IT1400085B1 - Modulo sensore - Google Patents
Modulo sensoreInfo
- Publication number
- IT1400085B1 IT1400085B1 ITMI2010A000475A ITMI20100475A IT1400085B1 IT 1400085 B1 IT1400085 B1 IT 1400085B1 IT MI2010A000475 A ITMI2010A000475 A IT MI2010A000475A IT MI20100475 A ITMI20100475 A IT MI20100475A IT 1400085 B1 IT1400085 B1 IT 1400085B1
- Authority
- IT
- Italy
- Prior art keywords
- sensor module
- module
- sensor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/10—Elements for damping the movement of parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0242—Gyroscopes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009001930.8A DE102009001930B4 (de) | 2009-03-27 | 2009-03-27 | Sensorbaustein |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20100475A1 ITMI20100475A1 (it) | 2010-09-28 |
IT1400085B1 true IT1400085B1 (it) | 2013-05-17 |
Family
ID=42663851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI2010A000475A IT1400085B1 (it) | 2009-03-27 | 2010-03-23 | Modulo sensore |
Country Status (4)
Country | Link |
---|---|
US (1) | US8584525B2 (it) |
DE (1) | DE102009001930B4 (it) |
FR (1) | FR2943790A1 (it) |
IT (1) | IT1400085B1 (it) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009000574B4 (de) * | 2009-02-03 | 2017-07-27 | Robert Bosch Gmbh | Sensorvorrichtung |
DE102010000848A1 (de) * | 2010-01-13 | 2011-07-14 | Robert Bosch GmbH, 70469 | Trägermaterial mit einer mechanischen Filtereigenschaft und Verfahren zur Herstellung eines Trägermaterials |
DE102011003195B4 (de) | 2011-01-26 | 2019-01-10 | Robert Bosch Gmbh | Bauteil und Verfahren zum Herstellen eines Bauteils |
US9175959B2 (en) | 2011-02-22 | 2015-11-03 | Trw Automotive U.S. Llc | Measuring device mounting method and structure |
DE102011080971A1 (de) | 2011-08-16 | 2013-02-21 | Robert Bosch Gmbh | Sensor, Sensoreinheit und Verfahren zur Herstellung einer Sensoreinheit |
DE102011054231B4 (de) * | 2011-10-06 | 2015-03-26 | Sick Ag | Linearer Wegsensor |
JP5818087B2 (ja) * | 2011-10-31 | 2015-11-18 | 日立工機株式会社 | 電動工具 |
DE102012201486B4 (de) | 2012-02-02 | 2020-08-06 | Robert Bosch Gmbh | Dämpfungsvorrichtung für eine mikromechanische Sensoreinrichtung |
US9227833B2 (en) * | 2012-06-06 | 2016-01-05 | Rosemount Aerospace Inc. | Vibration isolated MEMS structures and methods of manufacture |
DE102012224424A1 (de) * | 2012-12-27 | 2014-07-17 | Robert Bosch Gmbh | Sensorsystem und Abdeckvorrichtung für ein Sensorsystem |
US9250262B1 (en) * | 2013-02-01 | 2016-02-02 | Maxim Integrated Products, Inc. | Method and apparatus for an integrated isolation mechanical filter with substrate based package |
EP2840375A1 (en) * | 2013-08-19 | 2015-02-25 | Sensirion AG | Device with a micro- or nanoscale structure |
EP3367082A1 (en) | 2013-11-06 | 2018-08-29 | Invensense, Inc. | Pressure sensor |
EP2871455B1 (en) | 2013-11-06 | 2020-03-04 | Invensense, Inc. | Pressure sensor |
DE102014105861B4 (de) * | 2014-04-25 | 2015-11-05 | Infineon Technologies Ag | Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung |
EP3076146B1 (en) | 2015-04-02 | 2020-05-06 | Invensense, Inc. | Pressure sensor |
DE102016204914B4 (de) * | 2016-03-24 | 2017-10-19 | Schaeffler Technologies AG & Co. KG | Geberzylinder für ein Kupplungsbetätigungssystem, Kupplungsbetätigungssystem und Sensoraufnahme |
NL2017885B1 (en) * | 2016-11-29 | 2018-06-11 | Sencio B V | Sensor package and method of manufacturing the same |
DE102017206828A1 (de) * | 2017-04-24 | 2018-10-25 | Robert Bosch Gmbh | Mechanischer Dämpfer für einen Stapel von Substraten; Verfahren zur Herstellung eines mechanischen Dämpfers |
US11225409B2 (en) | 2018-09-17 | 2022-01-18 | Invensense, Inc. | Sensor with integrated heater |
US11365990B2 (en) * | 2018-09-25 | 2022-06-21 | Fraba B.V. | Sensor device |
CN111175967A (zh) * | 2018-11-13 | 2020-05-19 | 台达电子工业股份有限公司 | 光学模块 |
EP3969868A1 (en) | 2019-05-17 | 2022-03-23 | InvenSense, Inc. | A pressure sensor with improve hermeticity |
