PL1727663T3 - Kompozycje fotoutwardzalne - Google Patents
Kompozycje fotoutwardzalneInfo
- Publication number
- PL1727663T3 PL1727663T3 PL05729543T PL05729543T PL1727663T3 PL 1727663 T3 PL1727663 T3 PL 1727663T3 PL 05729543 T PL05729543 T PL 05729543T PL 05729543 T PL05729543 T PL 05729543T PL 1727663 T3 PL1727663 T3 PL 1727663T3
- Authority
- PL
- Poland
- Prior art keywords
- composition
- radiation
- component
- photocurable
- cured
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 9
- 230000005855 radiation Effects 0.000 abstract 5
- 238000001723 curing Methods 0.000 abstract 2
- 230000001427 coherent effect Effects 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 238000000016 photochemical curing Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2033/00—Use of polymers of unsaturated acids or derivatives thereof as moulding material
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Mechanical Engineering (AREA)
- Polymerisation Methods In General (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04251653 | 2004-03-22 | ||
| PCT/EP2005/051287 WO2005092598A1 (en) | 2004-03-22 | 2005-03-21 | Photocurable compositions |
| EP05729543A EP1727663B1 (en) | 2004-03-22 | 2005-03-21 | Photocurable compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL1727663T3 true PL1727663T3 (pl) | 2012-04-30 |
Family
ID=34930235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL05729543T PL1727663T3 (pl) | 2004-03-22 | 2005-03-21 | Kompozycje fotoutwardzalne |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US8097399B2 (pl) |
| EP (1) | EP1727663B1 (pl) |
| JP (1) | JP4776616B2 (pl) |
| KR (2) | KR20070005638A (pl) |
| CN (1) | CN100581792C (pl) |
| AT (1) | ATE527099T1 (pl) |
| CA (1) | CA2557226A1 (pl) |
| ES (1) | ES2374823T3 (pl) |
| PL (1) | PL1727663T3 (pl) |
| TW (1) | TWI406086B (pl) |
| WO (1) | WO2005092598A1 (pl) |
Families Citing this family (60)
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| CN100340388C (zh) * | 2006-03-03 | 2007-10-03 | 南京师范大学 | 制作三维物体和支撑的打印成型方法 |
| US20080103226A1 (en) * | 2006-10-31 | 2008-05-01 | Dsm Ip Assets B.V. | Photo-curable resin composition |
| US8236476B2 (en) | 2008-01-08 | 2012-08-07 | International Business Machines Corporation | Multiple exposure photolithography methods and photoresist compositions |
| WO2010043274A1 (en) * | 2008-10-17 | 2010-04-22 | Huntsman Advanced Materials (Switzerland) Gmbh | Improvements for rapid prototyping apparatus |
| TW201031737A (en) * | 2009-02-03 | 2010-09-01 | Henkel Corp | Encapsulant for inkjet print head |
| KR101995185B1 (ko) * | 2009-12-17 | 2019-07-01 | 디에스엠 아이피 어셋츠 비.브이. | 트라이아릴 설포늄 보레이트 양이온 광개시제를 포함하는 적층식 제작을 위한 액체 방사선 경화성 수지 |
| JP5774825B2 (ja) | 2010-08-19 | 2015-09-09 | ソニー株式会社 | ３次元造形装置及び造形物の製造方法 |
| EP2436510A1 (en) | 2010-10-04 | 2012-04-04 | 3D Systems, Inc. | System and resin for rapid prototyping |
| CN104487221B (zh) * | 2012-03-01 | 2017-09-26 | 纳斯达克有限公司 | 阳离子可聚合组合物及其使用方法 |
| EP3044274A1 (en) * | 2013-09-13 | 2016-07-20 | Basf Se | Scratch-resistant radiation-cured coatings |
| WO2015165363A1 (zh) * | 2014-04-30 | 2015-11-05 | 中国科学院化学研究所 | 一种用于3d打印的材料及其制备方法和制品 |
| CN107077064B (zh) | 2014-06-23 | 2021-06-04 | 卡本有限公司 | 用于制备三维物体的具有多重硬化机制的聚氨酯树脂 |
| US10273327B2 (en) | 2014-09-03 | 2019-04-30 | University Of Washington | Metathesis polymerization methods |
| JP6568218B2 (ja) | 2014-12-23 | 2019-08-28 | ブリヂストン アメリカズ タイヤ オペレーションズ、 エルエルシー | 化学線硬化型高分子混合物、硬化高分子混合物、及び関連するプロセス |
