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DE69026992D1 - Prozess zur gegenseitigen Konnektion von Elektrodenanschlüssen - Google Patents

Prozess zur gegenseitigen Konnektion von Elektrodenanschlüssen

Info

Publication number
DE69026992D1
DE69026992D1 DE69026992T DE69026992T DE69026992D1 DE 69026992 D1 DE69026992 D1 DE 69026992D1 DE 69026992 T DE69026992 T DE 69026992T DE 69026992 T DE69026992 T DE 69026992T DE 69026992 D1 DE69026992 D1 DE 69026992D1
Authority
DE
Germany
Prior art keywords
electrode terminals
circuit substrate
electroconductive particles
electroconductive
charged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69026992T
Other languages
English (en)
Other versions
DE69026992T2 (de
Inventor
Hiroshi Takabayashi
Masanori Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1210584A external-priority patent/JPH06103702B2/ja
Priority claimed from JP1216140A external-priority patent/JPH0382048A/ja
Priority claimed from JP1324983A external-priority patent/JPH03185894A/ja
Priority claimed from JP2195332A external-priority patent/JP2704033B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69026992D1 publication Critical patent/DE69026992D1/de
Application granted granted Critical
Publication of DE69026992T2 publication Critical patent/DE69026992T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Wire Bonding (AREA)
  • Photovoltaic Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
DE69026992T 1989-08-17 1990-08-16 Prozess zur gegenseitigen Konnektion von Elektrodenanschlüssen Expired - Fee Related DE69026992T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1210584A JPH06103702B2 (ja) 1989-08-17 1989-08-17 電極端子の相互接続方法及び電気接続構造体の製造方法
JP1216140A JPH0382048A (ja) 1989-08-24 1989-08-24 半導体素子の接続方法
JP1324983A JPH03185894A (ja) 1989-12-15 1989-12-15 電極端子の相互接続方法
JP2195332A JP2704033B2 (ja) 1990-07-23 1990-07-23 電極端子の相互接続方法

Publications (2)

Publication Number Publication Date
DE69026992D1 true DE69026992D1 (de) 1996-06-20
DE69026992T2 DE69026992T2 (de) 1996-10-24

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DE69026992T Expired - Fee Related DE69026992T2 (de) 1989-08-17 1990-08-16 Prozess zur gegenseitigen Konnektion von Elektrodenanschlüssen

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US (1) US5352318A (de)
EP (1) EP0413335B1 (de)
KR (1) KR940008554B1 (de)
AT (1) ATE138225T1 (de)
DE (1) DE69026992T2 (de)

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CN1123067C (zh) * 1995-05-22 2003-10-01 日立化成工业株式会社 具有与布线基板电连接的半导体芯片的半导体器件
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JP3711873B2 (ja) 2001-02-19 2005-11-02 ソニーケミカル株式会社 バンプレスｉｃチップの製造方法
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Also Published As

Publication number Publication date
EP0413335A3 (en) 1991-10-30
KR910005466A (ko) 1991-03-30
DE69026992T2 (de) 1996-10-24
US5352318A (en) 1994-10-04
EP0413335B1 (de) 1996-05-15
KR940008554B1 (ko) 1994-09-24
ATE138225T1 (de) 1996-06-15
EP0413335A2 (de) 1991-02-20

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