CN1779568A - 固化性树脂组合物、其固化物以及印刷电路板 - Google Patents
固化性树脂组合物、其固化物以及印刷电路板 Download PDFInfo
- Publication number
- CN1779568A CN1779568A CNA2004100954406A CN200410095440A CN1779568A CN 1779568 A CN1779568 A CN 1779568A CN A2004100954406 A CNA2004100954406 A CN A2004100954406A CN 200410095440 A CN200410095440 A CN 200410095440A CN 1779568 A CN1779568 A CN 1779568A
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- China
- Prior art keywords
- compound
- methyl
- resin composition
- acrylate
- hardening resin
- Prior art date
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
Abstract
Description
实施例 | 比较例 | ||||||||
1 | 2 | 1 | 2 | 3 | 4 | 5 | 6 | 7 | |
固化性树脂A | 195 | - | 195 | 195 | 195 | 195 | 195 | 195 | - |
固化性树脂B | - | 154 | - | - | - | - | - | - | 154 |
光聚合引发剂A | 5.3 | 5.3 | 5.3 | 5.3 | 5.3 | 5.3 | 5.3 | - | 5.3 |
光聚合引发剂B | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
增感剂A | - | - | - | 0.5 | - | - | - | - | - |
增感剂B | - | - | - | - | 0.5 | - | - | - | - |
增感剂C | - | - | - | - | 0.5 | - | - | - | |
增感剂D | - | - | - | - | 0.5 | - | - | ||
增感剂E | 0.5 | 0.5 | - | - | - | - | - | 0.5 | - |
环氧树脂A | 23 | 23 | 23 | 23 | 23 | 23 | 23 | 23 | 23 |
环氧树脂B | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
环氧树脂C | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
聚合性单体A | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
聚合性单体B | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 |
热固化催化剂A | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
热固化催化剂B | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 |
颜料A | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
颜料B | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
添加剂A | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
填充剂A | 150 | 150 | 150 | 150 | 150 | 150 | 150 | 150 | 150 |
通过光谱感光度计测得的表面光泽 | 良好 | 良好 | 不良 | 不良 | 不良 | 不良 | 不良 | 不良 | 不良 |
图案形成性 | 良好 | 良好 | 不良 | 不良 | 不良 | 不良 | 不良 | 不良 | 不良 |
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP398088/2003 | 2003-11-27 | ||
JP2003398088 | 2003-11-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1779568A true CN1779568A (zh) | 2006-05-31 |
CN1779568B CN1779568B (zh) | 2010-10-06 |
Family
ID=36769928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004100954406A Active CN1779568B (zh) | 2003-11-27 | 2004-11-26 | 固化性树脂组合物、其固化物以及印刷电路板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4865044B2 (zh) |
KR (1) | KR101048940B1 (zh) |
CN (1) | CN1779568B (zh) |
TW (1) | TW200519535A (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101183212B (zh) * | 2006-11-15 | 2010-12-08 | 太阳油墨制造株式会社 | 光工具以及阻焊图案的形成方法 |
CN102445846A (zh) * | 2010-09-30 | 2012-05-09 | 太阳控股株式会社 | 感光性导电糊剂 |
CN101183219B (zh) * | 2006-11-15 | 2012-07-04 | 太阳控股株式会社 | 碱显影型的糊剂组合物 |
CN102591148A (zh) * | 2011-01-11 | 2012-07-18 | 东京应化工业株式会社 | 用于触控面板的着色感光性树脂组合物以及触控面板和显示装置 |
CN105739241A (zh) * | 2014-12-26 | 2016-07-06 | 太阳油墨制造株式会社 | 固化性树脂组合物、干膜、固化物和印刷电路板 |
TWI581061B (zh) * | 2013-12-24 | 2017-05-01 | 可隆股份有限公司 | 乾膜光阻用光敏樹脂組成物 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4849860B2 (ja) * | 2005-10-04 | 2012-01-11 | 太陽ホールディングス株式会社 | 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 |
KR100781873B1 (ko) * | 2006-01-02 | 2007-12-05 | 주식회사 엘지화학 | 광활성 옥심 에스테르계 화합물 및 이를 포함하는 감광성조성물 |