| US10792855B2 (en) | 2015-02-05 | 2020-10-06 | Carbon, Inc. | Method of additive manufacturing by intermittent exposure |
| US10391711B2 (en) | 2015-03-05 | 2019-08-27 | Carbon, Inc. | Fabrication of three dimensional objects with multiple operating modes |
| JP7069006B2 (ja) | 2015-09-04 | 2022-05-17 | カーボン，インコーポレイテッド | 積層造形用シアネートエステル二重硬化樹脂 |
| WO2017044381A1 (en) | 2015-09-09 | 2017-03-16 | Carbon3D, Inc. | Epoxy dual cure resins for additive manufacturing |
| US10647873B2 (en) | 2015-10-30 | 2020-05-12 | Carbon, Inc. | Dual cure article of manufacture with portions of differing solubility |
| WO2017078193A1 (ko) * | 2015-11-04 | 2017-05-11 | (주) 개마텍 | 광경화 코팅용 조성물 및 코팅막 |
| US11891485B2 (en) | 2015-11-05 | 2024-02-06 | Carbon, Inc. | Silicone dual cure resins for additive manufacturing |
| US11097531B2 (en) | 2015-12-17 | 2021-08-24 | Bridgestone Americas Tire Operations, Llc | Additive manufacturing cartridges and processes for producing cured polymeric products by additive manufacturing |
| WO2017112483A2 (en) | 2015-12-22 | 2017-06-29 | Carbon, Inc. | Accelerants for additive manufacturing with dual cure resins |
| US10787583B2 (en) | 2015-12-22 | 2020-09-29 | Carbon, Inc. | Method of forming a three-dimensional object comprised of a silicone polymer or co-polymer |
| US10501572B2 (en) | 2015-12-22 | 2019-12-10 | Carbon, Inc. | Cyclic ester dual cure resins for additive manufacturing |
| US10538031B2 (en) | 2015-12-22 | 2020-01-21 | Carbon, Inc. | Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products |
| US10343331B2 (en) | 2015-12-22 | 2019-07-09 | Carbon, Inc. | Wash liquids for use in additive manufacturing with dual cure resins |
| US10350823B2 (en) | 2015-12-22 | 2019-07-16 | Carbon, Inc. | Dual precursor resin systems for additive manufacturing with dual cure resins |
| JP6944935B2 (ja) | 2015-12-22 | 2021-10-06 | カーボン，インコーポレイテッド | 二重硬化樹脂を用いた積層造形による複数の中間体からの複合生産物の製作 |
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| KR101970724B1 (ko) | 2016-06-14 | 2019-04-22 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 감광성 수지막 및 이를 이용한 컬러필터 |
| CN106084616B (zh) * | 2016-06-17 | 2019-03-22 | 湖南华曙高科技有限责任公司 | 一种用于3d打印的光固化树脂材料 |
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| CN107459871B (zh) | 2016-07-11 | 2018-05-25 | 珠海赛纳打印科技股份有限公司 | 3d喷墨打印用光固化透明墨水及其制备方法 |
| WO2018081053A1 (en) | 2016-10-27 | 2018-05-03 | Bridgestone Americas Tire Operations, Llc | Processes for producing cured polymeric products by additive manufacturing |
| CN106541129B (zh) * | 2016-11-08 | 2019-05-14 | 西安铂力特增材技术股份有限公司 | 一种颗粒增强金属基复合材料的制备方法 |
| WO2018094131A1 (en) * | 2016-11-21 | 2018-05-24 | Carbon, Inc. | Method of making three-dimensional object by delivering reactive component for subsequent cure |
| WO2018119026A1 (en) | 2016-12-23 | 2018-06-28 | 3M Innovative Properties Company | Printable compositions including polymeric and polymerizable components, articles, and methods of making articles therefrom |
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| CN213006569U (zh) | 2017-06-21 | 2021-04-20 | 卡本有限公司 | 用于增材制造的系统和对分配用于增材制造的树脂有用的分配系统 |
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| CN110128662B (zh) * | 2019-03-01 | 2021-09-21 | 湖北大学 | 一种水溶性硫醇封端的peg官能化poss交联剂及其制备方法和应用 |
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| JP3536791B2 (ja) * | 2000-03-30 | 2004-06-14 | 三菱化学株式会社 | プラスチック積層体 |
