CN1779568B - 固化性树脂组合物、其固化物以及印刷电路板 - Google Patents
固化性树脂组合物、其固化物以及印刷电路板 Download PDFInfo
- Publication number
- CN1779568B CN1779568B CN2004100954406A CN200410095440A CN1779568B CN 1779568 B CN1779568 B CN 1779568B CN 2004100954406 A CN2004100954406 A CN 2004100954406A CN 200410095440 A CN200410095440 A CN 200410095440A CN 1779568 B CN1779568 B CN 1779568B
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- CN
- China
- Prior art keywords
- compound
- methyl
- resin composition
- acrylate
- hardening resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP398088/2003 | 2003-11-27 | ||
JP2003398088 | 2003-11-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1779568A CN1779568A (zh) | 2006-05-31 |
CN1779568B true CN1779568B (zh) | 2010-10-06 |
Family
ID=36769928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004100954406A Active CN1779568B (zh) | 2003-11-27 | 2004-11-26 | 固化性树脂组合物、其固化物以及印刷电路板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4865044B2 (zh) |
KR (1) | KR101048940B1 (zh) |
CN (1) | CN1779568B (zh) |
TW (1) | TW200519535A (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4849860B2 (ja) * | 2005-10-04 | 2012-01-11 | 太陽ホールディングス株式会社 | 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 |
KR100781873B1 (ko) * | 2006-01-02 | 2007-12-05 | 주식회사 엘지화학 | 광활성 옥심 에스테르계 화합물 및 이를 포함하는 감광성조성물 |
JP4864545B2 (ja) * | 2006-05-26 | 2012-02-01 | 太陽ホールディングス株式会社 | フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板及びフレキシブル基板の製造方法 |
KR100904348B1 (ko) * | 2006-10-24 | 2009-06-23 | 다이요 잉키 세이조 가부시키가이샤 | 광 경화성 열 경화성 수지 조성물 및 이것을 사용한 인쇄배선판 |
JP5079310B2 (ja) * | 2006-11-15 | 2012-11-21 | 太陽ホールディングス株式会社 | ソルダーレジスト露光用フォトツール及びそれを用いて露光処理されるソルダーレジストパターンの形成方法 |
TW200844660A (en) * | 2006-11-15 | 2008-11-16 | Taiyo Ink Mfg Co Ltd | Alkali development type paste composition, method for conductive pattern and black matrix pattern formation using the same, and the conductive pattern and the black matrix pattern |
KR100996046B1 (ko) * | 2007-03-29 | 2010-11-22 | 도쿄 오카 고교 가부시키가이샤 | 착색 감광성 수지 조성물, 블랙 매트릭스, 컬러 필터, 및액정 표시 디스플레이 |
KR101277020B1 (ko) * | 2010-09-30 | 2013-06-24 | 다이요 홀딩스 가부시키가이샤 | 감광성 도전 페이스트 |
JP5744528B2 (ja) * | 2011-01-11 | 2015-07-08 | 東京応化工業株式会社 | タッチパネル用着色感光性樹脂組成物、タッチパネル、及び表示装置 |
JP2012163735A (ja) * | 2011-02-07 | 2012-08-30 | Toyo Ink Sc Holdings Co Ltd | 感光性樹脂組成物、それを用いた保護膜およびタッチパネル用絶縁膜 |
KR101692003B1 (ko) * | 2013-12-24 | 2017-01-03 | 코오롱인더스트리 주식회사 | 드라이 필름 포토 레지스트용 감광성 수지 조성물 |
TW201940615A (zh) * | 2014-12-26 | 2019-10-16 | 日商太陽油墨製造股份有限公司 | 硬化性樹脂組成物、乾膜、硬化物以及印刷配線板 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1241562A (zh) * | 1998-06-26 | 2000-01-19 | 西巴特殊化学品控股有限公司 | 新的o-酰基肟光引发剂 |
CN1299812A (zh) * | 1999-12-15 | 2001-06-20 | 西巴特殊化学品控股有限公司 | 肟酯光引发剂 |
CN1305124A (zh) * | 1999-12-15 | 2001-07-25 | 西巴特殊化学品控股有限公司 | 光敏树脂组合物 |
CN1307693A (zh) * | 1998-06-26 | 2001-08-08 | 西巴特殊化学品控股有限公司 | 可光聚合热固性树脂组合物 |
CN1514845A (zh) * | 2001-06-11 | 2004-07-21 | �������⻯ѧƷ�ع�����˾ | 具有复合结构的肟酯光引发剂 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4033428B2 (ja) * | 1999-03-31 | 2008-01-16 | 日本化薬株式会社 | 新規不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物 |
JP2001302871A (ja) * | 2000-04-25 | 2001-10-31 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物とこれを用いて形成したソルダーレジスト皮膜や樹脂絶縁層を有するプリント配線板 |
-
2004
- 2004-11-22 TW TW093135867A patent/TW200519535A/zh unknown
- 2004-11-26 KR KR1020040098063A patent/KR101048940B1/ko active IP Right Grant
- 2004-11-26 CN CN2004100954406A patent/CN1779568B/zh active Active
-
2010
- 2010-02-15 JP JP2010029943A patent/JP4865044B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1241562A (zh) * | 1998-06-26 | 2000-01-19 | 西巴特殊化学品控股有限公司 | 新的o-酰基肟光引发剂 |
CN1307693A (zh) * | 1998-06-26 | 2001-08-08 | 西巴特殊化学品控股有限公司 | 可光聚合热固性树脂组合物 |
CN1299812A (zh) * | 1999-12-15 | 2001-06-20 | 西巴特殊化学品控股有限公司 | 肟酯光引发剂 |
CN1305124A (zh) * | 1999-12-15 | 2001-07-25 | 西巴特殊化学品控股有限公司 | 光敏树脂组合物 |
CN1514845A (zh) * | 2001-06-11 | 2004-07-21 | �������⻯ѧƷ�ع�����˾ | 具有复合结构的肟酯光引发剂 |
Non-Patent Citations (3)
Title |
---|
CN 1514845 A,说明书实施例35,36. |
JP特开2001-302871A 2001.10.31 |
JP特开2002-107926A 2002.04.10 |
Also Published As
Publication number | Publication date |
---|---|
CN1779568A (zh) | 2006-05-31 |
TW200519535A (en) | 2005-06-16 |
KR101048940B1 (ko) | 2011-07-12 |
KR20050051574A (ko) | 2005-06-01 |
JP4865044B2 (ja) | 2012-02-01 |
JP2010160495A (ja) | 2010-07-22 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: TAIYO HOLDING CO., LTD. Free format text: FORMER NAME: TAIYO INK MANUFACTURING CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Taiyo Holding Co., Ltd. Address before: Tokyo, Japan Patentee before: Taiyo Ink Manufacturing Co., Ltd. |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20060531 Assignee: Taiyo Ink Mfg.Co., Ltd. Assignor: Taiyo Holding Co., Ltd. Contract record no.: 2011990000116 Denomination of invention: Hardenable resin composition, hardened body thereof, and printed wiring board Granted publication date: 20101006 License type: Common License Record date: 20110302 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model |