JP2008117945A - ウォータージェットレーザダイシング用粘着シート - Google Patents
ウォータージェットレーザダイシング用粘着シート Download PDFInfo
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- JP2008117945A JP2008117945A JP2006299864A JP2006299864A JP2008117945A JP 2008117945 A JP2008117945 A JP 2008117945A JP 2006299864 A JP2006299864 A JP 2006299864A JP 2006299864 A JP2006299864 A JP 2006299864A JP 2008117945 A JP2008117945 A JP 2008117945A
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- pressure
- sensitive adhesive
- adhesive sheet
- meth
- water jet
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- 239000002964 rayon Substances 0.000 description 1
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- 239000002904 solvent Substances 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
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- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
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Abstract
【解決手段】基材フィルム上に粘着剤層が積層されてなるウォータージェットレーザダイシング用粘着シートであって、基材フィルムが、繊維によって形成されたメッシュからなるウォータージェットレーザダイシング用粘着シート。
【選択図】なし
Description
このウォータージェットレーザダイシング用粘着シートでは、基材フィルムが、メッシュフィルムであるか、繊維径10〜200μmのモノフィラメント又はマルチフィラメントにより形成されてなることが好ましい。
また、粘着剤層の厚みが1〜30μmであることが好ましい。
基材フィルムの厚さは、シートの破損または半導体ウェハ等の加工中の切断を防止するとともに、製造コストを抑えるという観点から、10〜400μmが好ましく、さらに30〜250μmが好ましい。
さらに、基材フィルムは、引張強度が0.1N/20mmを超えることが好ましく、さらに0.3N/20mmより高いことが好ましい。粘着シート自体の破損および/または切断を回避するためである。
引張強度は、破断時の測定値である。
接着剤層は、基材フィルムの一面に塗布された接着剤層によって構成されている。この接着剤は、感圧型、感熱型、感光型のいずれの型でもよいが、エネルギー線の照射によって硬化するタイプの接着剤であることが適している。これにより、被加工物からの剥離性を容易に行うことができる。エネルギー線としては、例えば、紫外線、可視光線、赤外線等、種々の波長のものを利用することができるが、ダイシングに用いるレーザビームが、400nm以下の発振波長、例えば、発振波長248nmのKrFエキシマレーザー、308nmのXeCIエキシマレーザー、YAGレーザーの第三高調波(355nm)、第四高調波(266nm)、あるいは400nm以上の発振波長、例えば、多光子吸収過程を経由した紫外線領域の光吸収が可能で、かつ多光子吸収アブレーションにより20μm以下の幅の切断加工などが可能である波長750〜800nm付近のチタンサファイヤレーザー等でパルス幅が1e-9秒(0.000000001秒)以下のレーザーなどであることから、用いるダイシング装置のレーザービームの照射によって硬化しない接着剤を用いることが好ましい。
モノマー/オリゴマーとしては、例えば、ウレタン(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、テトラメチロールメタンテトラ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールモノヒドロキシペンタ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、及び1,4−ブチレングリコールジ(メタ)アクリレートなどが挙げられる。これらは単独で用いてもよく、2種以上を併用してもよい。これらの配合量は、特に制限されるものではないが、粘着性を考慮すると、粘着剤を構成する(メタ)アクリル系ポリマー等のベースポリマー100重量部に対して、5〜500重量部程度であることが好ましく、さらに70〜150重量部程度であることが好ましい。
アクリル系ポリマーの調製は、例えば、1種又は2種以上のモノマーまたはそれらの混合物に、溶液重合法、乳化重合法、現状重合法、懸濁重合法等の公知の方法を適用して行うことができる。なかでも、溶液重合法が好ましい。ここで用いる溶媒は、例えば、酢酸エチル、トルエン等の極性溶剤が挙げられる。溶液濃度は、通常20〜80重量%程度である。
特に、アクリル系ポリマーは、被加工物への汚染防止等の観点から、低分子量物質の含有量が少ないものが好ましく、アクリル系ポリマーの数平均分子量は、30万以上、さらに80〜300万程度が好ましい。
ここで、接着強さは、測定温度が23±3℃、剥離角度が180°、剥離速度が300mm/分(ASTM D1000に準拠)の条件下に、Siミラーウェハ上で測定した場合の値である。
(粘着剤層の形成)
アクリル酸メチル60重量部、アクリル酸2−エチルヘキシル35重量部、アクリル酸5重量部を酢酸エチル中で常法により共重合させた。これにより、重量平均分子量70万のアクリル系共重合体を含有する溶液を得た。