CN112880667B (zh) * | 2019-11-29 | 2023-12-08 | 精工爱普生株式会社 | 传感器单元、电子设备以及移动体 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
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US2260417A (en) * | 1941-10-28 | Treating fatty oils and the like | ||
JPS5945356A (ja) * | 1982-09-08 | 1984-03-14 | Toray Silicone Co Ltd | 導電性シリコ−ンゴム組成物 |
US5174765A (en) * | 1986-05-14 | 1992-12-29 | Barvid Technology Inc. | Electrical connector having electrically conductive elastomer covered by insulating elastomer |
JP2692461B2 (ja) * | 1991-10-26 | 1997-12-17 | 日本電気株式会社 | 半導体装置 |
US5311779A (en) * | 1992-01-03 | 1994-05-17 | Inabagomu Co., Ltd. | Pressure-sensitive sensor |
JPH1197656A (ja) * | 1997-09-22 | 1999-04-09 | Fuji Electric Co Ltd | 半導体光センサデバイス |
DE19854733A1 (de) * | 1998-11-27 | 2000-05-31 | Heidenhain Gmbh Dr Johannes | Abtasteinheit einer Positionsmeßeinrichtung |
DE29903716U1 (de) * | 1999-03-02 | 1999-06-02 | Hahn-Schickard-Gesellschaft für angewandte Forschung e.V., 78052 Villingen-Schwenningen | Mikroventilanordnung |
US6441503B1 (en) * | 2001-01-03 | 2002-08-27 | Amkor Technology, Inc. | Bond wire pressure sensor die package |
TW471143B (en) * | 2001-01-04 | 2002-01-01 | Wen-Wen Chiou | Integrated circuit chip package |
US6617702B2 (en) * | 2001-01-25 | 2003-09-09 | Ibm Corporation | Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate |
IL159728A0 (en) * | 2001-08-24 | 2004-06-20 | Zeiss Stiftung | Method for producing micro-electromechanical components |
US20030176066A1 (en) * | 2001-09-12 | 2003-09-18 | Yu Zhou | Contact structure and production method thereof and probe contact assemly using same |
JP3882738B2 (ja) * | 2002-10-24 | 2007-02-21 | ソニー株式会社 | 複合チップモジュール及びその製造方法、並びに複合チップユニット及びその製造方法 |
JP2006017524A (ja) * | 2004-06-30 | 2006-01-19 | Denso Corp | 角速度センサ |
JP4880218B2 (ja) * | 2004-12-22 | 2012-02-22 | 三洋電機株式会社 | 回路装置 |
JP4581759B2 (ja) * | 2005-03-14 | 2010-11-17 | セイコーエプソン株式会社 | 発光装置、画像形成装置および電子機器 |
DE102005015454B4 (de) * | 2005-04-04 | 2010-02-18 | Infineon Technologies Ag | Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip sowie Verfahren zur Herstellung desselben |
DE102005046008B4 (de) * | 2005-09-26 | 2007-05-24 | Infineon Technologies Ag | Halbleitersensorbauteil mit Sensorchip und Verfahren zur Herstellung desselben |
US20070080458A1 (en) * | 2005-10-11 | 2007-04-12 | Tsuyoshi Ogawa | Hybrid module and method of manufacturing the same |
DE102006011753B4 (de) * | 2006-03-13 | 2021-01-28 | Infineon Technologies Ag | Halbleitersensorbauteil, Verfahren zur Herstellung eines Nutzens und Verfahren zur Herstellung von Halbleitersensorbauteilen |
DE102006026878A1 (de) * | 2006-06-09 | 2007-12-20 | Robert Bosch Gmbh | Premold-Gehäuse mit integrierter Schwingungsisolierung |
JP5166714B2 (ja) * | 2006-09-15 | 2013-03-21 | 東海ゴム工業株式会社 | センサー用架橋エラストマー体およびその製法 |
DE102006056361B4 (de) * | 2006-11-29 | 2012-08-16 | Infineon Technologies Ag | Modul mit polymerhaltigem elektrischen Verbindungselement und Verfahren |
US8059443B2 (en) * | 2007-10-23 | 2011-11-15 | Hewlett-Packard Development Company, L.P. | Three-dimensional memory module architectures |
US8064739B2 (en) * | 2007-10-23 | 2011-11-22 | Hewlett-Packard Development Company, L.P. | Three-dimensional die stacks with inter-device and intra-device optical interconnect |
JP2010211179A (ja) * | 2009-02-13 | 2010-09-24 | Hitachi Ltd | 光電気複合配線モジュールおよびその製造方法 |
-
2009
- 2009-03-27 DE DE102009001930.8A patent/DE102009001930B4/de active Active
-
2010
- 2010-02-18 US US12/707,896 patent/US8584525B2/en active Active
- 2010-03-23 FR FR1052059A patent/FR2943790A1/fr active Pending
- 2010-03-23 IT ITMI2010A000475A patent/IT1400085B1/it active
Also Published As
Publication number | Publication date |
---|---|
ITMI20100475A1 (it) | 2010-09-28 |
US20100242605A1 (en) | 2010-09-30 |
DE102009001930A1 (de) | 2010-09-30 |
DE102009001930B4 (de) | 2018-01-04 |
US8584525B2 (en) | 2013-11-19 |
FR2943790A1 (fr) | 2010-10-01 |
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