| KR100795740B1 (ko) * | 2000-03-30 | 2008-01-17 | 미쓰비시 가가꾸 가부시키가이샤 | 광경화성 조성물, 경화체 및 상기물의 제조 방법 |
| JP2002080615A (ja) * | 2000-06-30 | 2002-03-19 | Mitsubishi Chemicals Corp | 寸法変化の小さいプラスチック基板 |
| GB0103752D0 (en) * | 2001-02-15 | 2001-04-04 | Vantico Ltd | Three-Dimensional printing |
| GB0103754D0 (en) * | 2001-02-15 | 2001-04-04 | Vantico Ltd | Three-dimensional structured printing |
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| US6939489B2 (en) * | 2001-03-23 | 2005-09-06 | Ivoclar Vivadent Ag | Desktop process for producing dental products by means of 3-dimensional plotting |
| DE20106887U1 (de) * | 2001-04-20 | 2001-09-06 | Envision Technologies GmbH, 45768 Marl | Vorrichtung zum Herstellen eines dreidimensionalen Objekts |
| DE10119817A1 (de) | 2001-04-23 | 2002-10-24 | Envision Technologies Gmbh | Vorrichtung und Verfahren für die zerstörungsfreie Trennung ausgehärteter Materialschichten von einer planen Bauebene |
| GB0127252D0 (en) * | 2001-11-13 | 2002-01-02 | Vantico Ag | Production of composite articles composed of thin layers |
| JP4000885B2 (ja) * | 2002-04-01 | 2007-10-31 | 三菱化学株式会社 | 重合性組成物及び硬化体 |
| US20030198824A1 (en) * | 2002-04-19 | 2003-10-23 | Fong John W. | Photocurable compositions containing reactive polysiloxane particles |
| GB0212062D0 (en) * | 2002-05-24 | 2002-07-03 | Vantico Ag | Jetable compositions |
| US20040077745A1 (en) * | 2002-10-18 | 2004-04-22 | Jigeng Xu | Curable compositions and rapid prototyping process using the same |
| US7189781B2 (en) * | 2003-03-13 | 2007-03-13 | H.B. Fuller Licensing & Finance Inc. | Moisture curable, radiation curable sealant composition |
| EP1477511A1 (en) * | 2003-05-15 | 2004-11-17 | DSM IP Assets B.V. | Radiation curable thiol-ene composition |
| DE10344412A1 (de) * | 2003-09-25 | 2005-05-19 | Röhm GmbH & Co. KG | Polymernetzwerke |
-
2005
- 2005-03-21 CN CN200580009111A patent/CN100581792C/zh active Active
- 2005-03-21 WO PCT/EP2005/051287 patent/WO2005092598A1/en not_active Application Discontinuation
- 2005-03-21 JP JP2007504410A patent/JP4776616B2/ja active Active
- 2005-03-21 CA CA002557226A patent/CA2557226A1/en not_active Abandoned
- 2005-03-21 TW TW094108631A patent/TWI406086B/zh active
- 2005-03-21 ES ES05729543T patent/ES2374823T3/es active Active
- 2005-03-21 US US10/593,746 patent/US8097399B2/en active Active
- 2005-03-21 KR KR1020067019508A patent/KR20070005638A/ko not_active Application Discontinuation
- 2005-03-21 AT AT05729543T patent/ATE527099T1/de active
- 2005-03-21 PL PL05729543T patent/PL1727663T3/pl unknown
- 2005-03-21 KR KR1020137002148A patent/KR101474174B1/ko active IP Right Grant
- 2005-03-21 EP EP05729543A patent/EP1727663B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| ES2374823T3 (es) | 2012-02-22 |
| EP1727663B1 (en) | 2011-10-05 |
| KR101474174B1 (ko) | 2014-12-17 |
| ATE527099T1 (de) | 2011-10-15 |
| CN1933961A (zh) | 2007-03-21 |
| TWI406086B (zh) | 2013-08-21 |
| KR20130026535A (ko) | 2013-03-13 |
| JP2007530724A (ja) | 2007-11-01 |
| US8097399B2 (en) | 2012-01-17 |
| TW200609669A (en) | 2006-03-16 |
| EP1727663A1 (en) | 2006-12-06 |
| JP4776616B2 (ja) | 2011-09-21 |
| CA2557226A1 (en) | 2005-10-06 |
| CN100581792C (zh) | 2010-01-20 |
| US20070205528A1 (en) | 2007-09-06 |
| WO2005092598A1 (en) | 2005-10-06 |
| KR20070005638A (ko) | 2007-01-10 |
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