[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

DE602007014288D1 - Wärmeableitunseinrichtung und LED Beleuchtungs- und/oder Signalvorrichtung mit einer solchen Einrichtung - Google Patents

Wärmeableitunseinrichtung und LED Beleuchtungs- und/oder Signalvorrichtung mit einer solchen Einrichtung

Info

Publication number
DE602007014288D1
DE602007014288D1 DE602007014288T DE602007014288T DE602007014288D1 DE 602007014288 D1 DE602007014288 D1 DE 602007014288D1 DE 602007014288 T DE602007014288 T DE 602007014288T DE 602007014288 T DE602007014288 T DE 602007014288T DE 602007014288 D1 DE602007014288 D1 DE 602007014288D1
Authority
DE
Germany
Prior art keywords
heatsink
led
wärmeableitunseinrichtung
led lighting
exchange portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007014288T
Other languages
English (en)
Inventor
Jean-Claude Gasquet
Alcina Tanghe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Vision SAS
Original Assignee
Valeo Vision SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Vision SAS filed Critical Valeo Vision SAS
Publication of DE602007014288D1 publication Critical patent/DE602007014288D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/47Passive cooling, e.g. using fins, thermal conductive elements or openings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14Light emitting diodes [LED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/50Light sources with three-dimensionally disposed light-generating elements on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0382Continuously deformed conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09054Raised area or protrusion of metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Led Devices (AREA)
DE602007014288T 2006-05-22 2007-05-15 Wärmeableitunseinrichtung und LED Beleuchtungs- und/oder Signalvorrichtung mit einer solchen Einrichtung Active DE602007014288D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0604575A FR2901347B1 (fr) 2006-05-22 2006-05-22 Composant de dissipation thermique et dispositif d'eclairage et/ou de signalisation a diode equipe d'un tel composant

Publications (1)

Publication Number Publication Date
DE602007014288D1 true DE602007014288D1 (de) 2011-06-16

Family

ID=36759036

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007014288T Active DE602007014288D1 (de) 2006-05-22 2007-05-15 Wärmeableitunseinrichtung und LED Beleuchtungs- und/oder Signalvorrichtung mit einer solchen Einrichtung

Country Status (7)

