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DE60318204D1 - Verfahren zur herstellung eines monolithischen silizium-beschleunigungsaufnehmers - Google Patents

Verfahren zur herstellung eines monolithischen silizium-beschleunigungsaufnehmers

Info

Publication number
DE60318204D1
DE60318204D1 DE60318204T DE60318204T DE60318204D1 DE 60318204 D1 DE60318204 D1 DE 60318204D1 DE 60318204 T DE60318204 T DE 60318204T DE 60318204 T DE60318204 T DE 60318204T DE 60318204 D1 DE60318204 D1 DE 60318204D1
Authority
DE
Germany
Prior art keywords
support structure
monolithic silicon
beam members
producing
inertial mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60318204T
Other languages
English (en)
Other versions
DE60318204T2 (de
Inventor
Geoffrey L Mahon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Electronics Oy
Original Assignee
VTI Technologies Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VTI Technologies Oy filed Critical VTI Technologies Oy
Application granted granted Critical
Publication of DE60318204D1 publication Critical patent/DE60318204D1/de
Publication of DE60318204T2 publication Critical patent/DE60318204T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Silicon Compounds (AREA)
DE60318204T 2002-06-17 2003-06-13 Verfahren zur herstellung eines monolithischen silizium-beschleunigungsaufnehmers Expired - Lifetime DE60318204T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US171994 2002-06-17
US10/171,994 US6862795B2 (en) 2002-06-17 2002-06-17 Method of manufacturing of a monolithic silicon acceleration sensor
PCT/EP2003/006238 WO2003107014A2 (en) 2002-06-17 2003-06-13 Method of manufacturing of a monolithic silicon acceleration sensor

Publications (2)

Publication Number Publication Date
DE60318204D1 true DE60318204D1 (de) 2008-01-31
DE60318204T2 DE60318204T2 (de) 2008-12-04

Family

ID=29732907

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60318204T Expired - Lifetime DE60318204T2 (de) 2002-06-17 2003-06-13 Verfahren zur herstellung eines monolithischen silizium-beschleunigungsaufnehmers

Country Status (7)

