CN1288052C - 片状基板的移动装载装置及其收存装置 - Google Patents
片状基板的移动装载装置及其收存装置 Download PDFInfo
- Publication number
- CN1288052C CN1288052C CNB02123387XA CN02123387A CN1288052C CN 1288052 C CN1288052 C CN 1288052C CN B02123387X A CNB02123387X A CN B02123387XA CN 02123387 A CN02123387 A CN 02123387A CN 1288052 C CN1288052 C CN 1288052C
- Authority
- CN
- China
- Prior art keywords
- support portion
- aforementioned
- manipulator
- plate shape
- shape substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G61/00—Use of pick-up or transfer devices or of manipulators for stacking or de-stacking articles not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
- Y10S414/138—Wafers positioned vertically within cassette
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001192674 | 2001-06-26 | ||
JP192674/2001 | 2001-06-26 | ||
JP380891/2001 | 2001-12-14 | ||
JP2001380891 | 2001-12-14 | ||
JP157122/2002 | 2002-05-30 | ||
JP2002157122A JP4328496B2 (ja) | 2001-06-26 | 2002-05-30 | 枚葉基板の移載装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1393385A CN1393385A (zh) | 2003-01-29 |
CN1288052C true CN1288052C (zh) | 2006-12-06 |
Family
ID=27347021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB02123387XA Expired - Fee Related CN1288052C (zh) | 2001-06-26 | 2002-06-25 | 片状基板的移动装载装置及其收存装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7547175B2 (zh) |
JP (1) | JP4328496B2 (zh) |
KR (1) | KR20030001327A (zh) |
CN (1) | CN1288052C (zh) |
TW (1) | TW579360B (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4328496B2 (ja) * | 2001-06-26 | 2009-09-09 | 株式会社日立プラントテクノロジー | 枚葉基板の移載装置 |
JP3929364B2 (ja) * | 2002-06-26 | 2007-06-13 | エスペック株式会社 | 基板支持及び出し入れ装置 |
WO2004061940A1 (fr) * | 2003-01-03 | 2004-07-22 | Quanta Display Inc. | Cassette pour substrats |
JP4023543B2 (ja) * | 2003-05-29 | 2007-12-19 | 東京エレクトロン株式会社 | 基板搬送装置および基板搬送方法ならびに真空処理装置 |
AU2003242481A1 (en) * | 2003-06-19 | 2005-01-04 | Rorze Corporation | Thin plate-supporting body |
KR20050036037A (ko) * | 2003-10-14 | 2005-04-20 | 삼성전자주식회사 | 기판의 운반 장치 |
KR20050038134A (ko) * | 2003-10-21 | 2005-04-27 | 삼성전자주식회사 | 기판 스토킹 시스템 |
KR100596184B1 (ko) * | 2004-12-29 | 2006-07-06 | 한국단자공업 주식회사 | 기판용 트레이 |
JP4680657B2 (ja) * | 2005-04-08 | 2011-05-11 | 株式会社アルバック | 基板搬送システム |
KR100779118B1 (ko) * | 2005-12-09 | 2007-11-27 | 주식회사 테라세미콘 | 평판표시장치 제조시스템 |
EP1829613B1 (de) | 2006-03-02 | 2022-03-30 | Nexus Biosystems, Inc. | Aufbewahrungseinheit und Transfersystem zum Aufbewahren und Bereitstellen von Biologischen proben |
KR101354122B1 (ko) * | 2006-08-09 | 2014-01-27 | 엘아이지에이디피 주식회사 | 기판 반송장치 및 그 반송방법 |
TWI398335B (zh) * | 2006-11-27 | 2013-06-11 | Nidec Sankyo Corp | Workpiece conveying system |
JP4553957B2 (ja) * | 2008-06-18 | 2010-09-29 | 三菱電機株式会社 | 原子炉炉内核計測装置の通路選択装置 |
JP5317618B2 (ja) * | 2008-10-06 | 2013-10-16 | 株式会社日立ハイテクノロジーズ | 表示パネルモジュール組立装置及び基板搬送装置 |
CN102050330B (zh) * | 2010-11-05 | 2013-02-06 | 深圳市华星光电技术有限公司 | 机械手臂及具有该机械手臂的搬运装置 |
CN202072285U (zh) * | 2011-05-24 | 2011-12-14 | 深圳市华星光电技术有限公司 | 面板传送装置及其面板支撑机构 |
CN102435307B (zh) * | 2011-11-09 | 2013-09-18 | 深圳市华星光电技术有限公司 | Tft-lcd制程中多层uv烘烤炉的uv照度的检测方法及用于实施该方法的取片组合装置 |
CN102642714B (zh) * | 2012-04-27 | 2015-02-18 | 深圳市华星光电技术有限公司 | 基板移运装置 |
CN102774652A (zh) * | 2012-07-31 | 2012-11-14 | 深圳市华星光电技术有限公司 | 一种液晶面板搬运装置及其支撑臂结构 |
US9033645B2 (en) * | 2012-07-31 | 2015-05-19 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Liquid crystal panel transportation device and support arm structure with rotatable ancillary arm sections |