JP4864545B2 (ja) * | 2006-05-26 | 2012-02-01 | 太陽ホールディングス株式会社 | フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板及びフレキシブル基板の製造方法 |
KR100904348B1 (ko) * | 2006-10-24 | 2009-06-23 | 다이요 잉키 세이조 가부시키가이샤 | 광 경화성 열 경화성 수지 조성물 및 이것을 사용한 인쇄배선판 |
KR100996046B1 (ko) * | 2007-03-29 | 2010-11-22 | 도쿄 오카 고교 가부시키가이샤 | 착색 감광성 수지 조성물, 블랙 매트릭스, 컬러 필터, 및액정 표시 디스플레이 |
JP2012163735A (ja) * | 2011-02-07 | 2012-08-30 | Toyo Ink Sc Holdings Co Ltd | 感光性樹脂組成物、それを用いた保護膜およびタッチパネル用絶縁膜 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG77689A1 (en) * | 1998-06-26 | 2001-01-16 | Ciba Sc Holding Ag | New o-acyloxime photoinitiators |
MY121423A (en) * | 1998-06-26 | 2006-01-28 | Ciba Sc Holding Ag | Photopolymerizable thermosetting resin compositions |
JP4033428B2 (ja) * | 1999-03-31 | 2008-01-16 | 日本化薬株式会社 | 新規不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物 |
NL1016815C2 (nl) * | 1999-12-15 | 2002-05-14 | Ciba Sc Holding Ag | Oximester-fotoinitiatoren. |
SG97168A1 (en) * | 1999-12-15 | 2003-07-18 | Ciba Sc Holding Ag | Photosensitive resin composition |
JP2001302871A (ja) * | 2000-04-25 | 2001-10-31 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物とこれを用いて形成したソルダーレジスト皮膜や樹脂絶縁層を有するプリント配線板 |
WO2002100903A1 (en) * | 2001-06-11 | 2002-12-19 | Ciba Specialty Chemicals Holding Inc. | Oxime ester photoinitiators having a combined structure |
-
2004
- 2004-11-22 TW TW093135867A patent/TW200519535A/zh unknown
- 2004-11-26 KR KR1020040098063A patent/KR101048940B1/ko active IP Right Grant
- 2004-11-26 CN CN2004100954406A patent/CN1779568B/zh active Active
-
2010
- 2010-02-15 JP JP2010029943A patent/JP4865044B2/ja active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101183212B (zh) * | 2006-11-15 | 2010-12-08 | 太阳油墨制造株式会社 | 光工具以及阻焊图案的形成方法 |
CN101183219B (zh) * | 2006-11-15 | 2012-07-04 | 太阳控股株式会社 | 碱显影型的糊剂组合物 |
CN102445846A (zh) * | 2010-09-30 | 2012-05-09 | 太阳控股株式会社 | 感光性导电糊剂 |
CN102445846B (zh) * | 2010-09-30 | 2014-03-26 | 太阳控股株式会社 | 感光性导电糊剂 |
CN102591148A (zh) * | 2011-01-11 | 2012-07-18 | 东京应化工业株式会社 | 用于触控面板的着色感光性树脂组合物以及触控面板和显示装置 |
CN102591148B (zh) * | 2011-01-11 | 2016-12-14 | 东京应化工业株式会社 | 用于触控面板的着色感光性树脂组合物以及触控面板和显示装置 |
TWI581061B (zh) * | 2013-12-24 | 2017-05-01 | 可隆股份有限公司 | 乾膜光阻用光敏樹脂組成物 |
CN105739241A (zh) * | 2014-12-26 | 2016-07-06 | 太阳油墨制造株式会社 | 固化性树脂组合物、干膜、固化物和印刷电路板 |
Also Published As
Publication number | Publication date |
---|---|
JP2010160495A (ja) | 2010-07-22 |
KR20050051574A (ko) | 2005-06-01 |
KR101048940B1 (ko) | 2011-07-12 |
JP4865044B2 (ja) | 2012-02-01 |
TW200519535A (en) | 2005-06-16 |
CN1779568B (zh) | 2010-10-06 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: TAIYO HOLDING CO., LTD. Free format text: FORMER NAME: TAIYO INK MANUFACTURING CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Taiyo Holding Co., Ltd. Address before: Tokyo, Japan Patentee before: Taiyo Ink Manufacturing Co., Ltd. |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20060531 Assignee: Taiyo Ink Mfg.Co., Ltd. Assignor: Taiyo Holding Co., Ltd. Contract record no.: 2011990000116 Denomination of invention: Hardenable resin composition, hardened body thereof, and printed wiring board Granted publication date: 20101006 License type: Common License Record date: 20110302 |
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