ES2100513T3 - Composiciones fotosensibles. - Google Patents
Composiciones fotosensibles.Info
- Publication number
- ES2100513T3 ES2100513T3 ES93810862T ES93810862T ES2100513T3 ES 2100513 T3 ES2100513 T3 ES 2100513T3 ES 93810862 T ES93810862 T ES 93810862T ES 93810862 T ES93810862 T ES 93810862T ES 2100513 T3 ES2100513 T3 ES 2100513T3
- Authority
- ES
- Spain
- Prior art keywords
- weight
- meth
- acrylate
- liquid
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Materials For Photolithography (AREA)
Abstract
LA INVENCION SE REFIERE A UNA COMPOSICION FOTOSENSIBLE CONTENIENDO A) 40 A 80% EN PESO POR LOS MENOS DE UNA RESINA EPOXI FLUIDA CON UNA FUNCIONALIDAD EPOXIDO MAYOR O IGUAL A 2: B) 0,1 A 10% EN PESO POR LO MENOS DE UN FOTOINICIADOR CATIONICO PARA EL COMPONENTE A); C) 5 A 40% EN PESO POR LO MENOS DE UN DIACRILATO CICLOALIFATICO O AROMATICO; D) 0 A 15% EN PESO POR LO MENOS DE UN POLIMETACRILATO FLUIDO CON UNA FUNCIONALIDAD METACRILATO MAYOR QUE 2, POR LO QUE EL CONTENIDO EN METACRILATO ASCIENDE A LO SUMO AL 50% EN PESO; E) 0,1 A 10% EN PESO POR LOS MENOS DE UN FOTOINICADOR RADICAL PARA EL COMPONENTE C Y EN CASO DADO D Y F) 5 A 40% EN PESO POR LO MENOS DE UN POLIETER, POLIESTER O POLIURETANO TERMINADO EN OH QUE SON APROPIADOS PARA LA PRODUCCION DE CAPAS FOTOPOLIMERIZADAS, PARTICULARMENTE OBJETOS TRIDIMENSIONALES.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH390692 | 1992-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2100513T3 true ES2100513T3 (es) | 1997-06-16 |
Family
ID=4266050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES93810862T Expired - Lifetime ES2100513T3 (es) | 1992-12-21 | 1993-12-09 | Composiciones fotosensibles. |
Country Status (10)
Country | Link |
---|---|
US (1) | US5476748A (es) |
EP (1) | EP0605361B1 (es) |
JP (1) | JP3203461B2 (es) |
KR (1) | KR100282273B1 (es) |
AT (1) | ATE151085T1 (es) |
AU (1) | AU658780B2 (es) |
CA (1) | CA2111718C (es) |
DE (1) | DE59306034D1 (es) |
ES (1) | ES2100513T3 (es) |
TW (1) | TW269017B (es) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018178423A2 (es) | 2017-03-31 | 2018-10-04 | Centro Tecnologico De Nanomateriales Avanzados, S.L. | Composición de resina curable por radiación y procedimiento para su obtención |
Families Citing this family (103)
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---|---|---|---|---|
JPH01187424A (ja) * | 1988-01-22 | 1989-07-26 | Toshiba Corp | トルクセンサ |
TW311923B (es) * | 1992-01-27 | 1997-08-01 | Ciba Sc Holding Ag | |
JPH07291673A (ja) * | 1994-04-28 | 1995-11-07 | Kobe Steel Ltd | 可撓性を有する光ファイバーケーブル用複合強化材 |
JP3475528B2 (ja) * | 1994-11-18 | 2003-12-08 | 東洋インキ製造株式会社 | 紫外線硬化型樹脂組成物およびこれを含む被覆剤 |
JP3117394B2 (ja) * | 1994-11-29 | 2000-12-11 | 帝人製機株式会社 | 光学的立体造形用樹脂組成物 |
RU2131624C1 (ru) * | 1994-12-09 | 1999-06-10 | Сименс АГ | Элемент на поверхностных акустических волнах и способ изготовления демпфирующей структуры для него |
TW418215B (en) | 1995-03-13 | 2001-01-11 | Ciba Sc Holding Ag | A process for the production of three-dimensional articles in a stereolithography bath comprising the step of sequentially irradiating a plurality of layers of a liquid radiation-curable composition |
US5639413A (en) * | 1995-03-30 | 1997-06-17 | Crivello; James Vincent | Methods and compositions related to stereolithography |
EP0831127B1 (en) * | 1995-05-12 | 2003-09-03 | Asahi Denka Kogyo Kabushiki Kaisha | Stereolithographic resin composition and stereolithographic method |
US5707780A (en) * | 1995-06-07 | 1998-01-13 | E. I. Du Pont De Nemours And Company | Photohardenable epoxy composition |
DE19630705A1 (de) | 1995-08-30 | 1997-03-20 | Deutsche Telekom Ag | Verfahren zur Herstellung von 3-dimensional strukturierten Polymerschichten für die integrierte Optik |