CN104340535B (zh) * | 2014-09-12 | 2017-01-11 | 深圳市华星光电技术有限公司 | 一种多用型显示屏支撑装置 |
TWI725115B (zh) * | 2016-01-29 | 2021-04-21 | 日商達誼恆股份有限公司 | 基板移載用機器手 |
CN108811498A (zh) * | 2017-02-27 | 2018-11-13 | 法国圣戈班玻璃厂 | 包括活动支撑元件的支架 |
CN206998968U (zh) * | 2017-08-02 | 2018-02-13 | 京东方科技集团股份有限公司 | 机器人手臂及搬运机器人 |
KR101904671B1 (ko) * | 2017-09-29 | 2018-10-04 | 캐논 톡키 가부시키가이샤 | 기판지지구조체와, 이를 포함하는 진공 증착 장치 및 증착 방법 |
CN110589447B (zh) * | 2019-09-24 | 2021-09-03 | 苏州精濑光电有限公司 | 一种显示面板输送线衔接机构 |
CN113071900B (zh) * | 2020-01-03 | 2022-08-26 | 显示器生产服务株式会社 | 基板传送装置 |
JP7260210B1 (ja) * | 2022-02-15 | 2023-04-18 | 中島田精機株式会社 | 取出機構、箱、移動機構及び搬送機構並びに取出方法及び搬送方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5044752A (en) * | 1989-06-30 | 1991-09-03 | General Signal Corporation | Apparatus and process for positioning wafers in receiving devices |
FR2656599B1 (fr) * | 1989-12-29 | 1992-03-27 | Commissariat Energie Atomique | Dispositif de rangement d'objets plats dans une cassette avec rayonnages intermediaires. |
US5116182A (en) * | 1990-10-17 | 1992-05-26 | Lin Bao N | Automatic car parking system |
JPH09107013A (ja) * | 1995-10-09 | 1997-04-22 | Dainippon Screen Mfg Co Ltd | 基板受け渡し装置 |
JP3659724B2 (ja) | 1996-02-05 | 2005-06-15 | 三菱電機株式会社 | 基板搬送装置および基板搬送方法 |
KR19980044612U (ko) * | 1996-12-27 | 1998-09-25 | 양재신 | 자동차용 컵 홀더 |
TW401582B (en) * | 1997-05-15 | 2000-08-11 | Tokyo Electorn Limtied | Apparatus for and method of transferring substrates |
KR19990017355A (ko) * | 1997-08-22 | 1999-03-15 | 윤종용 | 반도체 웨이퍼 이송용 진공척 |
KR19990024866A (ko) * | 1997-09-09 | 1999-04-06 | 김광교 | 반도체 제조용 베이크 유니트의 웨이퍼 이송장치 |
US6203617B1 (en) * | 1998-03-26 | 2001-03-20 | Tokyo Electron Limited | Conveying unit and substrate processing unit |
US6213704B1 (en) * | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Method and apparatus for substrate transfer and processing |
JP2001093969A (ja) | 1999-09-24 | 2001-04-06 | Advanced Display Inc | 基板トレイおよび基板収納方法 |
KR20020027974A (ko) * | 2000-10-06 | 2002-04-15 | 윤종용 | 적재판을 갖는 화학적 기상 증착 장치용 보트 |
JP4328496B2 (ja) * | 2001-06-26 | 2009-09-09 | 株式会社日立プラントテクノロジー | 枚葉基板の移載装置 |
-
2002
- 2002-05-30 JP JP2002157122A patent/JP4328496B2/ja not_active Expired - Fee Related
- 2002-06-24 TW TW091113786A patent/TW579360B/zh not_active IP Right Cessation
- 2002-06-24 KR KR1020020035367A patent/KR20030001327A/ko not_active Application Discontinuation
- 2002-06-25 CN CNB02123387XA patent/CN1288052C/zh not_active Expired - Fee Related
- 2002-06-26 US US10/179,855 patent/US7547175B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20030001327A (ko) | 2003-01-06 |
CN1393385A (zh) | 2003-01-29 |
JP2003243482A (ja) | 2003-08-29 |
US20020197139A1 (en) | 2002-12-26 |
JP4328496B2 (ja) | 2009-09-09 |
TW579360B (en) | 2004-03-11 |
US7547175B2 (en) | 2009-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI,LTD. Free format text: FORMER OWNER: HITACHI PLANT TECHNOLOGIES LTD. Effective date: 20140305 |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140305 Address after: Tokyo, Japan Patentee after: Hitachi Ltd. Patentee after: Sharp Corporation Address before: Hyogo Patentee before: Hitachi Plant Technologies Ltd. Patentee before: Sharp Corporation |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061206 Termination date: 20150625 |
|
EXPY | Termination of patent right or utility model |