は、不活性雰囲気において、対応する金属ターゲットを使用し、
(2)金属窒化物層は、不活性ガスと窒素の混合物を含む反応性雰囲気において、対応する金属ターゲットを使用し、
(3)窒化ケイ素層は、不活性ガスと窒素の混合物を含む反応性雰囲気において、AlをドープしたSiターゲットを使用し、
(4)酸化ケイ素層は、AlをドープしたSiターゲットと、不活性ガスと酸素の混合物を含んで成る反応性雰囲気を使用した。
(1)すべての層を堆積させた後、4点法によって表面抵抗R□(1)を測定すること。
(2)いわゆる“ブロンズ(bronze)”試験、即ち、この試験は、空気中350℃で10分間、すべての層を備えたガラスを加熱することにある。該試験は、ナトリウムが、ガラスから電極に拡散したかどうかを調べることを意図するものである。該試験の最後に、表面抵抗R□(2)を、再度4点法によって測定する。加えて、顕微鏡を(100倍、及び、1000倍の倍率で)使用して、熱処理によって欠陥(ピンホール)等が生じたかどうかを確認する。
(3)いわゆる“セレン化(selenization)”試験、即ち、この試験は、セレン雰囲気中において、10分間、すべての層を備えたガラス基材を、さらに加熱することにある。セレン温度は200〜240℃の間とし、ガラス温度は325〜365℃の間とする。該試験の最後に、表面抵抗R□(3)を再度測定し、これからセレン化前の値とセレン化後の値とで、抵抗率(表面抵抗)の差、ΔR□(3)を算出する。
(1)ガラス中のナトリウムが電極へ拡散するのを妨げられること、
(2)電極が“ブロンズ”試験及び“セレン化”試験に対して、ある程度の抵抗性、即ち、欠陥がほとんどなく、且つ、十分な表面抵抗を有すること、
(3)電極がCIS層によく付着すること、及び、
(4)電極が特にレーザーによって、容易にエッチングできること、
が有利であると考えられる。
例1
この例は、バリヤー層とモリブデンの単一層電極を、ガラス/Si3N4(200nm)/Mo(500nm)の順序で使用する。図1は、セレン化工程の後、ガラスを顕微鏡で1000倍に拡大した写真である。顕微鏡写真によって、欠陥が少ししかなく、その上、小さいことが示される。電極の品質は良好であるとみなされる。
この例は、例1と同じであるが、著しくより薄いMo層を有する多層スタックを、ガラス/Si3N4(200nm)/Mo(200nm)の順序で使用する。
この例は、バリヤー層と2層電極(即ち、金属M層/Mo層)を、ガラス/Si3N4(200nm)/Ag(50nm)/Mo(175nm)の順序で使用する。
この例は、例2と同じであるが、別のタイプの金属M層を有する構成、即ち、ガラス/Si3N4(200nm)/Al(100nm)/Mo(175nm)を使用する。
この例は、バリヤー層と、金属/金属窒化物/Moの3層電極を、ガラス/Si3N4(200nm)/Cu(100nm)/TiN(100nm)/Mo(175nm)の順序で使用する。
これは例4と同じであるが、銅層の厚さが異なる構成、即ち、ガラス/Si3N4(200nm)/Cu(50nm)/TiN(100nm)/Mo(175nm)である。
この例は、バリヤー層と3層電極を、ガラス/Si3N4(200nm)/Ag(50nm)/TiN(100nm)/Mo(175nm)の順序で使用する。それは例2に対応するが、加えてTiN層を有する。
さらに、この例は、バリヤー層と3層電極を、ガラス/Si3N4(200nm)/Al(100nm)/TiN(100nm)/Mo(175nm)の順序で使用する。それは例3に対応するが、加えてTiN層を有する。
これらの例の目的は、反射における電極の側色学的応答を調節することである。
この例は、ガラス/Si3N4(200nm)/TiN(100nm)/Mo(400nm)の多層スタックを使用し、TiN層は、20vol%の窒素を含む反応性雰囲気において、反応性スパッタリングによって堆積させた。
これは例8と同じ構成であるが、この場合においては、TiN層を40vol%の窒素を含む雰囲気で堆積させた。
これは例8と同じ構成であるが、この場合においては、TiN層を70vol%の窒素を含む雰囲気で堆積させた。
この例において、高屈折率/低屈折率の光学コーティングを形成するために、屈折率を約2とするSi3N4バリヤー層を、屈折率を約1.45とするSiO2に基づいた付加的な層と組み合せる。
例9を繰り返し行うが、今度は40vol%の窒素がTiNの堆積雰囲気にある状態で行った。
例9を繰り返し行うが、今度は70vol%の窒素がTiNの堆積雰囲気にある状態で行った。
今度は、使用する窒化物層をNbNから作製し、ガラス/Si3N4(200nm)/SiO2(30nm)/NbN(100nm)/Mo(500nm)の構成とした。該NbN層は、20vol%の窒素を含む雰囲気において堆積させた。
例10を繰り返し行うが、この場合においては、NbN層を40vol%の窒素を含む雰囲気で堆積させた。
例10を繰り返し行うが、この場合においては、NbN層を70vol%の窒素を含む雰囲気で堆積させた。
この例は、例10、10a、10bの一連の層を繰り返し行うが、Si3N4とSiO2の厚さが異なる。
この例は、例11を繰り返し行うが、この場合においては、40vol%の窒素を含む雰囲気でNbN層を堆積させた。
この例は、例11を繰り返し行うが、この場合においては、70vol%の窒素を含む雰囲気でNbN層を堆積させた。
この例は、ガラス/Si3N4(150nm)/SiO2(65nm)/Si3N4(15nm)/Mo(500nm)の順序の層とする。