線径20μmのポリエチレンテレフタレートからなるメッシュの平均開口径が3μm、5μm、30μm□(空隙率30%)、50μm□(空隙率55%)、100μm□(空隙率85%)、平均厚さがそれぞれ45μmのメッシュフィルムを基材とし、上記で製造した粘着剤を、厚さ5μm、15μm、30μm、50μmとなるようにそれぞれ塗布し、レーザー加工用粘着シートを作製した。
実施例及び比較例で作製された粘着シートの算術平均粗さRaを測定した。
テンコール製の段差・表面粗さ微形状測定装置 P−15を用いて、得られたレーザ加工用粘着シートの粘着剤層表面について、図1に示すように、レーザ加工用粘着シート10の幅方向(例えば、幅E=1400mm)に3箇所(X、Y、Z)、長さ方向について、間隔D(例えば、10m)で10箇所、計30箇所を測定した平均粗さを算術平均粗さRaとした。各箇所の測定距離は粘着剤層側表面を長さ50mmに渡って測定した。
図2に示すように、SUS板をテープ保持用板11とし、日東電工社製の両面テープ12(NO.500)を介して、粘着シート10を固定した。
密着力測定の際に、粘着剤層と基材フィルムとの間で、粘着剤層が剥がれなかった場合、これらの密着力は、得られた値以上であるとした。
実施例及び比較例で得られた粘着シートを用いてシリコンウエハをダイシングし、加工の際の水の透過性、加工精度(チップ飛散およびチップ欠けの発生)を測定し、総合的な評価を行った。ダイシング条件は以下の通りとした。
ダイシング速度:50mm/s
レーザー直径:50μm
水ジェット圧:40MPa
チップサイズ:1mm×1mm
ウェハサイズ:13.7cm(5インチ)
ウェハ厚さ:150μm
なお、水透過性の測定は、水が透過しない場合を×、一部透過した場合を△、水が透過する場合を○として表わした。
総合評価は、水透過性及び加工精度等に基づいて行ったが、ピックアップ不良が発生したものには*を付した。
11 テープ保持用板
12 両面テープ
13 粘着剤層
14 テープ
Claims (4)
- 5〜30μmの平均開口径の孔を有する基材フィルム上に粘着剤層が積層されて構成されることを特徴とするウォータージェットレーザダイシング用粘着シート。
- 基材フィルムがメッシュフィルムである請求項1に記載のウォータージェットレーザダイシング用粘着シート。
- 基材フィルムが、繊維径10〜200μmのモノフィラメント又はマルチフィラメントにより形成されてなる請求項1〜3のいずれか1つに記載のウォータージェットレーザーダイシング用粘着シート。
- 粘着剤層の厚みが1〜30μmである請求項1又は2に記載のウォータージェットレーザーダイシング用粘着シート。
Priority Applications (6)
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JP2006299864A JP2008117945A (ja) | 2006-11-06 | 2006-11-06 | ウォータージェットレーザダイシング用粘着シート |
EP20070021321 EP1918343A1 (en) | 2006-11-06 | 2007-10-31 | Adhesive sheet for water jet laser dicing |
US11/931,124 US20080108262A1 (en) | 2006-11-06 | 2007-10-31 | Adhesive sheet for water jet laser dicing |
TW96141441A TW200842031A (en) | 2006-11-06 | 2007-11-02 | Adhesive sheet for water jet laser dicing |
KR1020070112073A KR20080041123A (ko) | 2006-11-06 | 2007-11-05 | 워터젯 레이저 다이싱용 점착 시트 |
CNA2007101850728A CN101177598A (zh) | 2006-11-06 | 2007-11-06 | 喷水激光切割用粘合片 |
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JP2006299864A JP2008117945A (ja) | 2006-11-06 | 2006-11-06 | ウォータージェットレーザダイシング用粘着シート |
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JP2006299864A Pending JP2008117945A (ja) | 2006-11-06 | 2006-11-06 | ウォータージェットレーザダイシング用粘着シート |
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US (1) | US20080108262A1 (ja) |
EP (1) | EP1918343A1 (ja) |
JP (1) | JP2008117945A (ja) |
KR (1) | KR20080041123A (ja) |
CN (1) | CN101177598A (ja) |
TW (1) | TW200842031A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008117943A (ja) * | 2006-11-06 | 2008-05-22 | Nitto Denko Corp | ウォータージェットレーザダイシング用粘着シート |
JP2008270504A (ja) * | 2007-04-20 | 2008-11-06 | Nitto Denko Corp | ウォータージェットレーザダイシング用粘着シート |
WO2024181556A1 (ja) * | 2023-03-01 | 2024-09-06 | 大日本印刷株式会社 | 電子部品加工用粘着テープ |
Families Citing this family (9)
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JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
