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GB2068834A - Coating vitreous or ceramic supports - Google Patents

Coating vitreous or ceramic supports Download PDF

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Publication number
GB2068834A
GB2068834A GB8002556A GB8002556A GB2068834A GB 2068834 A GB2068834 A GB 2068834A GB 8002556 A GB8002556 A GB 8002556A GB 8002556 A GB8002556 A GB 8002556A GB 2068834 A GB2068834 A GB 2068834A
Authority
GB
United Kingdom
Prior art keywords
coating
metal
substrate
masking
masking material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8002556A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BFG Glassgroup GIE
Original Assignee
BFG Glassgroup GIE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BFG Glassgroup GIE filed Critical BFG Glassgroup GIE
Priority to GB8002556A priority Critical patent/GB2068834A/en
Publication of GB2068834A publication Critical patent/GB2068834A/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/26Printing on other surfaces than ordinary paper
    • B41M1/34Printing on other surfaces than ordinary paper on glass or ceramic surfaces

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A method of providing a vitreous or ceramic support (3) with a metal or metal compound (e.g. metal oxide) coating (6) in a pattern comprises the following steps: applying a masking material to the substrate in a negative pattern through a stencil, the applied masking material being such that when baked it leaves a dry masking deposit (5) which adheres to the substrate and is mechanically removable, baking the substrate (3) and applied masking material and applying an overall coating (6) of said metal or metal compound, and then mechanically removing the masking deposit (5) and overlying metal or metal compound (6) to leave a positive patterned coating of said metal or metal compound on the substrate (3). <IMAGE>