Country Link
US (1) US7780315B2 (de)
EP (1) EP1860707B1 (de)
JP (1) JP2007318139A (de)
CN (1) CN101105286A (de)
AT (1) ATE508481T1 (de)
DE (1) DE602007014288D1 (de)
FR (1) FR2901347B1 (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8425085B2 (en) * 2006-04-16 2013-04-23 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
US7806574B2 (en) * 2006-04-16 2010-10-05 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
FR2914984B1 (fr) * 2007-04-13 2013-11-08 Valeo Vision Support electronique flexible equipe, supportant au moins une diode electroluminescente, et procede de fabrication associe.
CN101162816B (zh) * 2007-09-13 2010-09-01 番禺得意精密电子工业有限公司 电连接装置
CN101400210B (zh) * 2007-09-27 2010-06-02 北京京东方光电科技有限公司 设有发光二极管的印刷电路板
EP2235437A1 (de) * 2007-12-07 2010-10-06 Osram Gesellschaft mit beschränkter Haftung Kühlkörper und beleuchtungsvorrichtung mit einem kühlkörper
KR101142580B1 (ko) 2007-12-07 2012-05-08 오스람 아게 히트싱크와 히트싱크를 포함하는 조명장치
DE102008016458A1 (de) * 2008-03-31 2009-10-01 Osram Gesellschaft mit beschränkter Haftung Leiterplatte
US20100027281A1 (en) * 2008-07-31 2010-02-04 Waters Stanley E LED Anti-Collision Light for Commercial Aircraft
US9076951B2 (en) 2008-08-26 2015-07-07 Albeo Technologies, Inc. Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
US8981629B2 (en) 2008-08-26 2015-03-17 Albeo Technologies, Inc. Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
US8058659B2 (en) 2008-08-26 2011-11-15 Albeo Technologies, Inc. LED chip-based lighting products and methods of building
CN101739898A (zh) * 2008-11-05 2010-06-16 富士迈半导体精密工业(上海)有限公司 显示看板
US20100226139A1 (en) 2008-12-05 2010-09-09 Permlight Products, Inc. Led-based light engine
US8337030B2 (en) 2009-05-13 2012-12-25 Cree, Inc. Solid state lighting devices having remote luminescent material-containing element, and lighting methods
JP5442317B2 (ja) * 2009-05-14 2014-03-12 株式会社小糸製作所 車両用灯具
US20100321893A1 (en) * 2009-06-20 2010-12-23 Peter Scott Andrews Heat Dissipation Packaging for Electrical Components
US20110249406A1 (en) * 2009-06-20 2011-10-13 LEDAdventures LLC Heat dissipation system for electrical components
KR100963083B1 (ko) * 2009-08-27 2010-06-10 윤인숙 엘이디 형광등
KR20110039080A (ko) * 2009-10-09 2011-04-15 알티반도체 주식회사 백라이트 유닛 및 그 제조 방법
TW201123410A (en) * 2009-12-25 2011-07-01 Bright Led Electronics Corp LED light-emitting module and its manufacturing method thereof.
JP5381729B2 (ja) * 2010-01-12 2014-01-08 セイコーエプソン株式会社 電気光学装置
US20110267821A1 (en) * 2010-02-12 2011-11-03 Cree, Inc. Lighting device with heat dissipation elements
CN105282892A (zh) * 2010-05-04 2016-01-27 吉可多公司 具有用于发送关联信息的通信端口的led照明装置
US8391009B2 (en) * 2010-06-18 2013-03-05 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipating assembly
DE102011076765A1 (de) * 2011-05-31 2012-12-06 Osram Ag Beleuchtungseinrichtung
KR101847042B1 (ko) 2011-08-11 2018-04-09 엘지이노텍 주식회사 조명 장치
KR101911762B1 (ko) * 2011-08-09 2018-10-26 엘지이노텍 주식회사 조명 장치
TWI435026B (zh) * 2011-11-07 2014-04-21 訊凱國際股份有限公司 發光裝置及其燈具之製作方法
US10591124B2 (en) 2012-08-30 2020-03-17 Sabic Global Technologies B.V. Heat dissipating system for a light, headlamp assembly comprising the same, and method of dissipating heat
US8926133B2 (en) 2012-09-13 2015-01-06 Lumastream, Inc. System, method, and apparatus for dissipating heat from a LED
CN102997098A (zh) * 2012-11-27 2013-03-27 南通贝思特科技咨询有限公司 球面或四侧发光的led灯
KR102024291B1 (ko) 2012-12-18 2019-09-23 엘지이노텍 주식회사 램프 유닛 및 그를 이용한 차량 램프 장치
AT514403B1 (de) * 2013-05-29 2015-06-15 Zizala Lichtsysteme Gmbh Beleuchtungsvorrichtung für einen Fahrzeugscheinwerfer sowie Fahrzeugscheinwerfer
DE102014103379A1 (de) * 2014-03-13 2015-09-17 Hella Kgaa Hueck & Co. Lichtmodul mit einer verbesserten Positionierung einer optischen Einheit zu einem Leuchtmittel
FR3022976B1 (fr) * 2014-06-30 2018-08-31 Valeo Vision Module d'eclairage pour projecteur automobile avec positionnement entre reflecteur et source lumineuse
FR3022975B1 (fr) * 2014-06-30 2020-06-19 Valeo Vision Module d'eclairage pour projecteur automobile avec positionnement entre plieuse et radiateur
JP2017536670A (ja) 2014-11-20 2017-12-07 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. 個別に指定可能なledモジュールを有するled装置
KR102423383B1 (ko) 2014-12-29 2022-07-22 엘지이노텍 주식회사 조명 장치
FR3046656B1 (fr) * 2016-01-11 2019-11-29 Valeo Iluminacion Module lumineux pour vehicule automobile comprenant deux types de sources lumineuses
DE102016101999A1 (de) * 2016-02-04 2017-08-10 Automotive Lighting Reutlingen Gmbh Lichtmodul für eine Kraftfahrzeugbeleuchtungseinrichtung
JP6695165B2 (ja) * 2016-02-23 2020-05-20 株式会社小糸製作所 車両用灯具ユニット
CZ2016524A3 (cs) 2016-08-30 2018-03-07 Varroc Lighting Systems, s.r.o. Chladič, zejména pro signalizační nebo osvětlovací zařízení motorových vozidel, a způsob jeho výroby
CN113316698B (zh) 2019-01-23 2023-07-07 海拉有限双合股份公司 用于车辆的具有定位器件的照明装置
US10697625B1 (en) * 2019-10-27 2020-06-30 Richard Redpath Illumination apparatus having thermally isolated heat sinks and dual light sources
FR3113629B1 (fr) * 2020-09-01 2022-08-26 Valeo Vision Module d'éclairage pour un véhicule automobile
CN114415449B (zh) * 2022-01-24 2024-05-24 深圳颂威科技有限公司 灯板和聚光灯
FR3137439B1 (fr) * 2022-06-30 2024-10-18 Valeo Vision Dispositif de signalisation de véhicule automobile
CA3184321C (en) * 2022-12-16 2024-01-23 Sws Warning Lights Inc. Light system using flexible printed circuit boards