DE19534594B4 (de) * | 1995-09-19 | 2007-07-26 | Delo Industrieklebstoffe Gmbh & Co. Kg | Kationisch härtende, flexible Epoxidharzmassen und ihre Verwendung zum Auftragen dünner Schichten |
DE19534664A1 (de) * | 1995-09-19 | 1997-03-20 | Thera Ges Fuer Patente | Lichtinitiiert kationisch härtende, dauerflexible Epoxidharzmasse und ihre Verwendung |
DE19534668A1 (de) * | 1995-09-19 | 1997-03-20 | Thera Ges Fuer Patente | Kettenverlängerte Epoxidharze enthaltende, vorwiegend kationisch härtende Masse |
DE19541075C1 (de) * | 1995-11-03 | 1997-04-24 | Siemens Ag | Photohärtbares Harz mit geringem Schwund und dessen Verwendung in einem Stereolithographieverfahren |
JP3626275B2 (ja) * | 1996-04-09 | 2005-03-02 | Jsr株式会社 | 光硬化性樹脂組成物 |
WO1997042549A1 (en) * | 1996-05-09 | 1997-11-13 | Dsm N.V. | Photosensitive resin composition for rapid prototyping and a process for the manufacture of 3-dimensional objects |
KR100491736B1 (ko) * | 1996-07-29 | 2005-09-09 | 반티코 아게 | 입체리토그래피용방사선-경화성액체조성물 |
JP3825506B2 (ja) * | 1996-09-02 | 2006-09-27 | Jsr株式会社 | 液状硬化性樹脂組成物 |
US5766277A (en) * | 1996-09-20 | 1998-06-16 | Minnesota Mining And Manufacturing Company | Coated abrasive article and method of making same |
JP3724893B2 (ja) * | 1996-09-25 | 2005-12-07 | ナブテスコ株式会社 | 光学的立体造形用樹脂組成物 |
JP3786480B2 (ja) * | 1996-10-14 | 2006-06-14 | Jsr株式会社 | 光硬化性樹脂組成物 |
JP3844824B2 (ja) * | 1996-11-26 | 2006-11-15 | 株式会社Adeka | エネルギー線硬化性エポキシ樹脂組成物、光学的立体造形用樹脂組成物及び光学的立体造形方法 |
JP3626302B2 (ja) * | 1996-12-10 | 2005-03-09 | Jsr株式会社 | 光硬化性樹脂組成物 |
JP3650238B2 (ja) * | 1996-12-10 | 2005-05-18 | Jsr株式会社 | 光硬化性樹脂組成物 |
JP3765896B2 (ja) | 1996-12-13 | 2006-04-12 | Jsr株式会社 | 光学的立体造形用光硬化性樹脂組成物 |
FR2757530A1 (fr) * | 1996-12-24 | 1998-06-26 | Rhodia Chimie Sa | Utilisation pour la stereophotolithographie - d'une composition liquide photoreticulable par voie cationique comprenant un photoamorceur du type sels d'onium ou de complexes organometalliques |
US6054250A (en) * | 1997-02-18 | 2000-04-25 | Alliedsignal Inc. | High temperature performance polymers for stereolithography |
WO1998036323A1 (en) * | 1997-02-14 | 1998-08-20 | Alliedsignal Inc. | High temperature performance polymers for stereolithography |
EP0887706A1 (en) | 1997-06-25 | 1998-12-30 | Wako Pure Chemical Industries Ltd | Resist composition containing specific cross-linking agent |
DE59802943D1 (de) * | 1997-06-30 | 2002-03-14 | Siemens Ag | Reaktionsharzmischungen und deren Verwendung |
US6287745B1 (en) | 1998-02-18 | 2001-09-11 | Dsm N.V. | Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound |
US6472129B2 (en) * | 1998-03-10 | 2002-10-29 | Canon Kabushiki Kaisha | Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus making use of the same |
US6344526B1 (en) * | 1998-03-10 | 2002-02-05 | Canon Kabushiki Kaisha | Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus using same |
US6448346B1 (en) * | 1998-03-10 | 2002-09-10 | Canon Kabushiki Kaisha | Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus making use of the same |
US6136497A (en) | 1998-03-30 | 2000-10-24 | Vantico, Inc. | Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography |
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KR102604506B1 (ko) | 2017-06-12 | 2023-11-21 | 오르멧 서키츠 인코퍼레이티드 | 양호한 사용가능 시간 및 열전도성을 갖는 금속성 접착제 조성물, 이의 제조 방법 및 이의 용도 |
JP6886588B2 (ja) * | 2017-08-30 | 2021-06-16 | Dic株式会社 | エポキシ樹脂改質剤 |
WO2019169211A1 (en) * | 2018-03-02 | 2019-09-06 | Formlabs, Inc. | Latent cure resins and related methods |
EP3597668A1 (en) | 2018-07-20 | 2020-01-22 | Clariant International Ltd | Photo-curable resin composition for 3d printing |