Description

SPECIFICATION Coating vitreous or ceramic supports The present invention relates to a method of providing a vitreous or ceramic support with a metal or metal compound coating over one or more predetermined regions to form a positive pattern on the substrate while the remaining region or regions of the substrate is or are uncoated by said coating in a negative pattern in the finished article.
Such coated articles have many uses, depending on the type of coating applied to the substrate. Where the coating is electrically conductive, the article may be constituted as for example a printed circuit board, a switching panel or part of a display device such as a gas discharge display, a vacuum fluorescent or liquid crystal display, an electromagnetic or electrophoretic display, an electromagnetic or photoconductor-controlled display. Coatings may also be applied as anti-sputter coatings in various kinds of articles, and for other purposes, including functional and decorative purposes.
One method of applying a coating according to a predetermined pattern is described in French Patent No. 1,454,611 (Associated Electrical Industries Limited). According to that patent, a substrate is given an overall coating of lead sulphide (PbS) which is in turn covered with a photo-resist material. The photo-resist is exposed through a diapositive which bears an opaque image corresponding to the required predetermined coating pattern.
The photo-resist is developed and the unexposed regions of the photo-resist and underlying regions of the lead sulphide coating are etched away with hyrochloric acid. The photoresist remaining on the substrate is then dissolved e.g. using toluene to leave a lead sulphide mask over only those areas which it is desired not to coat. The substrate and its thus formed mask are then given an overall coating of the desired material, e.g. a nickel chromium alloy in any suitable way, for example by a vacuum evaporation technique, and the lead sulphide mask and overcoated Ni-Cr overcoating are then removed by etching e.g.
with nitric acid, to leave the desired predetermined coating pattern of nickel chromium alloy on the substrate.
This is a rather complicated and lengthy process, and it is an object of the present invention to provide a simpler coating method.
According to the present invention, there is provided a method of providing a vitreous or ceramic support with a metal or metal compound e.g. metal oxide coating over one or more predetermined regions to form a positive pattern on the substrate while the remaining region or regions of the substrate is or are uncoated by said coating in a negative pattern in the finished article, characterised by the steps of:: applying a masking material to the substrate in such negative pattern through a stencil, the applied masking material being such that when baked it leaves a dry masking deposit which adheres to the substrate and is mechanically removable, baking the substrate and applied masking material and applying an overall coating of said metal or metal compound, and then mechanically removing the masking deposit and overcoated metal or metal compound to leave a positive patterned coating of said metal or metal compound on the substrate.
A patterned coating can be applied very simply by a method according to the invention, and such method lends itself very well to series production of coated vitreous and ceramic articles.
The expression "vitreous" used herein denotes glass and vitrocrystalline material i.e.
partially devitrified glass. "Ceramics" includes vitroceramics i.e. partially vitrified ceramics.
The baking may take place before, after, or even during the application of the coating.
The invention is especially applicable to the provision of thin coatings, for example coatings less than 1#m thick, and even coatings less than 200 nm thick.
After coating, said masking deposit may be removed in any desired mechanical way, for example by scraping, rubbing or brushing, but it is preferable for the masking deposit to be removed by ultra-sonically vibrating the substrate so as to reduce or eliminate the risk of marring the remainder of the coating.
Preferably, said masking material is applied serigraphically, since this generally allows a more precise definition of the predetermined pattern.
Advantageously, said masking material is a silk screen resist ink. Many such inks are widely available commercially, and when baked form a powdery deposit which adheres to the substrate sufficiently well to mask underlying substrate regions during coating.
Among such inks which may be used when performing the present invention are those available from Wiederhold under their trade name WIEDOPRINT, especially their etching resist inks designated -AL, -AL/HV and AL/25673, those available under the trade name WIEDOPRINT, especially their etching resist inks designated -AL, -AL/HV and -AL/25673, those available under the trade name SERICROM especially the acid resist ink sist alkali soluble".
Preferably, said masking material is baked before the application of said metal or metal oxide coating. This avoids any risk of the metal or metal oxide coating being damaged during baking.
In some preferred embodiments of the invention, said coating is applied by sputtering.
Conductive coating materials can readily be applied by low frequency sputtering techniques, and conductive and non-conductive coating materials can easily be applied by high (radio) frequency sputtering. D.C. sputtering techniques may also be used.
In other preferred embodiments in which the coating is an oxide coating, it is applied by pyrolysis. In such embodiments, in which the substrate must be heated for coating deposition, it is desirable to use such heating stage to bake the masking material before coating takes place.