Claims (24)
- 特に太陽電池用の電極を備え、厚さが多くとも500nm、特には多くとも400nm、多くとも300nm、又は、多くとも200nmのモリブデンMoに基づいた導電層を含んで成ることを特徴とする、特にガラス製の透明基材。
- モリブデンに基づいた層が、少なくとも20nm、特には少なくとも50nm、又は、少なくとも80nmの厚さであることを特徴とする、請求項1に記載の基材。
- 特にアルカリ金属に対してバリヤーとして働く、少なくとも1つのバリヤー層を備え、該バリヤー層が前記基材と前記電極の間に挿入されていることを特徴とする、請求項1又は請求項2の何れか1項に記載の基材。
- 該バリヤー層が、以下の化合物、即ち、窒化ケイ素又は酸窒化ケイ素、窒化アルミニウム又は酸窒化アルミニウム、酸化ケイ素又は酸炭化ケイ素のうちの少なくとも1つから選択された誘電材料に基づくことを特徴とする、請求項3に記載の基材。
- 該バリヤー層が、少なくとも20nm、特には少なくとも100nm、及び、好ましくは多くとも300nm、特には多くとも250nm、又は、多くとも200nmの厚さであることを特徴とする、請求項3又は請求項4の何れか1項に記載の基材。
- 該電極が、モリブデンに基づいた層とは異なる、少なくとも1つの補足(complementary)導電層を含んで成ることを特徴とする、請求項1〜5の何れか1項に記載の基材。
- 該補足導電層、又は、少なくとも2つある場合にはそれらのうちの少なくとも1つが、少なくとも10nm、特には少なくとも40nm、及び、好ましくは多くとも300nmの厚さであり、好ましくは厚さが50〜200nmの間であることを特徴とする、請求項6に記載の基材。
- 該電極が、金属又は金属合金に基づいた少なくとも1つの補足導電層Mを含んで成り、特には以下の金属又は合金、即ち、Cu、Ag、Al、Ta、Ni、Cr、NiCr、鋼のうちの1つから選択されたことを特徴とする、請求項6又は請求項7の何れか1項に記載の基材。
- 該電極が、モリブデンに基づいた導電層Moの下に、金属又は金属合金に基づいた少なくとも1つの補足導電層Mを含んで成ることを特徴とする、請求項6〜8の何れか1項に記載の基材。
- 該電極が、以下の金属、即ち、Ta、Zr、Nb、Ti、Mo、Hfのうちの少なくとも1つの窒化物に基づいた、少なくとも1つの補足導電層M’Nを含んで成り、前記窒化物が、窒素に関して、亜化学量論的(substoichiometric)、化学量論的(stoichiometric)、又は、過化学量論的(superstoichiometric)であることを特徴とする、請求項6〜9の何れか1項に記載の基材。
- 該層M’Nが、モリブデンに基づいた層Moの下、及び/又は、上にあることを特徴とする、請求項10に記載の基材。
- 該層M’Nが、層MとMoに基づいた層との間に配置されたことを特徴とする、請求項8及び請求項10に記載の基材。
- 該電極が、以下の順序の層、即ち、M/Mo/M’N、M/M’N/Mo、M/Mo、M’N/Mo、Mo/M’Nのうちの1つを含んで成ることを特徴とする、請求項8及び/又は請求項10に記載の基材。
- 該電極の導電層厚さの合計が、600nm以下、特には500nm以下であることを特徴とする、請求項1〜13の何れか1項に記載の基材。
- 該電極が、2Ω/□以下、特には1Ω/□以下、好ましくは0.50Ω/□、又は、0.45Ω/□以下の表面抵抗(resistance per square)R□を有することを特徴とする、請求項1〜14の何れか1項に記載の基材。
- 該バリヤー層が、光学的な目的のために多層コーティングの一部を形成し、該多層コーティングが異なる屈折率を有する誘電材料のうちの少なくとも2つの層から成ることを特徴とする、請求項3に記載の基材。
- 該多層コーティングが、1.9〜2.3の高屈折率を有する層と、1.4〜1.7の低屈折率を有する層の交互配列を、特にはSi3N4/SiO2、又は、Si3N4/SiO2/Si3N4の順序で含んで成ることを特徴とする、請求項16に記載の基材。
- 光学コーティングの組成が、反射における該基材の測色学的応答(colorimetric response)を、特にはマイナスのa*とb*の値で青緑に、又は、わずかにプラスのa*値とマイナスのb*値でピンクに、少なくとも部分的に調節することを特徴とする、請求項16又は請求項17に記載の基材。
- 窒化物層M’Nの窒素の化学量論的量が、反射における該基材の測色学的応答を、特にはマイナスのa*とb*の値で青緑に、又は、プラスのa*値とマイナスのb*値でピンクに、少なくとも部分的に調節することを特徴とする、請求項10に記載の基材。
- 可視光領域において吸収性の、特にはTiNから作製され、好ましくは厚さが2〜15nmである薄層が、反射における該基材の測色学的応答を、特にはマイナスのa*とb*の値で青緑に、又は、わずかにプラスのa*値とマイナスのb*値でピンクに、少なくとも部分的に調節するために、該バリヤー層と該電極の間に挿入されたことを特徴とする、請求項3に記載の基材。
- 該電極の上部に黄銅鉱の吸収剤層を含んで成ることを特徴とする、請求項1〜20の何れか1項に記載の基材。
- 太陽電池電極としての、請求項1〜20の何れか1項に記載の該基材の使用。
- 太陽電池を作製するための請求項21に記載の該基材の使用。
- 請求項21に記載の該基材を含んで成ることを特徴とする、太陽電池。
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