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357536A (en) * 1993-05-07 1994-10-18 Xerox Corporation Method and apparatus for the positioning of laser diodes
JP3347279B2 (ja) * 1997-12-19 2002-11-20 三菱電機株式会社 半導体装置およびその製造方法
US6208517B1 (en) * 1999-09-10 2001-03-27 Legerity, Inc. Heat sink
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
ITMI20012579A1 (it) * 2001-12-06 2003-06-06 Fraen Corp Srl Modulo illuminante ad elevata dissipazione di calore
JP2003198071A (ja) * 2001-12-21 2003-07-11 Sanritsu Shoji Kk 放熱板付きプリント配線板およびその製造方法
US7170151B2 (en) * 2003-01-16 2007-01-30 Philips Lumileds Lighting Company, Llc Accurate alignment of an LED assembly
FR2853200B1 (fr) * 2003-03-27 2005-10-07 Valeo Vision Procede de fixation d'une diode electroluminescente de puissance sur un radiateur, et dispositif de signalisation comportant une telle diode.
JP4102240B2 (ja) * 2003-04-08 2008-06-18 株式会社小糸製作所 車両用前照灯
US7495322B2 (en) * 2003-05-26 2009-02-24 Panasonic Electric Works Co., Ltd. Light-emitting device
US20060180821A1 (en) * 2003-06-30 2006-08-17 Koninklijke Philips Electronics N.V. Light-emitting diode thermal management system
EP1663705B1 (de) * 2003-09-08 2011-08-24 odelo GmbH Vorrichtung und verfahren zur montage und einstellung von led-scheinwerfern
US7198387B1 (en) * 2003-12-18 2007-04-03 B/E Aerospace, Inc. Light fixture for an LED-based aircraft lighting system
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
JP4433875B2 (ja) * 2004-05-14 2010-03-17 オムロン株式会社 発熱部品の放熱構造と、この放熱構造における放熱部材の製造方法
JP2006127963A (ja) * 2004-10-29 2006-05-18 Hitachi Ltd 配光制御デバイス
DE102005002812B4 (de) * 2005-01-20 2013-07-18 Infineon Technologies Ag Kühlkörper für oberflächenmontierte Halbleiterbauteile und Montageverfahren
TWI256454B (en) * 2005-06-03 2006-06-11 Au Optronics Corp Light module
US7404655B2 (en) * 2006-05-10 2008-07-29 Gentex Corporation Vehicle rearview assembly including a map light

Also Published As

Publication number Publication date
CN101105286A (zh) 2008-01-16
JP2007318139A (ja) 2007-12-06
FR2901347A1 (fr) 2007-11-23
ATE508481T1 (de) 2011-05-15
EP1860707A1 (de) 2007-11-28
US20070268703A1 (en) 2007-11-22
FR2901347B1 (fr) 2008-07-18
EP1860707B1 (de) 2011-05-04
US7780315B2 (en) 2010-08-24

Similar Documents

Publication Publication Date Title
DE602007014288D1 (de) Wärmeableitunseinrichtung und LED Beleuchtungs- und/oder Signalvorrichtung mit einer solchen Einrichtung
MY165672A (en) Lightweight heat sinks and led lamps employing same
US9429302B2 (en) Lighting system with thermal management system having point contact synthetic jets
US7236366B2 (en) High brightness LED apparatus with an integrated heat sink
ATE364904T1 (de) Leuchtdiode-beleuchtungsvorrichtung mit wärmeabfuhrsystem
TW200509337A (en) Semiconductor assembled heat sink structure for embedding electronic components
ATE381248T1 (de) Flexible zwischenschaltungsstrukturen für elektrische geräte und lichtquellen mit derartigen strukturen
US20100128484A1 (en) Led heat dissipation structure
DE602005024315D1 (de) Hochleistungs-led-beleuchtungseinrichtung mit hohem thermischen diffusionsvermögen
EP2787798A3 (de) Beleuchtungsvorrichtung
JP2010010659A (ja) 基板及び照明器具
ATE508328T1 (de) Beleuchtungseinheit
ATE467236T1 (de) Beleuchtungsvorrichtung
ATE517434T1 (de) Elektronische vorrichtung mit einer bodenplatte
ATE533011T1 (de) Wärmesenke und beleuchtungseinrichtung mit einer wärmesenke
TW200620710A (en) Light-emitting device with improved heatsinking
KR20100101489A (ko) 냉각장치
US8182107B2 (en) LED luminaire made with recycled materials
JP2010055939A (ja) 光源ユニット及び照明装置
TW200626828A (en) Illumination device with at least one luminous diode and headlight of a vehicle
KR101082405B1 (ko) 발광다이오드 조명장치 및 그 제조방법
JP7083267B2 (ja) 光源ユニット、灯具、及び照明装置
JP5701768B2 (ja) ヒートシンクと熱伝導性ガラス製カバーを備えたled光源アセンブリ
TWM491783U (zh) Led燈具之電子元件固定結構
CN201652267U (zh) 散热模块和热源的紧结构造