Among oxide coatings which may be applied in accordance with the invention, specially preference is given to oxides selected from: indium oxide, tin oxide, zirconium oxide and titanium oxide.
In yet other preferred embodiments of the invention, the coating is applied by vacuum evaporation. This technique is especially suitable for depositing metal coatings, for example coatings of gold, platinum and palladium, which are preferred for their electrical conductivity and resistance to corrosion.
Preferred embodiments of the invention will now be described by way of example and with reference to the accompanying diagrammatic drawings of which: Figure 1 is a cross sectional view of a vitreous or ceramic support to which a mask has been applied in a predetermined negative pattern; Figure 2 is a corresponding view of the masked support on which an overall metal or metal compound coating has been deposited, and Figure 3 is a corresponding view of the support after the mask and overcoated metal or metal oxide coating has been removed to leave a positive patterned coating.
With reference to the drawings: it is desired to coat, with a metal or metal compound, a number of regions 1 forming a positive pattern on a substrate constituted by the upper surface 2 of a vitreous or ceramic support 3.
In accordance with the invention, a masking material 4 (Fig. 1) is stencilled onto the substrate 2 in a negative pattern, leaving the regions 1 of the positive pattern unmasked.
The masking material 4 is most preferably applied serigraphically. After the masking material is applied, it and the support 3 are baked so that the masking material forms a dry masking deposit 5 which can be removed by brushing or by ultra-sonic vibration. After such baking, the masked substrate is given an overall coating 6 of the desired metal or metal compound, by any desired method, such as by cathode sputtering, pyrolysis or vacuum evaporation (Fig. 2). The masking deposit 5 and overlying regions of the coating 6 are then removed mechanically, e.g. by brushing, but preferably by ultra-sonic vibration, to leave the metal or metal oxide coating 6 confined to the predetermined regions 1 of the upper surface 2 of the support 3 as shown in Fig. 3.
Example 1 It is desired to deposit a positively patterned coating of In203 onto glass sheets, the In203 coating constituting electrodes and conductors of display elements. To this end, a silk-screen stencil is prepared and used to print onto the glass sheets Wiederhold's WIEDOPRINT AL/HV (Trade Mark) ink in a negative masking pattern. The glass sheets are then baked at $OO"C. for 20 minutes to reduce the masking ink to a dry#powdery residue which adheres lightly to the sheets and sufficiently for the sheets to be handled. The sheets are allowed to cool, and their masked faces are then given an overall coating of In203 by a radio4requency cathode sputtering technique well known in the art. The In203 coatings are deposited to a thickness of 400 nm.The coated sheets are then ultrasonically vibrated at a frequency of about 20 KHz for five minutes to dislodge the masking residue and overlying portions of the In203 coating to leave positively patterned conductive coatings of ln203.
In a variant of this Example, the masking residue is simply wiped off.
Example 2 It is desired to deposit a plurality of SnO2 electrodes in capacitive relation on opposite sides of ceramic sheets to form capacitive touch control switch panels. Two silk-screen stencils are prepared, and using one of them, a negative masking pattern of Wiederhold's WIEDOPRINT AL (Trade Mark) ink is printed on one side of each ceramic sheet. The sheets are then conveyed through a heating station, in which the masking ink is baked to leave a dry powdery adherent masking residue, and thence to a coating station where they are sprayed with a solution of SnCI4 in known manner. When the SnCI4 solution contacts the heated sheets it is pyrolised to give a uniform overall coating of SnO2 80 nm thick. After cooling, the masking residue and overlying regions of SnO2 are removed by brushing to leave a positive patterned SnO2 coating on one side of each sheet. The process is then repeated using the other silk-screen stencil to provide a positive patterned SnO2 coating on the other side of each ceramic sheet.
In a variant of this Example, both sides of each sheet are masked and the sheets are then baked, and SnO2 coatings are formed on both sides of the sheets in a single stage of the process by a high frequency cathode sputtering technique.
Example 3 It is desired to provide a pre-coated vitreous sheet for use in a gas discharge display device with an anti-sputtering coating of ZrO2 arranged in a predetermined positive pattern. A stencil is prepared and a negative patterned mask of SERICROM (Trade Mark) 7001 Acid resist ink is printed onto the substrate constituted by the pre-coated vitreous sheet. The sheet is then baked to dry the masking ink, and a coating of ZrO2 is applied to a thickness of 100 nm uniformly over the masked substrate by high frequency cathode sputtering.
The dry masking deposit and overlying regions of ZrO2 are then removed by ultra-sonic vibration of the sheet.
In a variant of this Example, the anti-sputtering coating is of TiO2.
Example 4 In order to produce a microcircuitry component comprising a positive pattern of metal conductor elements on a vitreous support, the support is serigraphically provided with a negative masking deposit of Nazdar (Europe)'s black alkali soluble ink resist No. 226 which is then baked to leave a dry powdery deposit.
The masked substrate is then coated by a vacuum evaporation technique with the desired metal e.g. gold to the desired thickness e.g. 20 nm. The masking deposit and overlying metal coating are then removed ultrasonically to leave a positive pattened conductive coating.
In variants of this Example, the substrate is plated with platinum or palladium instead of gold.