US8651919B2 (en) * | 2007-08-30 | 2014-02-18 | Denki Kagaku Kogyo Kabushiki Kaisha | Adhesive sheet and process for manufacturing electronic part |
JP2009297734A (ja) * | 2008-06-11 | 2009-12-24 | Nitto Denko Corp | レーザー加工用粘着シート及びレーザー加工方法 |
FR2967365A1 (fr) * | 2010-11-15 | 2012-05-18 | Pascal Lutz | Utilisation d'un film de protection temporaire pour proteger une surface metallique lors de la decoupe par faisceau laser |
JP2012184324A (ja) * | 2011-03-04 | 2012-09-27 | Nitto Denko Corp | 薄膜基板固定用粘接着シート |
JP5996260B2 (ja) * | 2012-05-09 | 2016-09-21 | 株式会社ディスコ | 被加工物の分割方法 |
JP6870974B2 (ja) * | 2016-12-08 | 2021-05-12 | 株式会社ディスコ | 被加工物の分割方法 |
JP6938212B2 (ja) | 2017-05-11 | 2021-09-22 | 株式会社ディスコ | 加工方法 |
TWI805564B (zh) | 2018-01-25 | 2023-06-21 | 晶元光電股份有限公司 | 晶粒轉移方法及其裝置 |
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JP2001316648A (ja) * | 2000-03-30 | 2001-11-16 | Nitto Denko Corp | 水透過性接着テープ |
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WO2001051580A1 (fr) | 2000-01-13 | 2001-07-19 | Nitto Denko Corporation | Feuille adhesive poreuse, plaquette a semi-conducteurs munie de la feuille adhesive poreuse, et procede de fabrication associe |
US6863976B2 (en) * | 2002-11-16 | 2005-03-08 | Milliken & Company | Polypropylene monofilament and tape fibers exhibiting certain creep-strain characteristics and corresponding crystalline configurations |
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- 2007-10-31 US US11/931,124 patent/US20080108262A1/en not_active Abandoned
- 2007-10-31 EP EP20070021321 patent/EP1918343A1/en not_active Withdrawn
- 2007-11-02 TW TW96141441A patent/TW200842031A/zh unknown
- 2007-11-05 KR KR1020070112073A patent/KR20080041123A/ko not_active Application Discontinuation
- 2007-11-06 CN CNA2007101850728A patent/CN101177598A/zh active Pending
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JP2001316648A (ja) * | 2000-03-30 | 2001-11-16 | Nitto Denko Corp | 水透過性接着テープ |
JP2003034780A (ja) * | 2001-04-23 | 2003-02-07 | Furukawa Electric Co Ltd:The | レーザーダイシング用粘着テープ |
JP2005167042A (ja) * | 2003-12-04 | 2005-06-23 | Furukawa Electric Co Ltd:The | 半導体ウェハ固定用粘着テープ |
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JP2008117943A (ja) * | 2006-11-06 | 2008-05-22 | Nitto Denko Corp | ウォータージェットレーザダイシング用粘着シート |
JP2008270504A (ja) * | 2007-04-20 | 2008-11-06 | Nitto Denko Corp | ウォータージェットレーザダイシング用粘着シート |
WO2008133104A1 (ja) * | 2007-04-20 | 2008-11-06 | Nitto Denko Corporation | ウォータージェットレーザダイシング用粘着シート |
WO2024181556A1 (ja) * | 2023-03-01 | 2024-09-06 | 大日本印刷株式会社 | 電子部品加工用粘着テープ |
Also Published As
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EP1918343A1 (en) | 2008-05-07 |
KR20080041123A (ko) | 2008-05-09 |
US20080108262A1 (en) | 2008-05-08 |
CN101177598A (zh) | 2008-05-14 |
TW200842031A (en) | 2008-11-01 |
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