CN109897189B (zh) * | 2019-02-27 | 2021-05-25 | 黑龙江省科学院石油化学研究院 | 一种原位接枝氧化石墨烯改性耐高温环氧树脂复合材料的制备方法 |
CN111072871A (zh) * | 2019-12-24 | 2020-04-28 | 无锡市腰果新材料有限公司 | 一种耐高温sla型3d打印光固化材料及其制备方法 |
RU2757595C1 (ru) * | 2020-08-31 | 2021-10-19 | Федеральное государственное бюджетное образовательное учреждение высшего образования «Кабардино-Балкарский государственный университет им. Х.М. Бербекова» (КБГУ) | Полимерный композиционный материал |
EP4228897A1 (en) | 2020-10-13 | 2023-08-23 | Cabot Corporation | Conductive photo-curable compositions for additive manufacturing |
US20240150518A1 (en) | 2021-02-25 | 2024-05-09 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | One Component Polymerizable Composition for Trickle Impregnation |
CN115947658A (zh) * | 2022-12-28 | 2023-04-11 | Tcl华星光电技术有限公司 | 配向膜添加剂、配向膜、液晶显示面板及其制作方法 |
WO2024203363A1 (ja) * | 2023-03-24 | 2024-10-03 | 株式会社Adeka | 抗菌性組成物、形成用材料、硬化物及び抗菌方法 |
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CH490444A (de) * | 1967-04-19 | 1970-05-15 | Ciba Geigy | Neue, heisshärtbare Mischungen aus Polyepoxydverbindungen, Polyestern und Polycarbonsäureanhydriden |
CA1240439A (en) * | 1983-02-07 | 1988-08-09 | Union Carbide Corporation | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials having primary hydroxyl content |
WO1985001947A1 (en) * | 1983-10-28 | 1985-05-09 | Loctite Corporation | Photocurable (meth)acrylate and cationic monomers or prepolymers |
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ES2016087B3 (es) * | 1985-11-07 | 1990-10-16 | Uvexs Incorporated | Composicion polimerica curable mediante la exposicion a la luz ultravioleta. |
CA1330464C (en) * | 1987-12-08 | 1994-06-28 | Mitsui Petrochemical Industries, Ltd. | Active energy ray-curable composition and optical recording medium having cured product of the composition |
WO1989007620A1 (en) * | 1988-02-19 | 1989-08-24 | Asahi Denka Kogyo K.K. | Resin composition for optical modeling |
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TW363999B (en) * | 1991-06-04 | 1999-07-11 | Vantico Ag | Photosensitive compositions |
-
1993
- 1993-11-29 TW TW082110041A patent/TW269017B/zh not_active IP Right Cessation
- 1993-12-09 DE DE59306034T patent/DE59306034D1/de not_active Expired - Lifetime
- 1993-12-09 EP EP93810862A patent/EP0605361B1/de not_active Expired - Lifetime
- 1993-12-09 AT AT93810862T patent/ATE151085T1/de active
- 1993-12-09 ES ES93810862T patent/ES2100513T3/es not_active Expired - Lifetime
- 1993-12-14 US US08/166,767 patent/US5476748A/en not_active Expired - Lifetime
- 1993-12-17 KR KR1019930028653A patent/KR100282273B1/ko not_active IP Right Cessation
- 1993-12-17 CA CA002111718A patent/CA2111718C/en not_active Expired - Lifetime
- 1993-12-20 AU AU52524/93A patent/AU658780B2/en not_active Expired
- 1993-12-21 JP JP34518293A patent/JP3203461B2/ja not_active Expired - Fee Related
Cited By (1)
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WO2018178423A2 (es) | 2017-03-31 | 2018-10-04 | Centro Tecnologico De Nanomateriales Avanzados, S.L. | Composición de resina curable por radiación y procedimiento para su obtención |
Also Published As
Publication number | Publication date |
---|---|
EP0605361B1 (de) | 1997-04-02 |
TW269017B (es) | 1996-01-21 |
JP3203461B2 (ja) | 2001-08-27 |
EP0605361A3 (de) | 1995-02-22 |
ATE151085T1 (de) | 1997-04-15 |
KR100282273B1 (ko) | 2001-03-02 |
AU5252493A (en) | 1994-06-30 |
AU658780B2 (en) | 1995-04-27 |
CA2111718A1 (en) | 1994-06-22 |
EP0605361A2 (de) | 1994-07-06 |
US5476748A (en) | 1995-12-19 |
JPH06228413A (ja) | 1994-08-16 |
DE59306034D1 (de) | 1997-05-07 |
KR940015712A (ko) | 1994-07-21 |
CA2111718C (en) | 2004-10-05 |
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