Claims (13)

1. A method of providing a vitreous or ceramic support with a metal or metal compound coating over one or more predetermined regions to form a positive pattern on the substrate while the remaining region or regions of the substrate is or are uncoated by said coating in a negative pattern in the finished article, characterised by the steps of: applying a masking material to the substrate in such negative pattern through a stencil, the applied masking material being such that when baked it leaves a dry masking deposit which adheres to the substrate and is removable mechanically, baking the substrate and applied masking material and applying an overall coating of said metal or metal compound and then mechanically removing the masking deposit and overcoated metal or metal patterned coating of said metal or metal oxide on the substrate.
2. A method according to Claim 1, characterised in that said coating is applied to a thickness of less than 1,us.
3. A method according to Claims 1 or 2, characterised in that said masking deposit is removed by ultra-sonically vibrating the substrate.
4. A method according to any preceding claim, characterised in that said masking material is applied serigraphically.
5. A method according to any preceding claim, characterised in that said masking material is a silk-screen resist ink.
6. A method according to any preceding claim, characterised in that said masking material is baked before the application of said metal or metal
7. A method according to any preceding claim, characterised in that said coating is applied by sputtering.
8. A method according to Claim 6, characterised in that said coating is an oxide coating and is applied by pyrolysis.
9. A method according to any preceding claim, characterised in that said coating is an oxide coating selected from: indium oxide, tin oxide, zirconium oxide and titanium oxide.
10. A method according to any of Claims 1 to 6, characterised in that said coating is applied by vacuum evaporation.
11. A method according to Claims 7 or 10, characterised in that said coating is a metal coating selected from gold, platinum and palladium.
CLAIMS (12 Nov 1980)
1. A method of providing a vitreous or ceramic support with a metal or metal compound coating over one or more predetermined regions to form a positive pattern on the substrate while the remaining region or regions of the substrate is or are uncoated by said coating in a negative pattern in the finished article, characterised by the steps of: : applying a masking material to the substrate in such negative pattern through a stencil, the applied masking material being such that when baked it leaves a dry masking deposit which adheres to the substrate and is removable mechanically, baking the substrate and applied masking material and applying an overall coating of said metal or metal compound and then mechanically removing the masking deposit and overcoated metal or metal compound to leave a positive patterned coating of said metal or metal compound on the substrate.
6. A method according to any preceding claim, characterised in that said masking material is baked before the application of said metal or metal oxide.
12. A method according to Claim 1 and substantially as herein described.
13. A vitreous or ceramic support coated by a method according to any preceding claim.
GB8002556A 1980-01-25 1980-01-25 Coating vitreous or ceramic supports Withdrawn GB2068834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8002556A GB2068834A (en) 1980-01-25 1980-01-25 Coating vitreous or ceramic supports

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8002556A GB2068834A (en) 1980-01-25 1980-01-25 Coating vitreous or ceramic supports

Publications (1)

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GB2068834A true GB2068834A (en) 1981-08-19

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GB8002556A Withdrawn GB2068834A (en) 1980-01-25 1980-01-25 Coating vitreous or ceramic supports

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059454A (en) * 1989-04-26 1991-10-22 Flex Products, Inc. Method for making patterned thin film
EP0594932A1 (en) * 1992-10-27 1994-05-04 Matsushita Electric Industrial Co., Ltd. Method for forming patterned transparent conducting film
EP0785085A1 (en) * 1996-01-19 1997-07-23 Saint-Gobain Vitrage Process for printing on glass and window obtained thereby
CN104333981A (en) * 2014-10-16 2015-02-04 惠州智科实业有限公司 Manufacturing method of LED heat radiating substrate and LED module with substrate
CN110098101A (en) * 2018-01-30 2019-08-06 朗姆研究公司 The method on the surface that selectivity patterning applies for plasma resistant ceramic coating

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059454A (en) * 1989-04-26 1991-10-22 Flex Products, Inc. Method for making patterned thin film
US5368902A (en) * 1989-04-26 1994-11-29 Flex Products, Inc. Method for making patterned thin film
EP0594932A1 (en) * 1992-10-27 1994-05-04 Matsushita Electric Industrial Co., Ltd. Method for forming patterned transparent conducting film
US5403616A (en) * 1992-10-27 1995-04-04 Matsushita Electric Industrial Co., Ltd. Method for forming patterned transparent conducting film
EP0785085A1 (en) * 1996-01-19 1997-07-23 Saint-Gobain Vitrage Process for printing on glass and window obtained thereby
FR2743753A1 (en) * 1996-01-19 1997-07-25 Saint Gobain Vitrage METHOD OF PRINTING ON A GLAZING AND GLAZING OBTAINED
CN104333981A (en) * 2014-10-16 2015-02-04 惠州智科实业有限公司 Manufacturing method of LED heat radiating substrate and LED module with substrate
CN110098101A (en) * 2018-01-30 2019-08-06 朗姆研究公司 The method on the surface that selectivity patterning applies for plasma resistant ceramic coating
JP2019131888A (en) * 2018-01-30 2019-08-08 ラム リサーチ コーポレーションLam Research Corporation Method for selectively patterning surface for plasma resistance film coating
US11124659B2 (en) * 2018-01-30 2021-09-21 Lam Research Corporation Method to selectively pattern a surface for plasma resistant coat applications
TWI818950B (en) * 2018-01-30 2023-10-21 美商蘭姆研究公司 Method to selectively pattern a surface for plasma resistant coat applications

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