Country Link
US (1) US6862795B2 (de)
EP (1) EP1514122B1 (de)
JP (1) JP4562524B2 (de)
AT (1) ATE381714T1 (de)
AU (1) AU2003246424A1 (de)
DE (1) DE60318204T2 (de)
WO (1) WO2003107014A2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI119159B (fi) * 2003-02-11 2008-08-15 Vti Technologies Oy Kapasitiivinen kiihtyvyysanturirakenne
DE112005002196B4 (de) * 2004-09-27 2023-12-21 Conti Temic Microelectronic Gmbh Drehratensensor
EP1691203B1 (de) * 2005-02-15 2012-07-25 EM Microelectronic-Marin SA Elektronische Schaltung mit rauscharmem Messkondensator sowie mit einer solchen Schaltung ausgerüsteter Beschleunigungsaufnehmer
JPWO2007020701A1 (ja) * 2005-08-18 2009-02-19 株式会社シーアンドエヌ 加速度センサ装置
KR100798981B1 (ko) * 2006-09-06 2008-01-28 후지쯔 가부시끼가이샤 가변 커패시터 및 그 제조 방법
US7779689B2 (en) * 2007-02-21 2010-08-24 Freescale Semiconductor, Inc. Multiple axis transducer with multiple sensing range capability
DE102008043796B4 (de) * 2008-11-17 2023-12-21 Robert Bosch Gmbh Drehratensensor
US8266962B2 (en) 2009-01-28 2012-09-18 Infineon Technologies Ag Acceleration sensor
JPWO2013089079A1 (ja) * 2011-12-12 2015-04-27 株式会社村田製作所 加速度センサ
CN102539830B (zh) * 2012-01-29 2015-05-13 迈尔森电子（天津）有限公司 多轴传感器及其制作方法、差分的传感器系统
JPWO2014126019A1 (ja) * 2013-02-13 2017-02-02 株式会社村田製作所 加速度センサ
JP5930127B2 (ja) * 2013-06-04 2016-06-08 株式会社村田製作所 加速度センサ
WO2018096454A1 (en) * 2016-11-22 2018-05-31 King Abdullah University Of Science And Technology Out-of-plane deformable semiconductor substrate, method of making an out-of-plane deformable semiconductor substrate, and an in-plane and out-of-plane deformable semiconductor substrate
CN112415226B (zh) * 2020-12-12 2023-03-14 山东利恩斯智能科技有限公司 一种耐高温对地绝缘型加速度传感器
CN114578094B (zh) * 2022-02-28 2024-04-02 湖南天羿领航科技有限公司 一种高过载扭摆式硅微加速度计及其制备方法
CN115327162B (zh) * 2022-08-03 2024-08-27 欧梯恩智能科技(苏州)有限公司 一种法布里珀罗加速度传感器结构及其制备方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4574327A (en) 1984-05-18 1986-03-04 Becton, Dickinson And Company Capacitive transducer
JPS6376483A (ja) * 1986-09-19 1988-04-06 Fujitsu Ltd 半導体加速度センサの製造方法
DE3741036A1 (de) 1987-12-03 1989-06-15 Fraunhofer Ges Forschung Mikromechanischer beschleunigungsmesser
JP3104226B2 (ja) * 1988-06-28 2000-10-30 株式会社明電舎 端板電極の製造法
DE3824695A1 (de) * 1988-07-20 1990-02-01 Fraunhofer Ges Forschung Mikromechanischer beschleunigungssensor mit kapazitiver signalwandlung und verfahren zu seiner herstellung
JPH0623782B2 (ja) * 1988-11-15 1994-03-30 株式会社日立製作所 静電容量式加速度センサ及び半導体圧力センサ
US5008774A (en) 1989-02-28 1991-04-16 United Technologies Corporation Capacitive accelerometer with mid-plane proof mass
US4930043A (en) 1989-02-28 1990-05-29 United Technologies Closed-loop capacitive accelerometer with spring constraint
FR2681472B1 (fr) 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
DE9320965U1 (de) 1992-05-15 1995-07-06 Hitachi, Ltd., Tokio/Tokyo Halbleiter-Beschleunigungsmesser
JP3151956B2 (ja) * 1992-09-04 2001-04-03 株式会社村田製作所 加速度センサ
JPH06151885A (ja) * 1992-11-02 1994-05-31 Fujikura Ltd 半導体加速度センサの製造方法
JP3328707B2 (ja) * 1993-07-19 2002-09-30 オムロン株式会社 静電容量型半導体加速度センサ及び半導体圧力センサ
US5503285A (en) * 1993-07-26 1996-04-02 Litton Systems, Inc. Method for forming an electrostatically force balanced silicon accelerometer
JPH07183543A (ja) * 1993-12-22 1995-07-21 Hitachi Ltd 加速度センサ
JPH07191055A (ja) * 1993-12-27 1995-07-28 Hitachi Ltd 静電容量式加速度センサ
JPH08107219A (ja) * 1994-10-04 1996-04-23 Seiko Instr Inc 半導体加速度センサ及び半導体加速度センサの製造方法
JP2713241B2 (ja) * 1995-05-25 1998-02-16 日本電気株式会社 加速度センサおよびその製造方法
JP2773698B2 (ja) * 1995-08-30 1998-07-09 日本電気株式会社 静電容量型加速度センサおよびその製造方法
DE19649715C2 (de) 1996-11-30 2001-07-12 Telefunken Microelectron Anordnung zur Messung von Beschleunigungen
JP3380908B2 (ja) * 1997-02-05 2003-02-24 日本航空電子工業株式会社 シリコン加速度センサの製法
JPH1131825A (ja) * 1997-07-10 1999-02-02 Denso Corp 半導体力学量センサの製造方法
JP4176849B2 (ja) * 1997-05-08 2008-11-05 株式会社ワコー センサの製造方法
DE19748666C2 (de) 1997-11-04 2002-08-29 Fraunhofer Ges Forschung Verdrahtungsverfahren für mikroelektronische Systeme zur Verhinderung von Produktpiraterie und Produktmanipulation, durch das Verfahren hergestelltes mikroelektronisches System und Verwendung des mikroelektronischen Systems in einer Chipkarte
JP2000275272A (ja) * 1999-03-23 2000-10-06 Mitsubishi Electric Corp 半導体加速度センサ及びその製造方法
DE10055081A1 (de) 2000-11-07 2002-05-16 Bosch Gmbh Robert Mikrostrukturbauelement
FI119078B (fi) * 2002-02-12 2008-07-15 Nokia Corp Kiihtyvyysanturi

Also Published As

Publication number Publication date
EP1514122B1 (de) 2007-12-19
WO2003107014A2 (en) 2003-12-24
JP2005530159A (ja) 2005-10-06
US6862795B2 (en) 2005-03-08
US20030229981A1 (en) 2003-12-18
DE60318204T2 (de) 2008-12-04
ATE381714T1 (de) 2008-01-15
WO2003107014A3 (en) 2004-07-01
AU2003246424A1 (en) 2003-12-31
JP4562524B2 (ja) 2010-10-13
AU2003246424A8 (en) 2003-12-31
EP1514122A2 (de) 2005-03-16

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